WO2023190255A1 - 回路基板及びその製造方法、並びにパワーモジュール - Google Patents

回路基板及びその製造方法、並びにパワーモジュール Download PDF

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Publication number
WO2023190255A1
WO2023190255A1 PCT/JP2023/012018 JP2023012018W WO2023190255A1 WO 2023190255 A1 WO2023190255 A1 WO 2023190255A1 JP 2023012018 W JP2023012018 W JP 2023012018W WO 2023190255 A1 WO2023190255 A1 WO 2023190255A1
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Prior art keywords
main surface
ceramic plate
circuit board
recess
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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PCT/JP2023/012018
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English (en)
French (fr)
Japanese (ja)
Inventor
知広 ▲濱▼岡
聖治 小橋
厚樹 五十嵐
晃正 湯浅
貴裕 中村
善幸 江嶋
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Denka Co Ltd
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Denka Co Ltd
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Priority to JP2023554004A priority Critical patent/JPWO2023190255A1/ja
Publication of WO2023190255A1 publication Critical patent/WO2023190255A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Definitions

  • the present disclosure relates to a circuit board, a method for manufacturing the same, and a power module.
  • a circuit board included in such a power module includes a ceramic plate and a copper plate, which are bonded via a brazing material containing an active metal.
  • a phenomenon occurs in which the brazing material seeps onto the surface of the copper plate and creeps up along the side surface of the copper plate. If such a phenomenon occurs, it is feared that it will not only impair the appearance, but also lead to deterioration in the wettability of the solder material used, for example, when bonding semiconductor elements.
  • Patent Document 1 proposes providing a rough portion with a large surface roughness on the side surface of a metal plate in order to suppress creeping up of the brazing material.
  • Patent Document 2 proposes a technique in which a rib is provided in a circuit layer so as to surround a mounting surface on which a semiconductor element is to be mounted, in order to suppress the occurrence of stains due to the creeping phenomenon.
  • Patent Document 3 proposes laminating and brazing the metal plates so that the surface on the side where burrs are formed overlaps one surface of the ceramic plate. Using such techniques, attempts have been made to solve the problem of stains caused by creeping up of the brazing filler metal.
  • An etching method is known as a method for manufacturing multi-chip circuit boards.
  • the etching method requires resist printing and etching steps to process the metal plate into a predetermined size.
  • a mounting method is used in which metal plates that have been pre-processed to a predetermined size are joined together, such a process is not necessary, and production efficiency can be improved.
  • the amount of brazing filler metal applied is increased in order to ensure the reliability of the bond between the end of the metal plate and the ceramic plate, the brazing filler metal tends to creep up.
  • a conceivable technique to suppress creeping up of the brazing material is to provide a recess along the outer edge of the main surface of the metal plate on the ceramic plate side.
  • the bonding area between the metal plate and the ceramic plate becomes small, and there is a concern that stress may be concentrated during heat cycles and cracks may occur in the ceramic plate. Therefore, the present disclosure provides a circuit board that has excellent durability against heat cycles and a method for manufacturing the same.
  • the present disclosure also provides a power module including such a circuit board.
  • a circuit board is a circuit board including a ceramic plate, a metal plate, and a brazing material layer that joins the main surface of the ceramic plate and the main surface of the metal plate, the circuit board comprising: A recess is formed in the metal plate along at least a part of the outer edge of the main surface, and when viewed in a cross section perpendicular to the edge of the recess on the side surface of the metal plate and along the thickness direction of the metal plate, the above-mentioned A circuit board in which the outer edge of the contact surface between the ceramic plate and the brazing metal layer is farther from the recess than the intersection of the imaginary perpendicular line extending from the edge toward the main surface of the ceramic plate and the main surface of the ceramic plate.
  • the metal plate has a recess formed along at least a part of the outer edge of the main surface of the metal plate, so that the brazing material creeps up the side of the metal plate and separates from the ceramic plate side of the metal plate. It is possible to sufficiently prevent the brazing filler metal from reaching the main surface on the opposite side.
  • the contact surface between the ceramic plate and the brazing material layer is located at a point where the intersection between the ceramic plate and the imaginary perpendicular line extending from the edge of the recess toward the main surface of the ceramic plate is The outer edge is further away from the recess.
  • the contact area between the brazing material layer and the ceramic plate can be increased even though a recess is formed in the metal plate.
  • Such a circuit board can alleviate stress concentration caused by heat cycles, and has excellent durability against heat cycles. Furthermore, the bonding reliability between the metal plate and the ceramic plate is excellent.
  • the distance L between the intersection of the virtual perpendicular and the main surface of the ceramic plate and the outer edge of the contact surface may be greater than 0 and 0.3 mm or less.
  • the brazing material layer may have a skirt portion that widens away from the recess as it approaches the main surface of the ceramic plate.
  • a brazing material layer having such a skirt portion can further alleviate stress concentration caused by heat cycles. Therefore, durability against heat cycles can be further improved. Further, by having such a skirt portion, creeping up of the brazing material can be further suppressed.
  • the inclined surface forming the outline of the skirt portion may extend from the edge of the recess or the side surface of the metal plate to the main surface of the ceramic plate.
  • Such a circuit board can sufficiently increase the reliability of the bond between the ceramic plate and the metal plate.
  • the wall surface of the metal plate constituting the recess includes an opposing surface that faces the main surface of the ceramic plate, and at least a portion of the opposing surface may be covered with a brazing material layer.
  • a circuit board can also sufficiently alleviate stress concentration caused by heat cycles. Therefore, it has sufficient durability against heat cycles. Further, since the wall surface of the metal plate constituting the recess has such a facing surface, creeping up of the brazing material can be sufficiently suppressed.
  • the entire recess is filled with the brazing material layer, and the imaginary perpendicular line may extend from the edge of the recess to the main surface of the ceramic plate inside the brazing material layer.
  • the wall surface constituting the recess and the ceramic plate are fixed by a brazing material layer. This makes it possible to sufficiently increase the reliability of the connection between the metal plate and the ceramic plate.
  • the recess in the metal plate may be formed all around the outer edge of the main surface of the metal plate. Thereby, it is possible to sufficiently suppress the brazing material from creeping up from the brazing material layer onto the side surface of the metal plate and the main surface on the opposite side to the ceramic plate side.
