DE112022006855T5 - Halbleitereinrichtung - Google Patents

Halbleitereinrichtung Download PDF

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Publication number
DE112022006855T5
DE112022006855T5 DE112022006855.8T DE112022006855T DE112022006855T5 DE 112022006855 T5 DE112022006855 T5 DE 112022006855T5 DE 112022006855 T DE112022006855 T DE 112022006855T DE 112022006855 T5 DE112022006855 T5 DE 112022006855T5
Authority
DE
Germany
Prior art keywords
pattern
semiconductor device
wire
insulating substrate
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112022006855.8T
Other languages
German (de)
English (en)
Inventor
Kazutake Kadowaki
Hiroki Shiota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE112022006855T5 publication Critical patent/DE112022006855T5/de
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/60—Arrangements for protection of devices protecting against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings

Landscapes

  • Wire Bonding (AREA)
DE112022006855.8T 2022-03-17 2022-03-17 Halbleitereinrichtung Pending DE112022006855T5 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/012189 WO2023175823A1 (ja) 2022-03-17 2022-03-17 半導体装置

Publications (1)

Publication Number Publication Date
DE112022006855T5 true DE112022006855T5 (de) 2025-02-13

Family

ID=88022551

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112022006855.8T Pending DE112022006855T5 (de) 2022-03-17 2022-03-17 Halbleitereinrichtung

Country Status (3)

Country Link
JP (1) JP7672574B2 (https=)
DE (1) DE112022006855T5 (https=)
WO (1) WO2023175823A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003086763A (ja) 2001-09-12 2003-03-20 Toshiba Corp 半導体パワーモジュール及び電力変換器

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07212077A (ja) * 1994-01-24 1995-08-11 Sanyo Electric Co Ltd 混成集積回路装置
JP4682889B2 (ja) * 2006-03-23 2011-05-11 三菱マテリアル株式会社 パワーモジュール用基板およびパワーモジュール並びにパワーモジュール用基板の製造方法
JP5125241B2 (ja) * 2007-06-12 2013-01-23 三菱マテリアル株式会社 パワーモジュール用基板の製造方法
JP5071719B2 (ja) * 2008-02-18 2012-11-14 三菱電機株式会社 電力用半導体装置
JP2010010441A (ja) * 2008-06-27 2010-01-14 Murata Mfg Co Ltd 回路モジュールの製造方法および回路モジュール
WO2010014103A1 (en) 2008-07-31 2010-02-04 Skyworks Solutions, Inc. Semiconductor package with integrated interference shielding and method of manufacture therof
US8199518B1 (en) 2010-02-18 2012-06-12 Amkor Technology, Inc. Top feature package and method
JP2016063015A (ja) * 2014-09-17 2016-04-25 株式会社東芝 半導体装置
US9761537B2 (en) * 2014-09-30 2017-09-12 Skyworks Solutions, Inc. Shielded radio-frequency module having reduced area
CN106033755A (zh) 2015-03-17 2016-10-19 晟碟信息科技（上海）有限公司 具有电磁干扰屏蔽的半导体器件和基板带
EP3440698A4 (en) * 2016-04-01 2020-02-12 INTEL Corporation SEMICONDUCTOR HOUSING WITH STRUCTURES FOR SHIELDING ELECTROMAGNETIC INTERFERENCES
ES2864406T3 (es) 2018-07-02 2021-10-13 Hoeganaes Ab Publ Composiciones de alineación a base de hierro resistentes al desgaste que comprenden níquel
CN113228265B (zh) * 2019-07-03 2024-09-24 富士电机株式会社 半导体组件的电路构造
CN210575941U (zh) 2019-09-16 2020-05-19 柳州梓博科技有限公司 一种芯片及电子设备

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003086763A (ja) 2001-09-12 2003-03-20 Toshiba Corp 半導体パワーモジュール及び電力変換器

Also Published As

Publication number Publication date
JPWO2023175823A1 (https=) 2023-09-21
JP7672574B2 (ja) 2025-05-07
WO2023175823A1 (ja) 2023-09-21

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R012 Request for examination validly filed
R084 Declaration of willingness to licence
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0023120000

Ipc: H10W0070600000