JPWO2024150370A1 - - Google Patents
Info
- Publication number
- JPWO2024150370A1 JPWO2024150370A1 JP2024569943A JP2024569943A JPWO2024150370A1 JP WO2024150370 A1 JPWO2024150370 A1 JP WO2024150370A1 JP 2024569943 A JP2024569943 A JP 2024569943A JP 2024569943 A JP2024569943 A JP 2024569943A JP WO2024150370 A1 JPWO2024150370 A1 JP WO2024150370A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/000594 WO2024150370A1 (ja) | 2023-01-12 | 2023-01-12 | 絶縁基板および半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024150370A1 true JPWO2024150370A1 (https=) | 2024-07-18 |
| JPWO2024150370A5 JPWO2024150370A5 (https=) | 2025-02-17 |
Family
ID=91896560
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024569943A Pending JPWO2024150370A1 (https=) | 2023-01-12 | 2023-01-12 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2024150370A1 (https=) |
| CN (1) | CN120500746A (https=) |
| DE (1) | DE112023005604T5 (https=) |
| WO (1) | WO2024150370A1 (https=) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004080063A (ja) * | 1996-08-27 | 2004-03-11 | Dowa Mining Co Ltd | 高信頼性半導体用基板 |
| JP2007311527A (ja) * | 2006-05-18 | 2007-11-29 | Mitsubishi Materials Corp | パワーモジュール用基板およびパワーモジュール用基板の製造方法並びにパワーモジュール |
| JP2009158611A (ja) * | 2007-12-25 | 2009-07-16 | Kyocera Corp | 回路基板及びこれを用いたパッケージ並びに電子装置 |
| JP2014027221A (ja) * | 2012-07-30 | 2014-02-06 | Kyocera Corp | 回路基板およびそれを用いた電子装置 |
| JP2015028998A (ja) * | 2013-07-30 | 2015-02-12 | 株式会社豊田自動織機 | 半導体装置 |
| JP2015070107A (ja) * | 2013-09-30 | 2015-04-13 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
| WO2016098431A1 (ja) * | 2014-12-18 | 2016-06-23 | 三菱電機株式会社 | 絶縁回路基板、パワーモジュールおよびパワーユニット |
| JP2020161842A (ja) * | 2015-09-28 | 2020-10-01 | 株式会社東芝 | 回路基板および半導体装置 |
-
2023
- 2023-01-12 CN CN202380090039.4A patent/CN120500746A/zh active Pending
- 2023-01-12 JP JP2024569943A patent/JPWO2024150370A1/ja active Pending
- 2023-01-12 WO PCT/JP2023/000594 patent/WO2024150370A1/ja not_active Ceased
- 2023-01-12 DE DE112023005604.8T patent/DE112023005604T5/de active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004080063A (ja) * | 1996-08-27 | 2004-03-11 | Dowa Mining Co Ltd | 高信頼性半導体用基板 |
| JP2007311527A (ja) * | 2006-05-18 | 2007-11-29 | Mitsubishi Materials Corp | パワーモジュール用基板およびパワーモジュール用基板の製造方法並びにパワーモジュール |
| JP2009158611A (ja) * | 2007-12-25 | 2009-07-16 | Kyocera Corp | 回路基板及びこれを用いたパッケージ並びに電子装置 |
| JP2014027221A (ja) * | 2012-07-30 | 2014-02-06 | Kyocera Corp | 回路基板およびそれを用いた電子装置 |
| JP2015028998A (ja) * | 2013-07-30 | 2015-02-12 | 株式会社豊田自動織機 | 半導体装置 |
| JP2015070107A (ja) * | 2013-09-30 | 2015-04-13 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
| WO2016098431A1 (ja) * | 2014-12-18 | 2016-06-23 | 三菱電機株式会社 | 絶縁回路基板、パワーモジュールおよびパワーユニット |
| JP2020161842A (ja) * | 2015-09-28 | 2020-10-01 | 株式会社東芝 | 回路基板および半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE112023005604T5 (de) | 2025-11-06 |
| WO2024150370A1 (ja) | 2024-07-18 |
| CN120500746A (zh) | 2025-08-15 |
Similar Documents
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