  • the width X of the recess may be 0.05 mm or more, and the height Z of the recess may be 0.05 mm or more.
  • the recess has such a size, creeping up of the brazing material can be further suppressed.
  • the circuit board includes a ceramic plate, a plurality of metal plates, and a plurality of brazing metal layers bonding the main surface of the ceramic plate and the main surface of the plurality of metal plates, and the plurality of metal plates include: It includes a metal plate in which a recess is formed, and when viewed in a cross section along the thickness direction of the metal plate, perpendicular to the edge of the recess on the side surface of the metal plate, from the edge toward the main surface of the ceramic plate. The outer edge of the contact surface between the ceramic plate and the brazing material layer is further away from the recess than the intersection between the extending imaginary perpendicular line and the main surface of the ceramic plate.
  • the brazing filler metal creeps up the side of the metal plate and is separated from the ceramic plate side of the metal plate. It is possible to sufficiently prevent the brazing filler metal from reaching the main surface on the opposite side. Further, while having such a recessed portion, the contact area between the brazing material layer and the ceramic plate can be increased.
  • Such a circuit board can alleviate stress concentration caused by heat cycles, and has excellent durability against heat cycles. Furthermore, the bonding reliability between the metal plate and the ceramic plate is excellent.
  • each of the plurality of metal plates may be provided independently for each partition area defined by a partition line on the main surface of the ceramic plate.
  • Such a circuit board may be a multi-chip circuit board. By dividing such a multi-chip circuit board, a plurality of individualized boards (divided boards) can be manufactured at once. Such a circuit board has excellent production efficiency.
  • a method for manufacturing a circuit board includes a preparation step of preparing one or more metal plates each having a recess formed along at least a part of the outer edge of one main surface; A coating and drying process in which one or more coating layers are formed by applying and drying a brazing filler metal on the main surface, and a ceramic plate and one or more metal plates are laminated with one or more coating layers in between.
  • the method includes a lamination step of producing a laminate, and a joining step of heating the laminate to obtain a joined body in which a ceramic plate and one or more metal plates are joined with one or more brazing metal layers.
  • a ceramic plate and one or more metal plates are laminated so that one main surface of the one or more metal plates faces the main surface of the ceramic plate, and a recess is formed.
  • an imaginary perpendicular line extending from the edge toward the main surface of the ceramic plate and the ceramic plate. The outer edge of the contact surface between the ceramic plate and the brazing material layer is farther from the recess than the intersection with the main surface.
  • the ceramic plate and the one or more metal plates are stacked so that the main surface of the one or more metal plates, on which the concave portion is formed, faces the metal plate. are laminated. Because the bonding process is carried out using the laminate obtained in this way, the brazing metal creeps up the side of the metal plate and reaches the main surface of the metal plate on the opposite side from the ceramic plate side. can be sufficiently suppressed.
  • the intersection between the ceramic plate and the brazing metal layer is greater than the intersection of the imaginary perpendicular line extending from the edge of the recess toward the main surface of the ceramic plate and the main surface of the ceramic plate.
  • the outer edge of the contact surface is further away from the recess. As a result, the contact area between the brazing material layer and the ceramic plate can be increased even though a metal plate in which a recessed portion is formed is used.
  • a circuit board obtained from such a bonded body can alleviate the concentration of stress caused by heat cycles, and has excellent durability against heat cycles.
  • the metal plate contains Cu
  • the brazing filler metal applied to the main surface of the ceramic plate in the coating and drying step may contain 93 parts by mass or more of Ag based on a total of 100 parts by mass of Ag and Cu.
  • Such a brazing filler metal has a higher melting temperature than a brazing filler metal containing less than 93 parts by mass of Ag. Therefore, when the temperature of the laminate is raised in the joining process, the timing of melting of the brazing material can be delayed. Therefore, creeping up of the brazing material can be suppressed.
  • Ag and Cu have a eutectic point near a mass ratio of 69:31.
  • the molten brazing filler metal smoothly reacts with Cu contained in the metal plate to form a eutectic alloy. Therefore, the contact area between the brazing material layer and the ceramic plate can be sufficiently and smoothly increased. With this manufacturing method, it is possible to efficiently manufacture a circuit board that has excellent durability against heat cycles.
  • the brazing material may be applied to the main surface of the ceramic plate so that the thickness of one or more coating layers is greater at the ends than at the center. As a result, even if a recess is formed in the metal plate, the vicinity of the recess and the ceramic plate can be firmly joined by the brazing material layer. Such a circuit board has sufficiently excellent bonding reliability between the metal plate and the ceramic plate.
  • the coating layer is formed such that the width Y of the thickly coated portion of the coating layer at the end portion, which has a larger thickness than the coating layer at the center portion, is larger than the width X of the recessed portion.
  • the layers may be laminated so that the recessed portion and the thickly coated portion are in contact with each other.
  • the contact area between the brazing material layer and the ceramic plate can be made sufficiently large even though a metal plate in which a recessed portion is formed is used.
  • a circuit board obtained from such a bonded body can further alleviate the concentration of stress caused by heat cycles, and has better durability against heat cycles.
  • a laminate may be produced by laminating a plurality of metal plates as shown in FIG.
  • the bonded body obtained by such a bonding process can also be called a multi-chip circuit board.
  • a multi-chip circuit board by dividing such a multi-chip circuit board, a plurality of individualized boards (divided boards) can be manufactured all at once.
  • Such a manufacturing method can manufacture circuit boards (singulated boards) with high production efficiency.
  • a power module includes any of the circuit boards described above and a semiconductor element electrically connected to the metal plate of the circuit board. Such a power module has excellent reliability because it includes any of the above-mentioned circuit boards.
  • circuit board that has excellent durability against heat cycles and a method for manufacturing the same. Furthermore, a power module including such a circuit board can be provided.
  • FIG. 1 is a perspective view of a circuit board according to one embodiment.
  • FIG. 2 is a plan view of a circuit board according to one embodiment.
  • FIG. 3 is a cross-sectional view taken along the line III--III of the circuit board of FIG.
  • FIG. 4 is an enlarged cross-sectional view of a part of the cross-section of FIG. 3.
  • FIG. 5 is an enlarged cross-sectional view of a part of a cross section of a circuit board according to a modified example.
