JP4404684B2 - 配線基板 - Google Patents
配線基板 Download PDFInfo
- Publication number
- JP4404684B2 JP4404684B2 JP2004130898A JP2004130898A JP4404684B2 JP 4404684 B2 JP4404684 B2 JP 4404684B2 JP 2004130898 A JP2004130898 A JP 2004130898A JP 2004130898 A JP2004130898 A JP 2004130898A JP 4404684 B2 JP4404684 B2 JP 4404684B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- conductor
- insulating base
- wiring board
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
102・・・配線導体
103・・・溝
104・・・側面導体
105・・・接続パッド
106・・・導電パッド
107・・・接地用導体層
108・・・電源用導体層
109・・・貫通導体
110・・・配線基板
111・・・搭載部
Claims (2)
- 絶縁基体と、該絶縁基体の内部に形成された配線導体と、前記絶縁基体の側面に上下方向に延びるように形成された溝と、該溝の内面に形成され、前記配線導体に電気的に接続された側面導体と、前記絶縁基体の下面の外周部に前記側面導体に電気的に接続されて配列形成された複数の接続パッドと、前記絶縁基体の下面の中央部に形成された複数の導電パッドとを具備しており、複数の前記接続パッドは信号用のものと接地用および電源用のものとを含み、接地用および電源用の前記接続パッドは複数の前記導電パッドに電気的に接続されており、前記絶縁基体の下面の複数の前記導電パッド間に前記絶縁基体より高い誘電率を有する絶縁層が形成されていることを特徴とする配線基板。
- 前記絶縁基体は、内部に接地導体層および電源導体層の少なくとも一方が前記側面導体と電気的に接続されて形成されていることを特徴とする請求項1記載の配線基板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004130898A JP4404684B2 (ja) | 2004-04-27 | 2004-04-27 | 配線基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004130898A JP4404684B2 (ja) | 2004-04-27 | 2004-04-27 | 配線基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005317594A JP2005317594A (ja) | 2005-11-10 |
JP4404684B2 true JP4404684B2 (ja) | 2010-01-27 |
Family
ID=35444726
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004130898A Expired - Fee Related JP4404684B2 (ja) | 2004-04-27 | 2004-04-27 | 配線基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4404684B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4907178B2 (ja) * | 2006-01-26 | 2012-03-28 | パナソニック株式会社 | 半導体装置およびそれを備えた電子機器 |
JP5851439B2 (ja) * | 2013-03-07 | 2016-02-03 | 株式会社東芝 | 高周波半導体用パッケージ |
JP6314526B2 (ja) * | 2013-05-10 | 2018-04-25 | 株式会社大真空 | 圧電振動デバイス |
US11935806B2 (en) | 2020-07-10 | 2024-03-19 | Nichia Corporation | Semiconductor device and method for manufacturing semiconductor device |
-
2004
- 2004-04-27 JP JP2004130898A patent/JP4404684B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2005317594A (ja) | 2005-11-10 |
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