JP7555493B2 - 回路基板及びその製造方法 - Google Patents

回路基板及びその製造方法 Download PDF

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Publication number
JP7555493B2
JP7555493B2 JP2023533899A JP2023533899A JP7555493B2 JP 7555493 B2 JP7555493 B2 JP 7555493B2 JP 2023533899 A JP2023533899 A JP 2023533899A JP 2023533899 A JP2023533899 A JP 2023533899A JP 7555493 B2 JP7555493 B2 JP 7555493B2
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Japan
Prior art keywords
metal plate
bonding layer
ceramic plate
plate
circuit board
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
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JP2023533899A
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English (en)
Japanese (ja)
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JPWO2023188670A5 (https=
JPWO2023188670A1 (https=
Inventor
晃正 湯浅
貴裕 中村
善幸 江嶋
厚樹 五十嵐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of JPWO2023188670A1 publication Critical patent/JPWO2023188670A1/ja
Publication of JPWO2023188670A5 publication Critical patent/JPWO2023188670A5/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Ceramic Products (AREA)
JP2023533899A 2022-03-31 2023-01-04 回路基板及びその製造方法 Active JP7555493B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022059773 2022-03-31
JP2022059773 2022-03-31
PCT/JP2023/000025 WO2023188670A1 (ja) 2022-03-31 2023-01-04 回路基板及びその製造方法

Publications (3)

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JPWO2023188670A1 JPWO2023188670A1 (https=) 2023-10-05
JPWO2023188670A5 JPWO2023188670A5 (https=) 2024-03-08
JP7555493B2 true JP7555493B2 (ja) 2024-09-24

Family

ID=88200160

Family Applications (1)

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JP2023533899A Active JP7555493B2 (ja) 2022-03-31 2023-01-04 回路基板及びその製造方法

Country Status (2)

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JP (1) JP7555493B2 (https=)
WO (1) WO2023188670A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007311527A (ja) 2006-05-18 2007-11-29 Mitsubishi Materials Corp パワーモジュール用基板およびパワーモジュール用基板の製造方法並びにパワーモジュール
JP2008311294A (ja) 2007-06-12 2008-12-25 Mitsubishi Materials Corp パワーモジュール用基板の製造方法
WO2019003725A1 (ja) 2017-06-28 2019-01-03 京セラ株式会社 パワーモジュール用基板およびパワーモジュール

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10190176A (ja) * 1996-12-26 1998-07-21 Denki Kagaku Kogyo Kk 回路基板
JP2007095955A (ja) * 2005-09-28 2007-04-12 Kyocera Corp 回路基板およびその製造方法
JP2022000871A (ja) * 2018-07-31 2022-01-04 京セラ株式会社 電気回路基板及びパワーモジュール

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007311527A (ja) 2006-05-18 2007-11-29 Mitsubishi Materials Corp パワーモジュール用基板およびパワーモジュール用基板の製造方法並びにパワーモジュール
JP2008311294A (ja) 2007-06-12 2008-12-25 Mitsubishi Materials Corp パワーモジュール用基板の製造方法
WO2019003725A1 (ja) 2017-06-28 2019-01-03 京セラ株式会社 パワーモジュール用基板およびパワーモジュール

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WO2023188670A1 (ja) 2023-10-05
JPWO2023188670A1 (https=) 2023-10-05

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