  • FIG. 6 is a cross-sectional view of a power module according to one embodiment.
  • FIG. 7 is a perspective view showing an example of a ceramic plate provided with a coating layer in a method for manufacturing a circuit board according to an embodiment.
  • FIG. 8 is a cross-sectional view for explaining a lamination step in a method for manufacturing a circuit board according to an embodiment.
  • FIG. 9A is a scanning electron microscope (SEM) photograph showing a cross section along the thickness direction of the circuit board of Example 3.
  • FIG. 9(B) is a photograph showing the results of ultrasonic flaw detection of the circuit board of Example 3.
  • FIG. 10(A) is a scanning electron microscope (SEM) photograph showing a cross section along the thickness direction of the circuit board of Example 4.
  • FIG. 10(B) is a photograph showing the results of ultrasonic flaw detection of the circuit board of Example 4.
  • FIG. 11A is a scanning electron microscope (SEM) photograph showing a cross section along the thickness direction of the circuit board of Example 5.
  • FIG. 9A is a scanning electron microscope (SEM) photograph showing a cross section along the thickness direction of the circuit board of Example 3.
  • FIG. 9(B) is a photograph showing the results of ultrasonic flaw detection of the circuit board of Example 3.
  • FIG. 11(B) is a photograph showing the results of ultrasonic flaw detection of the circuit board of Example 5.
  • FIG. 12A is a scanning electron microscope (SEM) photograph showing a cross section along the thickness direction of the circuit board of Comparative Example 2.
  • FIG. 12(B) is a photograph showing the results of ultrasonic flaw detection of the circuit board of Comparative Example 2.
  • the numerical range indicated by "x to y” means greater than or equal to x and less than or equal to y.
  • Numerical ranges in which the upper limit or lower limit of each numerical range in each embodiment is replaced with the numerical value of any example are also included in the present disclosure.
  • a circuit board includes a ceramic plate, a metal plate, and a brazing material layer that joins the main surface of the ceramic plate and the main surface of the metal plate.
  • the number of metal plates joined to one main surface of one ceramic plate may be one or multiple.
  • the material of the ceramic plate is not particularly limited, and may be made of, for example, a nitride sintered body, a carbide sintered body, or an oxide sintered body. Specific examples include silicon nitride sintered bodies, aluminum nitride sintered bodies, aluminum oxide sintered bodies, and silicon carbide sintered bodies. There is no particular restriction as long as it is in the shape of a ceramic plate.
  • the thickness of the ceramic plate may be, for example, 0.2 to 2 mm, or 0.32 to 1.1 mm.
  • the metal plate may include Cu or an alloy of Cu and another metal, and may be a copper plate, for example.
  • the shape of the metal plate is not particularly limited as long as a recess is formed along at least a part of the outer edge of the main surface opposite to the main surface of the ceramic plate.
  • the thickness of the metal plate (distance between main surfaces) may be, for example, 0.1 to 1.2 mm, or 0.2 to 1.0 mm.
  • the metal plate may have a plating film on its surface.
  • the recess may be formed by a curved wall surface. That is, the metal plate may have an inner corner in the recess. This corner may extend parallel to the edge of the recess.
  • the brazing material layer may contain Ag, and may also contain Ag and Cu. Furthermore, it may contain one or more metals selected from the group consisting of Sn and active metals. Two or more metals may be an alloy.
  • the active metal may include one or more selected from the group consisting of Ti, Hf, Zr, and Nb.
  • Ag and Cu contained in the brazing material layer may be contained in the brazing material layer as an alloy such as an Ag--Cu eutectic alloy.
  • the content of Ag in the brazing material layer may be 65 to 95% by mass, or 70 to 95% by mass.
  • the total content of Ag and Cu in the brazing material layer may be 65 to 100% by mass, may be 70 to 99% by mass, may be 90 to 98% by mass, and may be 95 to 98% by mass. It's okay. This makes it possible to sufficiently reduce the residual stress in the brazing material layer and improving the denseness of the brazing material layer.
  • the content of the active metal in the brazing material layer may be 0.5 to 8 parts by mass based on 100 parts by mass of Ag and Cu in total.
  • the content of the active metal may be 0.5 to 8 parts by mass based on 100 parts by mass of Ag and Cu in total.
  • the metal contained in the brazing material layer may be contained as a nitride, oxide, carbide, or hydride.
  • the braze layer may include titanium nitride and/or titanium hydride ( TiH2 ). This makes it possible to sufficiently increase the bonding strength between the ceramic plate and the metal plate.
  • TiH 2 titanium nitride and/or titanium hydride
  • the content of TiH 2 may be, for example, 1 to 8 parts by weight with respect to 100 parts by weight of Ag and Cu in total.
  • FIG. 1 is a perspective view showing an example of a circuit board according to the present embodiment.
  • 2 is a plan view of the circuit board of FIG. 1
  • FIG. 3 is a sectional view taken along the line III--III of FIG.
  • the circuit board 100 includes a ceramic plate 10 and a plurality of metal plates 20 on the main surface 10A and the main surface 10B of the ceramic board 10.
  • the ceramic plate 10 has a flat plate shape.
  • the ceramic plate 10 is divided into a plurality of sections by dividing lines on the main surface 10A.
  • the principal surface 10A includes a plurality of partition lines L1 extending along a first direction and lined up at equal intervals, and a plurality of partition lines L1 extending along a second direction orthogonal to the first direction, as partition lines.
  • a plurality of partition lines L2 arranged at equal intervals are provided.
  • the partition line L1 and the partition line L2 are orthogonal to each other.
  • the partition lines L1 and L2 may be formed by, for example, a plurality of recesses lined up in a straight line, or may have a linear groove formed therein. Specifically, it may be a scribe line formed with laser light. Examples of the laser source include a carbon dioxide laser and a YAG laser. A scribe line can be formed by intermittently irradiating laser light from such a laser source. Note that the partition lines L1 and L2 do not have to be arranged at equal intervals, and are not limited to being perpendicular to each other. Further, the partition lines L1 and L2 may not be straight, but may be curved or bent.
  • the ceramic plate 10 has a plurality of partition areas 50 defined by partition lines L1 and L2.
  • a metal plate 20 is provided in each of the plurality of divided areas 50.
  • the plurality of metal plates 20 are independent from each other.
