JP7672574B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

Info

Publication number
JP7672574B2
JP7672574B2 JP2024507337A JP2024507337A JP7672574B2 JP 7672574 B2 JP7672574 B2 JP 7672574B2 JP 2024507337 A JP2024507337 A JP 2024507337A JP 2024507337 A JP2024507337 A JP 2024507337A JP 7672574 B2 JP7672574 B2 JP 7672574B2
Authority
JP
Japan
Prior art keywords
pattern
wire
semiconductor device
insulating substrate
outer periphery
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024507337A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023175823A1 (https=
JPWO2023175823A5 (https=
Inventor
和丈 門脇
裕基 塩田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of JPWO2023175823A1 publication Critical patent/JPWO2023175823A1/ja
Publication of JPWO2023175823A5 publication Critical patent/JPWO2023175823A5/ja
Application granted granted Critical
Publication of JP7672574B2 publication Critical patent/JP7672574B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/60—Arrangements for protection of devices protecting against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings

Landscapes

  • Wire Bonding (AREA)
JP2024507337A 2022-03-17 2022-03-17 半導体装置 Active JP7672574B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/012189 WO2023175823A1 (ja) 2022-03-17 2022-03-17 半導体装置

Publications (3)

Publication Number Publication Date
JPWO2023175823A1 JPWO2023175823A1 (https=) 2023-09-21
JPWO2023175823A5 JPWO2023175823A5 (https=) 2024-05-13
JP7672574B2 true JP7672574B2 (ja) 2025-05-07

Family

ID=88022551

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024507337A Active JP7672574B2 (ja) 2022-03-17 2022-03-17 半導体装置

Country Status (3)

Country Link
JP (1) JP7672574B2 (https=)
DE (1) DE112022006855T5 (https=)
WO (1) WO2023175823A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011529638A (ja) 2008-07-31 2011-12-08 スカイワークス ソリューションズ，インコーポレイテッド 一体化された干渉シールドを備えた半導体パッケージおよびその製造方法
US8199518B1 (en) 2010-02-18 2012-06-12 Amkor Technology, Inc. Top feature package and method
CN106033755A (zh) 2015-03-17 2016-10-19 晟碟信息科技（上海）有限公司 具有电磁干扰屏蔽的半导体器件和基板带
CN210575941U (zh) 2019-09-16 2020-05-19 柳州梓博科技有限公司 一种芯片及电子设备
WO2021002132A1 (ja) 2019-07-03 2021-01-07 富士電機株式会社 半導体モジュールの回路構造
JP7212077B2 (ja) 2018-07-02 2023-01-24 ホガナス アクチボラグ （パブル） ニッケルを含有する耐摩耗性鉄系合金組成物

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07212077A (ja) * 1994-01-24 1995-08-11 Sanyo Electric Co Ltd 混成集積回路装置
JP2003086763A (ja) 2001-09-12 2003-03-20 Toshiba Corp 半導体パワーモジュール及び電力変換器
JP4682889B2 (ja) * 2006-03-23 2011-05-11 三菱マテリアル株式会社 パワーモジュール用基板およびパワーモジュール並びにパワーモジュール用基板の製造方法
JP5125241B2 (ja) * 2007-06-12 2013-01-23 三菱マテリアル株式会社 パワーモジュール用基板の製造方法
JP5071719B2 (ja) * 2008-02-18 2012-11-14 三菱電機株式会社 電力用半導体装置
JP2010010441A (ja) * 2008-06-27 2010-01-14 Murata Mfg Co Ltd 回路モジュールの製造方法および回路モジュール
JP2016063015A (ja) * 2014-09-17 2016-04-25 株式会社東芝 半導体装置
US9761537B2 (en) * 2014-09-30 2017-09-12 Skyworks Solutions, Inc. Shielded radio-frequency module having reduced area
EP3440698A4 (en) * 2016-04-01 2020-02-12 INTEL Corporation SEMICONDUCTOR HOUSING WITH STRUCTURES FOR SHIELDING ELECTROMAGNETIC INTERFERENCES

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011529638A (ja) 2008-07-31 2011-12-08 スカイワークス ソリューションズ，インコーポレイテッド 一体化された干渉シールドを備えた半導体パッケージおよびその製造方法
US8199518B1 (en) 2010-02-18 2012-06-12 Amkor Technology, Inc. Top feature package and method
CN106033755A (zh) 2015-03-17 2016-10-19 晟碟信息科技（上海）有限公司 具有电磁干扰屏蔽的半导体器件和基板带
JP7212077B2 (ja) 2018-07-02 2023-01-24 ホガナス アクチボラグ （パブル） ニッケルを含有する耐摩耗性鉄系合金組成物
WO2021002132A1 (ja) 2019-07-03 2021-01-07 富士電機株式会社 半導体モジュールの回路構造
CN210575941U (zh) 2019-09-16 2020-05-19 柳州梓博科技有限公司 一种芯片及电子设备

Also Published As

Publication number Publication date
JPWO2023175823A1 (https=) 2023-09-21
DE112022006855T5 (de) 2025-02-13
WO2023175823A1 (ja) 2023-09-21

Similar Documents

Publication Publication Date Title
US9171773B2 (en) Semiconductor device
US10104775B2 (en) Semiconductor device and method for manufacturing the same
JP5656907B2 (ja) パワーモジュール
US6734551B2 (en) Semiconductor device
JP5067267B2 (ja) 樹脂封止型半導体装置とその製造方法
US8258622B2 (en) Power device package and semiconductor package mold for fabricating the same
JP4455488B2 (ja) 半導体装置
JP6233507B2 (ja) パワー半導体モジュールおよび複合モジュール
KR101221805B1 (ko) 전력 소자용 패키지 및 패키지 어셈블리
JP6707328B2 (ja) パワーモジュール、パワーモジュールの放熱構造、およびパワーモジュールの接合方法
WO2017175612A1 (ja) パワーモジュール、パワー半導体装置及びパワーモジュール製造方法
JP2002076197A (ja) 半導体装置用基板及び半導体装置
JP2003289085A (ja) 樹脂モールド型デバイス及びその製造装置
KR20150060036A (ko) 전력 반도체 모듈 및 그 제조 방법
JP7158392B2 (ja) パワー半導体モジュール
JP7672574B2 (ja) 半導体装置
CN112530915A (zh) 半导体装置
JP7479310B2 (ja) 半導体モジュール
JP3703978B2 (ja) 半導体装置
JP7512659B2 (ja) 半導体モジュール及び半導体モジュールの製造方法
CN111033723B (zh) 功率半导体模块
JP7045180B2 (ja) パワー半導体装置、モジュール及び製造方法
CN222762964U (zh) 半导体封装结构及电子设备
JP7489933B2 (ja) 半導体装置及びその製造方法
US20240088064A1 (en) Semiconductor device

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240215

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240215

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20250325

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20250422

R150 Certificate of patent or registration of utility model

Ref document number: 7672574

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150