JPWO2023175823A1 - - Google Patents

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Publication number
JPWO2023175823A1
JPWO2023175823A1 JP2024507337A JP2024507337A JPWO2023175823A1 JP WO2023175823 A1 JPWO2023175823 A1 JP WO2023175823A1 JP 2024507337 A JP2024507337 A JP 2024507337A JP 2024507337 A JP2024507337 A JP 2024507337A JP WO2023175823 A1 JPWO2023175823 A1 JP WO2023175823A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024507337A
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Japanese (ja)
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JP7672574B2 (ja
JPWO2023175823A5 (https=
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Publication of JPWO2023175823A1 publication Critical patent/JPWO2023175823A1/ja
Publication of JPWO2023175823A5 publication Critical patent/JPWO2023175823A5/ja
Application granted granted Critical
Publication of JP7672574B2 publication Critical patent/JP7672574B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/60—Arrangements for protection of devices protecting against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
JP2024507337A 2022-03-17 2022-03-17 半導体装置 Active JP7672574B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/012189 WO2023175823A1 (ja) 2022-03-17 2022-03-17 半導体装置

Publications (3)

Publication Number Publication Date
JPWO2023175823A1 true JPWO2023175823A1 (https=) 2023-09-21
JPWO2023175823A5 JPWO2023175823A5 (https=) 2024-05-13
JP7672574B2 JP7672574B2 (ja) 2025-05-07

Family

ID=88022551

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024507337A Active JP7672574B2 (ja) 2022-03-17 2022-03-17 半導体装置

Country Status (3)

Country Link
JP (1) JP7672574B2 (https=)
DE (1) DE112022006855T5 (https=)
WO (1) WO2023175823A1 (https=)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07212077A (ja) * 1994-01-24 1995-08-11 Sanyo Electric Co Ltd 混成集積回路装置
JP2010010441A (ja) * 2008-06-27 2010-01-14 Murata Mfg Co Ltd 回路モジュールの製造方法および回路モジュール
JP2011529638A (ja) * 2008-07-31 2011-12-08 スカイワークス ソリューションズ，インコーポレイテッド 一体化された干渉シールドを備えた半導体パッケージおよびその製造方法
US8199518B1 (en) * 2010-02-18 2012-06-12 Amkor Technology, Inc. Top feature package and method
JP2016063015A (ja) * 2014-09-17 2016-04-25 株式会社東芝 半導体装置
CN106033755A (zh) * 2015-03-17 2016-10-19 晟碟信息科技（上海）有限公司 具有电磁干扰屏蔽的半导体器件和基板带
CN210575941U (zh) * 2019-09-16 2020-05-19 柳州梓博科技有限公司 一种芯片及电子设备
WO2021002132A1 (ja) * 2019-07-03 2021-01-07 富士電機株式会社 半導体モジュールの回路構造

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003086763A (ja) 2001-09-12 2003-03-20 Toshiba Corp 半導体パワーモジュール及び電力変換器
JP4682889B2 (ja) * 2006-03-23 2011-05-11 三菱マテリアル株式会社 パワーモジュール用基板およびパワーモジュール並びにパワーモジュール用基板の製造方法
JP5125241B2 (ja) * 2007-06-12 2013-01-23 三菱マテリアル株式会社 パワーモジュール用基板の製造方法
JP5071719B2 (ja) * 2008-02-18 2012-11-14 三菱電機株式会社 電力用半導体装置
US9761537B2 (en) * 2014-09-30 2017-09-12 Skyworks Solutions, Inc. Shielded radio-frequency module having reduced area
EP3440698A4 (en) * 2016-04-01 2020-02-12 INTEL Corporation SEMICONDUCTOR HOUSING WITH STRUCTURES FOR SHIELDING ELECTROMAGNETIC INTERFERENCES
ES2864406T3 (es) 2018-07-02 2021-10-13 Hoeganaes Ab Publ Composiciones de alineación a base de hierro resistentes al desgaste que comprenden níquel

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07212077A (ja) * 1994-01-24 1995-08-11 Sanyo Electric Co Ltd 混成集積回路装置
JP2010010441A (ja) * 2008-06-27 2010-01-14 Murata Mfg Co Ltd 回路モジュールの製造方法および回路モジュール
JP2011529638A (ja) * 2008-07-31 2011-12-08 スカイワークス ソリューションズ，インコーポレイテッド 一体化された干渉シールドを備えた半導体パッケージおよびその製造方法
US8199518B1 (en) * 2010-02-18 2012-06-12 Amkor Technology, Inc. Top feature package and method
JP2016063015A (ja) * 2014-09-17 2016-04-25 株式会社東芝 半導体装置
CN106033755A (zh) * 2015-03-17 2016-10-19 晟碟信息科技（上海）有限公司 具有电磁干扰屏蔽的半导体器件和基板带
WO2021002132A1 (ja) * 2019-07-03 2021-01-07 富士電機株式会社 半導体モジュールの回路構造
CN210575941U (zh) * 2019-09-16 2020-05-19 柳州梓博科技有限公司 一种芯片及电子设备

Also Published As

Publication number Publication date
JP7672574B2 (ja) 2025-05-07
DE112022006855T5 (de) 2025-02-13
WO2023175823A1 (ja) 2023-09-21

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