  • the circuit board 100 is also called a collective board, and can be divided along partition lines L1 and L2. By dividing, a plurality of circuit boards (singulated boards) can be obtained. The individualized board obtained by dividing in this way is also an example of the circuit board of this embodiment.
  • One main surface 20A of the metal plate 20 is exposed to the outside.
  • the other main surface 20B of the metal plate 20 and the main surface 10A (main surface 10B) of the ceramic plate 10 are joined by a brazing material layer 30.
  • a recess 22 is formed in the metal plate 20 along the outer edge of the main surface 20B (joint surface with the brazing material layer 30) of the metal plate 20.
  • the metal plate 20 having such a recess 22 formed therein may be cut out so that the outer side of the main surface 20B has a step-like shape.
  • the recess 22 is formed all around the outer edge of the main surface 20B of the metal plate 20.
  • the outer edge of the main surface 20B is formed by the recess 22.
  • the recess 22 may be provided only in the vicinity of the portion where the semiconductor element is soldered when the semiconductor element is mounted on the metal plate 20. Further, the recess 22 may be provided only in a part of one or more metal plates 20. For example, it is not necessary to provide the recess 22 in the metal plate 20 that serves as a heat sink of the power module.
  • the metal plates 20 provided on the main surface 10A and the main surface 10B of the ceramic plate 10 may have shapes different from each other.
  • FIG. 4 shows a partially enlarged cross-section of the circuit board 100 shown in FIG. 3.
  • 3 and 4 both show a cross section along the thickness direction of the metal plate 20, which is perpendicular to the edge 27 (upper edge) of the recess 22 on the side surface 20C.
  • This cross section can be obtained by cutting the circuit board 100 perpendicular to the extending direction of the edge 27 of the recess 22 and along the thickness direction of the metal plate 20 and the ceramic plate 10.
  • the width X of the recess 22 may be 0.05 mm or more, and may be 0.1 mm or more. In this way, as the width X increases, the distance from the brazing material layer 30 to the side surface 20C of the metal plate 20 increases. Therefore, creeping up of the brazing material onto the side surface 20C and main surface 20A of the metal plate 20 can be further suppressed.
  • the width X may be 10 mm or less, 5 mm or less, 3 mm or less, 1 mm or less, or 0.5 mm or less.
  • the ratio of the width X to the length of the main surface 20A of the metal plate 20 measured along the same direction as the width X may be 0.0005 to 0.5, and may be 0.001 to 0.3. Good too.
  • the length of the main surface 20A may be, for example, 5 to 100 mm, or 15 to 50 mm.
  • the height Z of the recess 22 may be 0.05 mm or more, 0.07 mm or more, or 0.1 mm or more. In this way, as the height Z increases, the distance from the brazing material layer 30 to the side surface 20C of the metal plate 20 increases. Therefore, creeping up of the brazing material onto the side surface 20C and main surface 20A of the metal plate 20 can be further suppressed.
  • the height Z may be 1.1 mm or less, 1.0 mm or less, 0.9 mm or less, or 0.5 mm or less.
  • the ratio of the height Z to the thickness of the metal plate 20 may be 0.04 to 1.0, or may be 0.1 to 0.6.
  • the ratio of the height Z to the width X may be 0.001 to 22, and may be 0.1 to 4. It may be 0.15 to 3. Note that the width X is measured along a direction parallel to the main surfaces 10A and 10B of the ceramic plate 10 in the cross section shown in FIGS. 3 and 4. The height Z is measured along the direction perpendicular to the main surfaces 10A and 10B of the ceramic plate 10 in the cross section shown in FIGS. 3 and 4.
  • the wall surface of the metal plate 20 constituting the recess 22 includes an opposing surface 24 that faces the main surfaces 10A and 10B of the ceramic plate 10, and an upright surface 23 that is orthogonal to the main surfaces 10A and 10B. At the boundary between the opposing surface 24 and the upright surface 23, an inside corner 25 extends parallel to the edge 27 of the recess 22. Since the metal plate 20 has the opposing surface 24 and the corner portion 25 in the recess 22, it is possible to further suppress the brazing material from creeping up from the brazing material layer 30.
  • the upright surface 23 is perpendicular to the main surfaces 10A and 10B, but is not limited thereto.
  • the facing surface 24 and/or the upright surface 23 may be inclined with respect to the main surface 10A and the main surface 10B.
  • the width X and height Z when the recess 22 is rectangular are as shown in FIG.
  • the width X and height Z are measured based on the most recessed part of the recess 22. That is, the width X can be determined as the maximum value of the distance between the virtual perpendicular VP and the wall surface constituting the recess, which is measured in a direction parallel to the main surface 20A in a cross section as shown in FIG.
  • the height Z is the height between the main surface 10A (main surface 10B) and the wall surface (opposing surface 24) forming the recess 22, measured in a direction perpendicular to the main surface 10A in a cross section as shown in FIG. It can be determined as the maximum value of distance.
  • the recess 22 is filled with the end of the brazing material layer 30.
  • the relationship between the virtual perpendicular VP extending from the edge 27 of the recess 22 toward the main surface 10A (10B) of the ceramic plate 10 and the main surface 10A (10B) of the ceramic plate 10 is The outer edge 35 of the contact surface between the main surface 10A (10B) of the ceramic plate 10 and the brazing material layer 30 is further away from the recess 22 than the intersection 12. Thereby, the contact area between the brazing material layer 30 and the main surface 10A (10B) of the ceramic plate 10 in the vicinity of the recess 22 can be increased.
  • the distance L between the intersection 12 and the outer edge 35 may be greater than 0 and 0.3 mm or less.
  • the upper limit of this distance L may be 0.2 mm.
  • the lower limit of the distance L may be 0.01 mm, 0.1 mm, or 0.15 mm. Thereby, durability against heat cycles can be further improved.
  • the brazing material layer 30 has a skirt portion 34 on the outside of the recess 22 that widens away from the recess 22 as it approaches the main surface 10A (10B) of the ceramic plate 10.
  • the sloped surface 34A forming the outline of the skirt portion 34 extends from the end edge 27 to the main surface 10A (10B).
  • the inclined surface 34A may extend from the side surface 20C to the main surface 10A (10B).
