JPWO2023188670A1 - - Google Patents

Info

Publication number
JPWO2023188670A1
JPWO2023188670A1 JP2023533899A JP2023533899A JPWO2023188670A1 JP WO2023188670 A1 JPWO2023188670 A1 JP WO2023188670A1 JP 2023533899 A JP2023533899 A JP 2023533899A JP 2023533899 A JP2023533899 A JP 2023533899A JP WO2023188670 A1 JPWO2023188670 A1 JP WO2023188670A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023533899A
Other versions
JPWO2023188670A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023188670A1 publication Critical patent/JPWO2023188670A1/ja
Publication of JPWO2023188670A5 publication Critical patent/JPWO2023188670A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Ceramic Products (AREA)
JP2023533899A 2022-03-31 2023-01-04 Pending JPWO2023188670A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022059773 2022-03-31
PCT/JP2023/000025 WO2023188670A1 (ja) 2022-03-31 2023-01-04 回路基板及びその製造方法

Publications (2)

Publication Number Publication Date
JPWO2023188670A1 true JPWO2023188670A1 (ja) 2023-10-05
JPWO2023188670A5 JPWO2023188670A5 (ja) 2024-03-08

Family

ID=88200160

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023533899A Pending JPWO2023188670A1 (ja) 2022-03-31 2023-01-04

Country Status (2)

Country Link
JP (1) JPWO2023188670A1 (ja)
WO (1) WO2023188670A1 (ja)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10190176A (ja) * 1996-12-26 1998-07-21 Denki Kagaku Kogyo Kk 回路基板
JP2007095955A (ja) * 2005-09-28 2007-04-12 Kyocera Corp 回路基板およびその製造方法
JP4904916B2 (ja) * 2006-05-18 2012-03-28 三菱マテリアル株式会社 パワーモジュール用基板およびパワーモジュール用基板の製造方法並びにパワーモジュール
JP5125241B2 (ja) * 2007-06-12 2013-01-23 三菱マテリアル株式会社 パワーモジュール用基板の製造方法
JP2022000871A (ja) * 2018-07-31 2022-01-04 京セラ株式会社 電気回路基板及びパワーモジュール

Also Published As

Publication number Publication date
WO2023188670A1 (ja) 2023-10-05

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