JP4377729B2 - 配線基板 - Google Patents
配線基板 Download PDFInfo
- Publication number
- JP4377729B2 JP4377729B2 JP2004089426A JP2004089426A JP4377729B2 JP 4377729 B2 JP4377729 B2 JP 4377729B2 JP 2004089426 A JP2004089426 A JP 2004089426A JP 2004089426 A JP2004089426 A JP 2004089426A JP 4377729 B2 JP4377729 B2 JP 4377729B2
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- wiring
- conductive pad
- insulating base
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
1a・・・切欠き部
2・・・配線導体
3・・・接続パッド
4・・・導電パッド
5・・・非貫通の穴
6・・・導体層
9・・・配線基板
Claims (2)
- 複数の絶縁層が積層されて成る絶縁基体と、該絶縁基体の内部に形成された配線導体と、前記絶縁基体の下面の外周部に、前記絶縁基体の側面に形成された複数の切欠き部にそれぞれ延出するように配列形成されるとともに前記切欠き部で前記配線導体に電気的に接続されている複数の接続パッドと、前記絶縁基体の下面の中央部に形成された導電パッドと、前記絶縁基体の下面の前記導電パッドの周縁上に形成された非貫通の穴と、該非貫通の穴の内側面に形成された導体層とを具備していることを特徴とする配線基板。
- 前記穴は、横断面形状が円形状または楕円形状であり、同じ間隔で複数形成されていることを特徴とする請求項1記載の配線基板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004089426A JP4377729B2 (ja) | 2004-03-25 | 2004-03-25 | 配線基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004089426A JP4377729B2 (ja) | 2004-03-25 | 2004-03-25 | 配線基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005277164A JP2005277164A (ja) | 2005-10-06 |
JP4377729B2 true JP4377729B2 (ja) | 2009-12-02 |
Family
ID=35176481
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004089426A Expired - Fee Related JP4377729B2 (ja) | 2004-03-25 | 2004-03-25 | 配線基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4377729B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7223234B2 (ja) * | 2020-07-10 | 2023-02-16 | 日亜化学工業株式会社 | 半導体装置、及び半導体装置の製造方法 |
-
2004
- 2004-03-25 JP JP2004089426A patent/JP4377729B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2005277164A (ja) | 2005-10-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2006303335A (ja) | 電子部品搭載用基板及びそれを用いた電子装置 | |
JP2007234663A (ja) | 配線基板及びそれを用いた電子装置 | |
JP6622812B2 (ja) | 発光素子搭載用基板、発光装置および発光モジュール | |
JP2006270082A (ja) | 配線基板及びそれを用いた電子装置 | |
JP2017152433A (ja) | 電子部品搭載用基板、電子装置および電子モジュール | |
JP4377729B2 (ja) | 配線基板 | |
JP4458974B2 (ja) | 多数個取り配線基板 | |
JP4272550B2 (ja) | 多数個取り配線基板 | |
JP2006066424A (ja) | 配線基板 | |
JP4383253B2 (ja) | 配線基板 | |
JP5213663B2 (ja) | 電子装置の実装構造 | |
JP4404684B2 (ja) | 配線基板 | |
JP4812516B2 (ja) | 複数個取り配線基板 | |
JP4189312B2 (ja) | 配線基板 | |
JP2013012720A (ja) | 電子装置 | |
JP4476075B2 (ja) | 多数個取り配線基板 | |
JP2005317597A (ja) | 配線基板 | |
JP5084382B2 (ja) | 電子部品収納用パッケージ | |
JP2005311253A (ja) | 配線基板 | |
JP2006185977A (ja) | 配線基板 | |
JP2004288661A (ja) | 配線基板 | |
JP2007234662A (ja) | 複数個取り配線基板 | |
JP2006237298A (ja) | 配線基板 | |
JP4463056B2 (ja) | 電子部品収納用パッケージ | |
JP2005050935A (ja) | 多数個取り配線基板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070213 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20081023 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20090818 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20090911 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120918 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130918 Year of fee payment: 4 |
|
LAPS | Cancellation because of no payment of annual fees |