  • the slope angle of the slope surface 34A may not be constant, and a plurality of slope surfaces having different slope angles may be connected, or the slope surface 34A may be curved.
  • the brazing material layer 30 covers the entire wall surface of the metal plate 20 forming the recess 22 and fills the entire recess 22. Therefore, the entire virtual perpendicular line VP, which is a line segment connecting the edge 27 and the intersection point 12, passes through the inside of the brazing material layer 30. Thereby, the opposing surface 24 forming the recess 22 is also fixed to the ceramic plate 10. Therefore, the connection reliability between the metal plate 20 and the ceramic plate 10 can be made sufficiently high.
  • a part of the wall surface of the metal plate 20 forming the recess 22 may be exposed to the outside without being covered with the brazing material layer 30.
  • FIG. 5 is a cross-sectional view showing a modification of the circuit board 100. Similar to FIG. 4, FIG. 5 shows a part of a cross section along the thickness direction of the metal plate 20, which is perpendicular to the edge 27 (upper edge) of the recess 22 on the side surface 20C. In this modification, a part of the opposing surface 24 forming the recess 22 is covered with the brazing material layer 30, and an inclined surface 34A forming the outline of the skirt portion 34a extends from the opposing surface 24 to the main surface 10A (10B). ing. Therefore, a part of the virtual perpendicular VP passes through the inside of the brazing material layer 30, and the other part passes through the outside of the brazing material layer 30. Even with such a modification, durability against heat cycles can be sufficiently increased. Since the edge 27 is not covered with the brazing material layer 30, it is possible to sufficiently suppress the brazing material from creeping up onto the side surface 20C and main surface 20A of the metal plate 20.
  • the metal plate 20 may function as a circuit board that has the function of transmitting electrical signals or a heat sink that has the function of transmitting heat. Further, the metal plate 20 may have both a function of transmitting heat and a function of transmitting an electric signal.
  • the circuit board 100 and the individualized boards (circuit boards) obtained by dividing the circuit board can have a large contact area between the brazing material layer 30 and the ceramic board 10 even though a recess is formed in the metal plate 20. .
  • Such a circuit board 100 can alleviate stress concentration caused by heat cycles, and has excellent durability against heat cycles. Therefore, it is suitable as a component mounted in a power module that is required to have excellent durability against heat cycles.
  • a power module includes a circuit board and a semiconductor element electrically connected to a metal plate of the circuit board.
  • the circuit board may be the above-described circuit board 100 or a modification thereof, or may be another circuit board. The description regarding the circuit board 100 and its modifications is applied to the power module of this embodiment. Such a power module has excellent reliability.
  • the circuit board and the semiconductor element may be sealed with resin.
  • FIG. 6 is a cross-sectional view showing an example of the power module according to the present embodiment.
  • the power module 300 includes a base plate 70 and a circuit board 101 joined to one side of the base plate 70 via solder 62.
  • the metal plate 21 on one side of the circuit board 101 is joined to the base plate 70 via solder 62.
  • a semiconductor element 60 is attached to at least one of the metal plates 20 on the other side of the circuit board 101 via solder 61.
  • the semiconductor element 60 is connected to a predetermined location on the metal plate 20 with a metal wire 64 such as an aluminum wire. In this way, the semiconductor element 60 and the metal plate 20 are electrically connected.
  • the metal plate 20a which is one of the metal plates, is connected to an electrode 63 provided through the housing 66 via a solder 65. There is.
  • a housing 66 is disposed on one main surface of the base plate 70 and is integrated with the main surface to accommodate the circuit board 101.
  • a housing space formed by one main surface of the base plate 70 and the housing 66 is filled with resin 80.
  • the resin 80 seals the circuit board 101 and the semiconductor element 60.
  • the resin may be, for example, a thermosetting resin or a photocuring resin.
  • Cooling fins 72 forming a heat radiating section are joined to the other main surface of the base plate 70 via grease 74. Screws 73 are attached to the ends of the base plate 70 to fix the cooling fins 72 to the base plate 70.
  • the base plate 70 and the cooling fins 72 may be made of aluminum.
  • the base plate 70 and the cooling fins 72 have high thermal conductivity and function well as a heat dissipation section.
  • the metal plate 20 and the metal plate 21 are electrically insulated by the ceramic plate 10.
  • the metal plate 20 (20a) may form an electric circuit.
  • the metal plate 20 and the metal plate 21 are respectively joined to the main surface 10A and the main surface 10B of the ceramic plate 10 by a brazing material layer (not shown).
  • a recessed portion as shown in FIGS. 2 to 5 is formed in the metal plate 20, and the metal plate 20 is bonded to the ceramic plate 10 with a brazing material layer as shown in FIGS. 3 to 5.
  • concentration of stress caused by heat cycles on the circuit board 101 can be alleviated. Therefore, the power module 300 has excellent durability against heat cycles and is excellent in reliability.
  • a recess 22 similar to that of the metal plate 20 is also formed in the metal plate 21, and the metal plate 21 may be joined to the ceramic plate 10 with a brazing material layer as shown in FIGS. 3 to 5.
  • a method for manufacturing a circuit board includes a preparation step of preparing one or more metal plates each having a recess formed along the outer edge of one main surface, and applying a brazing material to the main surface of the ceramic plate.
  • a coating and drying process in which one or more coating layers are formed by coating and drying, and lamination in which a ceramic plate and one or more metal plates are laminated with one or more coating layers sandwiched therebetween to produce a laminate. and a joining step of heating the laminate to obtain a joined body in which a ceramic plate and one or more metal plates are joined with one or more brazing metal layers.
  • the metal plate may contain Cu or a Cu alloy, and may be a copper plate.
  • the recessed portion can be formed, for example, by machining using a machining center.
  • the size of the recess, ie width X and height Z, may be as described above.
  • the recess may be formed in a part of the outer edge of the main surface of the metal plate, or may be formed by cutting the outer edge of the main surface of the metal plate over the entire circumference.
  • the ceramic plate used in the coating and drying process can be produced, for example, by the following procedure.
  • a green sheet is produced by molding a slurry containing an inorganic compound powder, a binder resin, a sintering aid, a plasticizer, a dispersant, a solvent, and the like.
  • inorganic compounds include aluminum nitride (AlN), silicon nitride (Si 3 N 4 ), silicon carbide, and aluminum oxide.
