TW202419496A - 負型感光性樹脂組成物及乾膜光阻 - Google Patents

負型感光性樹脂組成物及乾膜光阻 Download PDF

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Publication number
TW202419496A
TW202419496A TW112134462A TW112134462A TW202419496A TW 202419496 A TW202419496 A TW 202419496A TW 112134462 A TW112134462 A TW 112134462A TW 112134462 A TW112134462 A TW 112134462A TW 202419496 A TW202419496 A TW 202419496A
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TW
Taiwan
Prior art keywords
film
resin composition
negative photosensitive
photosensitive resin
derived
Prior art date
Application number
TW112134462A
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English (en)
Chinese (zh)
Inventor
長田裕仁
伊部武史
Original Assignee
日商Ｄｉｃ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商Ｄｉｃ股份有限公司 filed Critical 日商Ｄｉｃ股份有限公司
Publication of TW202419496A publication Critical patent/TW202419496A/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
TW112134462A 2022-09-12 2023-09-11 負型感光性樹脂組成物及乾膜光阻 TW202419496A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022144622A JP7729294B2 (ja) 2022-09-12 2022-09-12 ネガ型感光性樹脂組成物及びドライフィルムレジスト
JP2022-144622 2022-09-12

Publications (1)

Publication Number Publication Date
TW202419496A true TW202419496A (zh) 2024-05-16

Family

ID=90132718

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112134462A TW202419496A (zh) 2022-09-12 2023-09-11 負型感光性樹脂組成物及乾膜光阻

Country Status (4)

Country Link
JP (1) JP7729294B2 (https=)
KR (1) KR20240036456A (https=)
CN (1) CN117687269A (https=)
TW (1) TW202419496A (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3391896B2 (ja) * 1994-06-15 2003-03-31 東京応化工業株式会社 耐熱性感光性樹脂組成物
EP1035438A3 (en) 1999-03-12 2000-09-20 Shipley Company LLC Phenolic resins and photoresist compositions comprising same
JP5011989B2 (ja) 2006-12-04 2012-08-29 宇部興産株式会社 フォトレジスト用ノボラック型フェノール樹脂およびその製造方法
JP6155842B2 (ja) 2013-05-22 2017-07-05 Dic株式会社 ノボラック型フェノール樹脂の製造方法及びフォトレジスト組成物。
JP6813398B2 (ja) 2017-03-10 2021-01-13 東京応化工業株式会社 感光性組成物、ドライフィルム、及びパターン化された硬化膜を形成する方法
JP6791176B2 (ja) 2018-01-24 2020-11-25 信越化学工業株式会社 ネガ型レジストフィルム積層体及びパターン形成方法
CN114502659A (zh) 2019-10-29 2022-05-13 东丽株式会社 树脂组合物、树脂片材、固化膜、固化膜的制造方法、半导体装置、有机el显示装置及显示装置
CN116261688A (zh) 2020-09-29 2023-06-13 东丽株式会社 感光性树脂组合物、固化物及显示装置、以及固化物的制造方法

Also Published As

Publication number Publication date
JP7729294B2 (ja) 2025-08-26
CN117687269A (zh) 2024-03-12
JP2024039899A (ja) 2024-03-25
KR20240036456A (ko) 2024-03-20

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