JPWO2023190255A1 - - Google Patents
Info
- Publication number
- JPWO2023190255A1 JPWO2023190255A1 JP2023554004A JP2023554004A JPWO2023190255A1 JP WO2023190255 A1 JPWO2023190255 A1 JP WO2023190255A1 JP 2023554004 A JP2023554004 A JP 2023554004A JP 2023554004 A JP2023554004 A JP 2023554004A JP WO2023190255 A1 JPWO2023190255 A1 JP WO2023190255A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022060145 | 2022-03-31 | ||
| PCT/JP2023/012018 WO2023190255A1 (ja) | 2022-03-31 | 2023-03-24 | 回路基板及びその製造方法、並びにパワーモジュール |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023190255A1 true JPWO2023190255A1 (https=) | 2023-10-05 |
Family
ID=88201578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023554004A Pending JPWO2023190255A1 (https=) | 2022-03-31 | 2023-03-24 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2023190255A1 (https=) |
| WO (1) | WO2023190255A1 (https=) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08255853A (ja) * | 1995-03-16 | 1996-10-01 | Ibiden Co Ltd | 電子部品搭載装置 |
| JP2005079372A (ja) * | 2003-09-01 | 2005-03-24 | Nec Electronics Corp | 樹脂封止型半導体装置とその製造方法 |
| JP2007311527A (ja) * | 2006-05-18 | 2007-11-29 | Mitsubishi Materials Corp | パワーモジュール用基板およびパワーモジュール用基板の製造方法並びにパワーモジュール |
| JP2014120639A (ja) * | 2012-12-18 | 2014-06-30 | Rohm Co Ltd | パワーモジュール半導体装置 |
| JP2017011216A (ja) * | 2015-06-25 | 2017-01-12 | 京セラ株式会社 | 回路基板および電子装置 |
| WO2019003725A1 (ja) * | 2017-06-28 | 2019-01-03 | 京セラ株式会社 | パワーモジュール用基板およびパワーモジュール |
| JP2020136648A (ja) * | 2019-02-26 | 2020-08-31 | 京セラ株式会社 | 回路基板および電子装置 |
| JP2021150455A (ja) * | 2020-03-18 | 2021-09-27 | 三菱マテリアル株式会社 | 金属部材の仮止め方法、接合体の製造方法、及び、絶縁回路基板の製造方法 |
| JP2022000871A (ja) * | 2018-07-31 | 2022-01-04 | 京セラ株式会社 | 電気回路基板及びパワーモジュール |
-
2023
- 2023-03-24 JP JP2023554004A patent/JPWO2023190255A1/ja active Pending
- 2023-03-24 WO PCT/JP2023/012018 patent/WO2023190255A1/ja not_active Ceased
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08255853A (ja) * | 1995-03-16 | 1996-10-01 | Ibiden Co Ltd | 電子部品搭載装置 |
| JP2005079372A (ja) * | 2003-09-01 | 2005-03-24 | Nec Electronics Corp | 樹脂封止型半導体装置とその製造方法 |
| JP2007311527A (ja) * | 2006-05-18 | 2007-11-29 | Mitsubishi Materials Corp | パワーモジュール用基板およびパワーモジュール用基板の製造方法並びにパワーモジュール |
| JP2014120639A (ja) * | 2012-12-18 | 2014-06-30 | Rohm Co Ltd | パワーモジュール半導体装置 |
| JP2017011216A (ja) * | 2015-06-25 | 2017-01-12 | 京セラ株式会社 | 回路基板および電子装置 |
| WO2019003725A1 (ja) * | 2017-06-28 | 2019-01-03 | 京セラ株式会社 | パワーモジュール用基板およびパワーモジュール |
| JP2022000871A (ja) * | 2018-07-31 | 2022-01-04 | 京セラ株式会社 | 電気回路基板及びパワーモジュール |
| JP2020136648A (ja) * | 2019-02-26 | 2020-08-31 | 京セラ株式会社 | 回路基板および電子装置 |
| JP2021150455A (ja) * | 2020-03-18 | 2021-09-27 | 三菱マテリアル株式会社 | 金属部材の仮止め方法、接合体の製造方法、及び、絶縁回路基板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023190255A1 (ja) | 2023-10-05 |
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