  • Sintering aids include rare earth metals, alkaline earth metals, metal oxides, fluorides, chlorides, nitrates, sulfates, and the like. These may be used alone or in combination of two or more.
  • binder resins include methyl cellulose, ethyl cellulose, polyvinyl alcohol, polyvinyl butyral, and (meth)acrylic resins.
  • plasticizers include purified glycerin, glycerin triolate, diethylene glycol, phthalic acid plasticizers such as di-n-butyl phthalate, and dibasic acid plasticizers such as di-2-ethylhexyl sebacate.
  • dispersants include poly(meth)acrylates and (meth)acrylic acid-maleate copolymers.
  • solvents include organic solvents such as ethanol and toluene.
  • Examples of methods for forming green sheets include a doctor blade method and an extrusion method.
  • the green sheet obtained by molding is degreased and fired.
  • Degreasing may be performed, for example, by heating at 400 to 800°C for 0.5 to 20 hours. Thereby, the amount of residual organic matter (carbon) can be reduced while suppressing oxidation and deterioration of inorganic compounds.
  • Sintering is performed by heating to 1700 to 1900° C. in an atmosphere of non-oxidizing gas such as nitrogen, argon, ammonia, or hydrogen. In this way, for example, a ceramic plate 10 can be obtained. If necessary, the ceramic plate may be laser-processed to cut the edges or provide scribe lines.
  • the above degreasing and sintering may be performed with a plurality of stacked green sheets.
  • a release layer made of a release agent may be provided between the green sheets in order to facilitate separation of the base materials after firing.
  • the mold release agent for example, boron nitride (BN) can be used.
  • the release layer may be formed, for example, by applying a slurry of boron nitride powder by spraying, brushing, roll coating, screen printing, or the like.
  • the number of green sheets to be laminated may be, for example, 8 to 100, or 30 to 70, from the viewpoint of efficient mass production of ceramic plates and sufficient degreasing.
  • a partition line may be formed on the one main surface.
  • a scribe line may be provided as a partition line by irradiating the main surface of the ceramic plate with a laser beam.
  • the laser beam irradiated onto the main surface of the ceramic include a carbon dioxide laser and a YAG laser.
  • the brazing filler metal may contain Ag in the form of a single metal or a metal compound (alloy), and in addition to Ag, it may contain one or more metals selected from the group consisting of Cu, Sn, and active metals. It's fine. Two or more metals may be an alloy.
  • the active metal may include one or more selected from the group consisting of Ti, Hf, Zr, and Nb.
  • the brazing filler metal may contain 93 parts by mass or more, 95 parts by mass or more, and 97 parts by mass or more of Ag based on 100 parts by mass of Ag and Cu in total. By making the ratio of Ag to Cu sufficiently high in this manner, the timing of melting of the brazing material can be delayed when the temperature of the laminate is increased in the bonding process.
  • the brazing filler metal does not need to contain Cu.
  • the content of active metal in the brazing material may be 0.5 to 8 parts by mass based on 100 parts by mass of Ag and Cu in total.
  • the content of the active metal may be 0.5 to 8 parts by mass based on 100 parts by mass of Ag and Cu in total.
  • the active metal contained in the brazing filler metal may be contained as a nitride, oxide, carbide, or hydride.
  • the brazing material may include titanium nitride and/or titanium hydride ( TiH2 ). This makes it possible to sufficiently increase the bonding strength between the ceramic plate and the metal plate.
  • TiH 2 titanium nitride and/or titanium hydride
  • the content of TiH 2 may be, for example, 1 to 8 parts by weight based on 100 parts by weight of Ag and Cu in total.
  • the content of Sn in the brazing filler metal may be 0.5 to 5 parts by mass based on 100 parts by mass of Ag and Cu in total.
  • the tin content may be 0.5 to 5 parts by mass based on 100 parts by mass of Ag and Cu in total.
  • the brazing material may contain an organic solvent, a binder, and the like.
  • the viscosity of the brazing filler metal may be, for example, 5 to 20 Pa ⁇ s.
  • the organic solvent content in the brazing filler metal may be, for example, 5 to 25% by mass, and the binder content may be, for example, 2 to 15% by mass.
  • the main surface 10A of the ceramic board 10 is coated with a roll coater method, a screen coating, etc.
  • the coating layer 38 is provided by applying a brazing material by a method such as a printing method or a transfer method.
  • the coating layer 38 may be provided at a position where the metal plate 20 is joined.
  • the area of the coating layer 38 may be made larger than the area of the metal plate so that the coating layer 38 protrudes from the outer edge of the main surface of the metal plate.
  • the number of coating layers 38 may be the same as the number of metal plates bonded to the ceramic plate.
  • the coating layer 38 may be provided on the main surface 10B as well as on the main surface 10A.
  • FIG. 8 shows a part of a cross section when the ceramic plate 10 provided with the coating layer 38 is cut along the thickness direction.
  • the coating layer 38 is thicker at the ends than at the center. That is, the coating layer 38 has a thinly coated portion 37 at the center and a thickly coated portion 36 at the ends. Further, the coating layer 38 has a protruding portion 39 extending outward from the side surface 20C of the metal plate 20 along the main surface 10A of the ceramic plate 10 at the end. As described above, since the coating layer 38 has the protruding portion 39 at the end, the area in plan view is larger than the area of the metal plate 20. The protruding portion 39 also constitutes a part of the thick coating portion 36. Thereby, the recess 22 can be more smoothly filled with the brazing material. Although one coating layer 38 is shown in FIG. 8, other coating layers 38 may have a similar shape.
  • the thick coating portion 36 of the coating layer 38 has a width Y.
  • the thickly coated portion 36 is formed to face the recess 22 of the metal plate 20 that is aligned with the coated layer 38 .
  • the coating layer may be formed such that the width Y of the thickly coated portion 36 at the end of the coating layer 38 is larger than the width X of the recess 22 of the metal plate 20 .
  • the width Y may be, for example, 0.02 mm or more, 0.05 mm or more, 0.2 mm or more, or 1 mm or more.
  • the upper limit of the width Y is, for example, 10 mm.
  • the difference H in thickness between the thickly coated portion 36 and the thinly coated portion 37 may be lower than the height Z of the recessed portion. Thereby, it is possible to sufficiently suppress the brazing filler metal from creeping up to the side surface 20C and the main surface 20A.
