JPWO2024150370A5 - - Google Patents

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Publication number
JPWO2024150370A5
JPWO2024150370A5 JP2024569943A JP2024569943A JPWO2024150370A5 JP WO2024150370 A5 JPWO2024150370 A5 JP WO2024150370A5 JP 2024569943 A JP2024569943 A JP 2024569943A JP 2024569943 A JP2024569943 A JP 2024569943A JP WO2024150370 A5 JPWO2024150370 A5 JP WO2024150370A5
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JP
Japan
Prior art keywords
circuit pattern
ceramic substrate
outer periphery
insulating substrate
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024569943A
Other languages
English (en)
Japanese (ja)
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JPWO2024150370A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/000594 external-priority patent/WO2024150370A1/ja
Publication of JPWO2024150370A1 publication Critical patent/JPWO2024150370A1/ja
Publication of JPWO2024150370A5 publication Critical patent/JPWO2024150370A5/ja
Pending legal-status Critical Current

Links

JP2024569943A 2023-01-12 2023-01-12 Pending JPWO2024150370A1 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/000594 WO2024150370A1 (ja) 2023-01-12 2023-01-12 絶縁基板および半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024150370A1 JPWO2024150370A1 (https=) 2024-07-18
JPWO2024150370A5 true JPWO2024150370A5 (https=) 2025-02-17

Family

ID=91896560

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024569943A Pending JPWO2024150370A1 (https=) 2023-01-12 2023-01-12

Country Status (4)

Country Link
JP (1) JPWO2024150370A1 (https=)
CN (1) CN120500746A (https=)
DE (1) DE112023005604T5 (https=)
WO (1) WO2024150370A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3932343B2 (ja) * 1996-08-27 2007-06-20 Ｄｏｗａメタルテック株式会社 半導体用基板およびその製造方法
JP4904916B2 (ja) * 2006-05-18 2012-03-28 三菱マテリアル株式会社 パワーモジュール用基板およびパワーモジュール用基板の製造方法並びにパワーモジュール
JP4926033B2 (ja) * 2007-12-25 2012-05-09 京セラ株式会社 回路基板及びこれを用いたパッケージ並びに電子装置
JP2014027221A (ja) * 2012-07-30 2014-02-06 Kyocera Corp 回路基板およびそれを用いた電子装置
JP6201490B2 (ja) * 2013-07-30 2017-09-27 株式会社豊田自動織機 半導体装置
JP6210818B2 (ja) * 2013-09-30 2017-10-11 三菱電機株式会社 半導体装置およびその製造方法
US10170433B2 (en) * 2014-12-18 2019-01-01 Mitsubishi Electric Corporation Insulated circuit board, power module and power unit
EP3358614B1 (en) * 2015-09-28 2022-12-14 Kabushiki Kaisha Toshiba Circuit substrate and semiconductor device

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