CN117687269A - 负型感光性树脂组合物和干膜抗蚀剂 - Google Patents

负型感光性树脂组合物和干膜抗蚀剂 Download PDF

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Publication number
CN117687269A
CN117687269A CN202311167780.4A CN202311167780A CN117687269A CN 117687269 A CN117687269 A CN 117687269A CN 202311167780 A CN202311167780 A CN 202311167780A CN 117687269 A CN117687269 A CN 117687269A
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CN
China
Prior art keywords
resin composition
negative photosensitive
photosensitive resin
resist
structural unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202311167780.4A
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English (en)
Chinese (zh)
Inventor
长田裕仁
伊部武史
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DIC Corp
Original Assignee
DIC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DIC Corp filed Critical DIC Corp
Publication of CN117687269A publication Critical patent/CN117687269A/zh
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
CN202311167780.4A 2022-09-12 2023-09-12 负型感光性树脂组合物和干膜抗蚀剂 Pending CN117687269A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022144622A JP7729294B2 (ja) 2022-09-12 2022-09-12 ネガ型感光性樹脂組成物及びドライフィルムレジスト
JP2022-144622 2022-09-12

Publications (1)

Publication Number Publication Date
CN117687269A true CN117687269A (zh) 2024-03-12

Family

ID=90132718

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202311167780.4A Pending CN117687269A (zh) 2022-09-12 2023-09-12 负型感光性树脂组合物和干膜抗蚀剂

Country Status (4)

Country Link
JP (1) JP7729294B2 (https=)
KR (1) KR20240036456A (https=)
CN (1) CN117687269A (https=)
TW (1) TW202419496A (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3391896B2 (ja) * 1994-06-15 2003-03-31 東京応化工業株式会社 耐熱性感光性樹脂組成物
EP1035438A3 (en) 1999-03-12 2000-09-20 Shipley Company LLC Phenolic resins and photoresist compositions comprising same
JP5011989B2 (ja) 2006-12-04 2012-08-29 宇部興産株式会社 フォトレジスト用ノボラック型フェノール樹脂およびその製造方法
JP6155842B2 (ja) 2013-05-22 2017-07-05 Dic株式会社 ノボラック型フェノール樹脂の製造方法及びフォトレジスト組成物。
JP6813398B2 (ja) 2017-03-10 2021-01-13 東京応化工業株式会社 感光性組成物、ドライフィルム、及びパターン化された硬化膜を形成する方法
JP6791176B2 (ja) 2018-01-24 2020-11-25 信越化学工業株式会社 ネガ型レジストフィルム積層体及びパターン形成方法
CN114502659A (zh) 2019-10-29 2022-05-13 东丽株式会社 树脂组合物、树脂片材、固化膜、固化膜的制造方法、半导体装置、有机el显示装置及显示装置
CN116261688A (zh) 2020-09-29 2023-06-13 东丽株式会社 感光性树脂组合物、固化物及显示装置、以及固化物的制造方法

Also Published As

Publication number Publication date
JP7729294B2 (ja) 2025-08-26
JP2024039899A (ja) 2024-03-25
KR20240036456A (ko) 2024-03-20
TW202419496A (zh) 2024-05-16

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