  • the thickness difference H may be 0.005 mm or more, or 0.010 mm or more. Thereby, the distance L in FIGS. 4 and 5 can be made sufficiently large.
  • the thickness difference H may be 0.1 mm or less, and may be 0.05 mm or less.
  • the width Y and the difference H in thickness may be changed depending on the width X and height Z of the recess 22. If the width Y and the thickness difference H are increased, the distance L in FIGS. 4 and 5 tends to become longer.
  • the protruding portion 39 has a width W.
  • the width W is measured along the main surface 10A with reference to a virtual perpendicular line VL drawn toward the coating layer 38 from the side surface 20C of the metal plate 20 aligned with the coating layer 38 as shown in FIG. This is the length of the protruding portion 39.
  • the width W of the protruding portion 39 may be 0.01 mm or more, or may be 0.015 mm or more.Thereby, the distance L in FIGS. 4 and 5 can be made sufficiently large. Thereby, the recess 22 can be sufficiently filled with the brazing material.
  • the width W may be 0.4 mm or less, or may be 0.2 mm or less. This can prevent the distance L in FIGS. 4 and 5 from becoming excessively large.
  • the width W may be changed depending on the width X and height Z of the recess 22. In some modifications, the protruding portion 39 may not be provided, and the area of the metal plate 20 and the area of the coating layer 38 in plan view
  • the bonding state can be further improved. For example, by setting the width W to 0.1 mm or less and the width Y to 1.5 mm or more, cracks that occur during a heat cycle test can be sufficiently reduced. Specifically, the area ratio of cracks measured by the method described in Examples can be reduced to 0.5% or less.
  • the ceramic plate 10 and the metal plate 20 are laminated with the coating layer 38 sandwiched therebetween to produce a laminate.
  • the main surface 20B on which the recess 22 is formed and the main surface 10A of the ceramic plate 10 are stacked so as to face each other.
  • a coating layer 38 is similarly formed on the main surface 10B of the ceramic plate 10, and the layers are laminated so that the main surface 20B on which the recess 22 is formed faces the main surface 10B of the ceramic board 10.
  • each of the plurality of metal plates 20 is independent for each partition area 50 defined by partition lines L1 and L2 on the main surface 10A of the ceramic plate 10.
  • the obtained laminate is heated in a heating furnace to obtain a joined body in which the ceramic plate and the metal plate are joined with a brazing material layer.
  • the heating temperature may be, for example, 700 to 900°C.
  • the atmosphere in the furnace may be an inert gas such as nitrogen, and the reaction may be performed under reduced pressure below atmospheric pressure or under vacuum.
  • the heating furnace may be of a continuous type that continuously manufactures a plurality of joined bodies, or may be one that manufactures one or more joined bodies in a batch manner. Heating may be performed while pressing the joined body in the stacking direction of the laminate.
  • the brazing material contained in the coating layer flows and reacts with the metal plate, forming a brazing material layer.
  • the brazing material layer may include a reaction product between the brazing material and a metal component contained in the metal plate.
  • the thus obtained bonded body may have a structure similar to the circuit board shown in FIGS. 1 to 4, or may have a structure similar to the circuit board shown in FIG. .
  • surface treatment such as forming a plating film on the metal plate is performed.
  • cutting or the like may be performed to adjust the shape of the brazing material layer. In this way, a circuit board can be manufactured.
  • a dividing step may be performed in which the aggregate substrate is divided into individual pieces. .
  • the collective board can be divided along the division lines L1 and L2 to obtain a plurality of circuit boards.
  • a joined body can be obtained by joining a plurality of metal plates that have been previously processed to a predetermined size.
  • a circuit board that has excellent durability against heat cycles and suppresses creeping can be efficiently manufactured without performing a resist printing process and a metal plate etching process. be able to.
  • the circuit board obtained by such a manufacturing method can reduce manufacturing costs and has excellent appearance and connection reliability with external circuits such as semiconductor elements.
  • a power module may be manufactured using the circuit board obtained in this way.
  • a power module can be manufactured by mounting a semiconductor element on a circuit board using solder and wire bonding, etc., housing the circuit board and semiconductor element in a housing space of a housing, and then sealing it with resin. .
  • a plurality of metal plates are provided on each of the pair of main surfaces of the ceramic plate, but the present invention is not limited thereto.
  • one or more metal plates may be provided on only one main surface of the ceramic plate.
  • the structure and shape of the brazing material layer and the metal plate provided on each of the pair of main surfaces of the ceramic plate may be different from each other.
  • one metal plate may be provided on each of the pair of main surfaces of the ceramic plate.
  • the recess does not need to be provided so as to surround the main surface.
  • the brazing material layer 30 had the skirt portion 34 and the skirt portion 34a at the end portions, respectively, but the present invention is not limited thereto.
  • the end portion of the brazing material layer 30 may form a step-like step. In this case, in a cross section as shown in FIG. 4, the end portion of the brazing material layer 30 may rise substantially parallel to the virtual perpendicular line VP.
  • a circuit board comprising a ceramic plate, a metal plate, and a brazing material layer that joins the main surface of the ceramic plate and the main surface of the metal plate, A recess is formed in the metal plate along at least a part of the outer edge of the main surface of the metal plate, When viewed in a cross section perpendicular to the edge of the recess on the side surface of the metal plate and along the thickness direction of the metal plate, an imaginary perpendicular line extending from the edge toward the main surface of the ceramic plate; A circuit board, wherein an outer edge of a contact surface between the ceramic plate and the brazing material layer is further away from the recess than an intersection with the main surface of the ceramic plate.
  • the distance L between the intersection of the virtual perpendicular and the main surface of the ceramic plate and the outer edge of the contact surface is greater than 0 and less than or equal to 0.3 mm.
  • the brazing material layer has a skirt portion that widens away from the recess as it approaches the main surface of the ceramic plate. circuit board.
  • the sloped surface forming the outline of the skirt portion extends from the edge or the side surface of the metal plate to the main surface of the ceramic plate when viewed in cross section. circuit board.
  • the wall surface of the metal plate constituting the recess includes an opposing surface that faces the main surface of the ceramic plate, and at least a portion of the opposing surface is covered with the brazing material layer. ] to [4].
