CN120500746A - 绝缘基板及半导体装置 - Google Patents

绝缘基板及半导体装置

Info

Publication number
CN120500746A
CN120500746A CN202380090039.4A CN202380090039A CN120500746A CN 120500746 A CN120500746 A CN 120500746A CN 202380090039 A CN202380090039 A CN 202380090039A CN 120500746 A CN120500746 A CN 120500746A
Authority
CN
China
Prior art keywords
circuit pattern
ceramic substrate
semiconductor element
semiconductor device
insulating substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380090039.4A
Other languages
English (en)
Chinese (zh)
Inventor
近藤胜彦
井本裕儿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN120500746A publication Critical patent/CN120500746A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof

Landscapes

  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN202380090039.4A 2023-01-12 2023-01-12 绝缘基板及半导体装置 Pending CN120500746A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/000594 WO2024150370A1 (ja) 2023-01-12 2023-01-12 絶縁基板および半導体装置

Publications (1)

Publication Number Publication Date
CN120500746A true CN120500746A (zh) 2025-08-15

Family

ID=91896560

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380090039.4A Pending CN120500746A (zh) 2023-01-12 2023-01-12 绝缘基板及半导体装置

Country Status (4)

Country Link
JP (1) JPWO2024150370A1 (https=)
CN (1) CN120500746A (https=)
DE (1) DE112023005604T5 (https=)
WO (1) WO2024150370A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3932343B2 (ja) * 1996-08-27 2007-06-20 Ｄｏｗａメタルテック株式会社 半導体用基板およびその製造方法
JP4904916B2 (ja) * 2006-05-18 2012-03-28 三菱マテリアル株式会社 パワーモジュール用基板およびパワーモジュール用基板の製造方法並びにパワーモジュール
JP4926033B2 (ja) * 2007-12-25 2012-05-09 京セラ株式会社 回路基板及びこれを用いたパッケージ並びに電子装置
JP2014027221A (ja) * 2012-07-30 2014-02-06 Kyocera Corp 回路基板およびそれを用いた電子装置
JP6201490B2 (ja) * 2013-07-30 2017-09-27 株式会社豊田自動織機 半導体装置
JP6210818B2 (ja) * 2013-09-30 2017-10-11 三菱電機株式会社 半導体装置およびその製造方法
US10170433B2 (en) * 2014-12-18 2019-01-01 Mitsubishi Electric Corporation Insulated circuit board, power module and power unit
EP3358614B1 (en) * 2015-09-28 2022-12-14 Kabushiki Kaisha Toshiba Circuit substrate and semiconductor device

Also Published As

Publication number Publication date
JPWO2024150370A1 (https=) 2024-07-18
DE112023005604T5 (de) 2025-11-06
WO2024150370A1 (ja) 2024-07-18

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