JPWO2023188670A1 - - Google Patents
Info
- Publication number
- JPWO2023188670A1 JPWO2023188670A1 JP2023533899A JP2023533899A JPWO2023188670A1 JP WO2023188670 A1 JPWO2023188670 A1 JP WO2023188670A1 JP 2023533899 A JP2023533899 A JP 2023533899A JP 2023533899 A JP2023533899 A JP 2023533899A JP WO2023188670 A1 JPWO2023188670 A1 JP WO2023188670A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Ceramic Products (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022059773 | 2022-03-31 | ||
| JP2022059773 | 2022-03-31 | ||
| PCT/JP2023/000025 WO2023188670A1 (ja) | 2022-03-31 | 2023-01-04 | 回路基板及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023188670A1 true JPWO2023188670A1 (https=) | 2023-10-05 |
| JPWO2023188670A5 JPWO2023188670A5 (https=) | 2024-03-08 |
| JP7555493B2 JP7555493B2 (ja) | 2024-09-24 |
Family
ID=88200160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023533899A Active JP7555493B2 (ja) | 2022-03-31 | 2023-01-04 | 回路基板及びその製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7555493B2 (https=) |
| WO (1) | WO2023188670A1 (https=) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10190176A (ja) * | 1996-12-26 | 1998-07-21 | Denki Kagaku Kogyo Kk | 回路基板 |
| JP2007095955A (ja) * | 2005-09-28 | 2007-04-12 | Kyocera Corp | 回路基板およびその製造方法 |
| JP2007311527A (ja) * | 2006-05-18 | 2007-11-29 | Mitsubishi Materials Corp | パワーモジュール用基板およびパワーモジュール用基板の製造方法並びにパワーモジュール |
| JP2008311294A (ja) * | 2007-06-12 | 2008-12-25 | Mitsubishi Materials Corp | パワーモジュール用基板の製造方法 |
| JP2022000871A (ja) * | 2018-07-31 | 2022-01-04 | 京セラ株式会社 | 電気回路基板及びパワーモジュール |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019003725A1 (ja) | 2017-06-28 | 2019-01-03 | 京セラ株式会社 | パワーモジュール用基板およびパワーモジュール |
-
2023
- 2023-01-04 WO PCT/JP2023/000025 patent/WO2023188670A1/ja not_active Ceased
- 2023-01-04 JP JP2023533899A patent/JP7555493B2/ja active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10190176A (ja) * | 1996-12-26 | 1998-07-21 | Denki Kagaku Kogyo Kk | 回路基板 |
| JP2007095955A (ja) * | 2005-09-28 | 2007-04-12 | Kyocera Corp | 回路基板およびその製造方法 |
| JP2007311527A (ja) * | 2006-05-18 | 2007-11-29 | Mitsubishi Materials Corp | パワーモジュール用基板およびパワーモジュール用基板の製造方法並びにパワーモジュール |
| JP2008311294A (ja) * | 2007-06-12 | 2008-12-25 | Mitsubishi Materials Corp | パワーモジュール用基板の製造方法 |
| JP2022000871A (ja) * | 2018-07-31 | 2022-01-04 | 京セラ株式会社 | 電気回路基板及びパワーモジュール |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023188670A1 (ja) | 2023-10-05 |
| JP7555493B2 (ja) | 2024-09-24 |
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