  • the brazing material layer fills the entire recess, and the virtual perpendicular line extends from the edge to the main surface of the ceramic plate inside the brazing material layer, [1] to [5] A circuit board as described in any one of the following.
  • the ceramic plate, a plurality of metal plates, and a plurality of brazing filler metal layers bonding the main surface of the ceramic plate and each of the main surfaces of the plurality of metal plates, the plurality of metal plates include the metal plate in which the recess is formed; When viewed in a cross section perpendicular to the edge of the recess on the side surface of the metal plate and along the thickness direction of the metal plate, an imaginary perpendicular line extending from the edge toward the main surface of the ceramic plate; According to any one of [1] to [8], the outer edge of the contact surface between the ceramic plate and the brazing material layer is further away from the recess than the intersection with the main surface of the ceramic plate.
  • the ceramic plate and the one or more metal plates are laminated so that the one main surface of the one or more metal plates and the main surface of the ceramic plate face each other, When viewed in a cross section of the joined body along the thickness direction of the metal plate and perpendicular to the edge of the recess on the side surface of the metal plate in which the recess is formed, Manufacturing a circuit board, wherein the outer edge of the contact surface
  • the metal plate contains Cu
  • Method. [12] In the coating and drying step, the brazing filler metal is coated on the main surface of the ceramic plate so that the thickness of the one or more coating layers is greater at the ends than at the center; 10] or the method for manufacturing a circuit board according to [11].
  • the width Y of the thickly coated portion of the coating layer at the end portion, which is thicker than the coating layer at the center portion, is larger than the width X of the recessed portion.
  • a plurality of metal plates in which the recesses are formed are prepared,
  • the laminated body is produced by laminating the plurality of metal plates so that each of the plurality of metal plates is independent for each division area defined by the division line on the main surface of the ceramic plate. death,
  • circuit board according to any one of [1] to [9] above, or the circuit board obtained by the manufacturing method according to any one of [10] to [14] above, and the circuit A power module comprising: a semiconductor element electrically connected to the metal plate of a substrate.
  • a brazing filler metal containing Ag, Sn, and TiH 2 was prepared.
  • This brazing filler metal contained 100 parts by mass of Ag based on a total of 100 parts by mass of Ag and Cu. That is, a brazing filler metal that does not contain Cu was used.
  • This brazing filler metal contained 3 parts by mass of Sn and 3.5 parts by mass of TiH 2 based on 100 parts by mass of Ag.
  • the main surface of the ceramic plate was divided into 24 divided areas by scribe lines.
  • a brazing material was applied to each section by screen printing (mesh number: 150) and dried to form a coating layer.
  • the coating area of the coating layer was the same as the area of the main surface of the copper plate to be bonded to the ceramic plate.
  • the coating layer had a thinly coated part and a thickly coated part as shown in FIG.
  • the width Y of the thickly coated portion, the width W of the protruding portion, and the difference H in thickness between the thickly coated portion and the thinly coated portion were as shown in Table 1. Note that the thickness of the lightly coated portion was 0.015 mm.
  • a copper plate was laminated on the ceramic plate so that the coating layer and the main surface of the copper plate were in contact with each other. In this way, a total of 24 copper plates were laminated on one main surface of the ceramic plate so as to be independent for each divided area.
  • Example 2 The procedure was the same as in Example 1, except that the amount of cutting of the outer edge of one main surface of the copper plate by machining using a machining center was changed, and the height Z of the recess in the copper plate was changed as shown in Table 1.
  • a circuit board was fabricated using the following steps.
  • Example 6 A circuit board was prepared in the same manner as in Example 2, except that at least one of the width Y of the thickly coated part in the coating layer, the width W of the protruding part, and the composition of the brazing material was changed as shown in Table 1. was created.
  • Example 2 was carried out in the same manner as in Example 2, except that the width Y of the thickly coated part in the coating layer, the heating temperature of the laminate during bonding (bonding temperature), and the composition of the brazing filler metal were changed as shown in Table 1. A circuit board was created.
  • Comparative example 2 A circuit board was produced in the same manner as Comparative Example 1, except that the composition of the brazing filler metal and the bonding temperature during bonding were changed as shown in Table 1.
  • circuit board ⁇ Cross-sectional shape of brazing metal layer>
  • the circuit boards of each Example and each Comparative Example were cut and cross-sectional observations were made. Specifically, the circuit board was cut perpendicular to the edge of the recess on the side surface of the metal plate and along the thickness direction of the copper plate to obtain a cross section as shown in FIG. 4 or 5.
  • FIG. 9(A), FIG. 10(A), FIG. 11(A), and FIG. 12(A) are SEMs showing cross sections of the circuit boards of Example 3, Example 4, Example 5, and Comparative Example 2, respectively. It's a photo. In this way, each cross section was observed by SEM (magnification: 200 times) to confirm the shape of the brazing material layer in the recess.
  • the entire recess is filled with the brazing material layer 30, and a skirt portion 34 that widens away from the recess as it approaches the main surface of the ceramic plate 10 is "A".
  • a portion of the wall surface (opposing surface) of the metal plate forming the recess is covered with a brazing material layer, and a portion of the skirt portion 34 is covered with a brazing material layer.
  • a case in which the material entered the inside of the recess was evaluated as "B". In FIG.
  • partial discharge charge amount measurement was performed after the heat cycle test. Specifically, the circuit board after the heat cycle test was boosted to 4.5 kV at a boost rate of 0.3 kV/s in insulating oil, and the amount of partial discharge charge at that time was measured.
  • a partial discharge measuring machine (device name: TTP15) manufactured by Mess & Prufsysteme GmbH was used. When the partial discharge charge amount was less than 10 pC, it was evaluated as "A”, and when it was 10 pC or more, it was evaluated as "B”. The results were as shown in Table 2.
  • SAT Ultrasonic testing
  • FIG. 9(B), FIG. 10(B), FIG. 11(B), and FIG. 12(B) are ultrasonic flaw detection tests of circuit boards of Example 3, Example 4, Example 5, and Comparative Example 2, respectively. This is a photograph showing the results. From these photographs, it was confirmed that the circuit boards of Examples 3 to 5 had fewer voids at the peripheral edge than the circuit board of Comparative Example 2.

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