KR20240036456A - 네거티브형 감광성 수지 조성물 및 드라이 필름 레지스트 - Google Patents

네거티브형 감광성 수지 조성물 및 드라이 필름 레지스트 Download PDF

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Publication number
KR20240036456A
KR20240036456A KR1020230106736A KR20230106736A KR20240036456A KR 20240036456 A KR20240036456 A KR 20240036456A KR 1020230106736 A KR1020230106736 A KR 1020230106736A KR 20230106736 A KR20230106736 A KR 20230106736A KR 20240036456 A KR20240036456 A KR 20240036456A
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KR
South Korea
Prior art keywords
film
resin composition
negative photosensitive
photosensitive resin
resist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020230106736A
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English (en)
Korean (ko)
Inventor
히로히토 나가타
다케시 이베
Original Assignee
디아이씨 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 디아이씨 가부시끼가이샤 filed Critical 디아이씨 가부시끼가이샤
Publication of KR20240036456A publication Critical patent/KR20240036456A/ko
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
KR1020230106736A 2022-09-12 2023-08-16 네거티브형 감광성 수지 조성물 및 드라이 필름 레지스트 Pending KR20240036456A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2022-144622 2022-09-12
JP2022144622A JP7729294B2 (ja) 2022-09-12 2022-09-12 ネガ型感光性樹脂組成物及びドライフィルムレジスト

Publications (1)

Publication Number Publication Date
KR20240036456A true KR20240036456A (ko) 2024-03-20

Family

ID=90132718

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020230106736A Pending KR20240036456A (ko) 2022-09-12 2023-08-16 네거티브형 감광성 수지 조성물 및 드라이 필름 레지스트

Country Status (4)

Country Link
JP (1) JP7729294B2 (https=)
KR (1) KR20240036456A (https=)
CN (1) CN117687269A (https=)
TW (1) TW202419496A (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018151489A (ja) 2017-03-10 2018-09-27 東京応化工業株式会社 感光性組成物、ドライフィルム、及びパターン化された硬化膜を形成する方法
JP2019128438A (ja) 2018-01-24 2019-08-01 信越化学工業株式会社 ネガ型レジストフィルム積層体及びパターン形成方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3391896B2 (ja) * 1994-06-15 2003-03-31 東京応化工業株式会社 耐熱性感光性樹脂組成物
EP1035438A3 (en) 1999-03-12 2000-09-20 Shipley Company LLC Phenolic resins and photoresist compositions comprising same
JP5011989B2 (ja) 2006-12-04 2012-08-29 宇部興産株式会社 フォトレジスト用ノボラック型フェノール樹脂およびその製造方法
JP6155842B2 (ja) 2013-05-22 2017-07-05 Dic株式会社 ノボラック型フェノール樹脂の製造方法及びフォトレジスト組成物。
CN114502659A (zh) 2019-10-29 2022-05-13 东丽株式会社 树脂组合物、树脂片材、固化膜、固化膜的制造方法、半导体装置、有机el显示装置及显示装置
CN116261688A (zh) 2020-09-29 2023-06-13 东丽株式会社 感光性树脂组合物、固化物及显示装置、以及固化物的制造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018151489A (ja) 2017-03-10 2018-09-27 東京応化工業株式会社 感光性組成物、ドライフィルム、及びパターン化された硬化膜を形成する方法
JP2019128438A (ja) 2018-01-24 2019-08-01 信越化学工業株式会社 ネガ型レジストフィルム積層体及びパターン形成方法

Also Published As

Publication number Publication date
JP7729294B2 (ja) 2025-08-26
CN117687269A (zh) 2024-03-12
JP2024039899A (ja) 2024-03-25
TW202419496A (zh) 2024-05-16

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