JPWO2023175823A5 - - Google Patents

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Publication number
JPWO2023175823A5
JPWO2023175823A5 JP2024507337A JP2024507337A JPWO2023175823A5 JP WO2023175823 A5 JPWO2023175823 A5 JP WO2023175823A5 JP 2024507337 A JP2024507337 A JP 2024507337A JP 2024507337 A JP2024507337 A JP 2024507337A JP WO2023175823 A5 JPWO2023175823 A5 JP WO2023175823A5
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JP
Japan
Prior art keywords
pattern
semiconductor device
wire
insulating substrate
connection points
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JP2024507337A
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English (en)
Japanese (ja)
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JPWO2023175823A1 (https=
JP7672574B2 (ja
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Priority claimed from PCT/JP2022/012189 external-priority patent/WO2023175823A1/ja
Publication of JPWO2023175823A1 publication Critical patent/JPWO2023175823A1/ja
Publication of JPWO2023175823A5 publication Critical patent/JPWO2023175823A5/ja
Application granted granted Critical
Publication of JP7672574B2 publication Critical patent/JP7672574B2/ja
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JP2024507337A 2022-03-17 2022-03-17 半導体装置 Active JP7672574B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/012189 WO2023175823A1 (ja) 2022-03-17 2022-03-17 半導体装置

Publications (3)

Publication Number Publication Date
JPWO2023175823A1 JPWO2023175823A1 (https=) 2023-09-21
JPWO2023175823A5 true JPWO2023175823A5 (https=) 2024-05-13
JP7672574B2 JP7672574B2 (ja) 2025-05-07

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ID=88022551

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024507337A Active JP7672574B2 (ja) 2022-03-17 2022-03-17 半導体装置

Country Status (3)

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JP (1) JP7672574B2 (https=)
DE (1) DE112022006855T5 (https=)
WO (1) WO2023175823A1 (https=)

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07212077A (ja) * 1994-01-24 1995-08-11 Sanyo Electric Co Ltd 混成集積回路装置
JP2003086763A (ja) 2001-09-12 2003-03-20 Toshiba Corp 半導体パワーモジュール及び電力変換器
JP4682889B2 (ja) * 2006-03-23 2011-05-11 三菱マテリアル株式会社 パワーモジュール用基板およびパワーモジュール並びにパワーモジュール用基板の製造方法
JP5125241B2 (ja) * 2007-06-12 2013-01-23 三菱マテリアル株式会社 パワーモジュール用基板の製造方法
JP5071719B2 (ja) * 2008-02-18 2012-11-14 三菱電機株式会社 電力用半導体装置
JP2010010441A (ja) * 2008-06-27 2010-01-14 Murata Mfg Co Ltd 回路モジュールの製造方法および回路モジュール
WO2010014103A1 (en) 2008-07-31 2010-02-04 Skyworks Solutions, Inc. Semiconductor package with integrated interference shielding and method of manufacture therof
US8199518B1 (en) 2010-02-18 2012-06-12 Amkor Technology, Inc. Top feature package and method
JP2016063015A (ja) * 2014-09-17 2016-04-25 株式会社東芝 半導体装置
US9761537B2 (en) * 2014-09-30 2017-09-12 Skyworks Solutions, Inc. Shielded radio-frequency module having reduced area
CN106033755A (zh) 2015-03-17 2016-10-19 晟碟信息科技（上海）有限公司 具有电磁干扰屏蔽的半导体器件和基板带
EP3440698A4 (en) * 2016-04-01 2020-02-12 INTEL Corporation SEMICONDUCTOR HOUSING WITH STRUCTURES FOR SHIELDING ELECTROMAGNETIC INTERFERENCES
ES2864406T3 (es) 2018-07-02 2021-10-13 Hoeganaes Ab Publ Composiciones de alineación a base de hierro resistentes al desgaste que comprenden níquel
CN113228265B (zh) * 2019-07-03 2024-09-24 富士电机株式会社 半导体组件的电路构造
CN210575941U (zh) 2019-09-16 2020-05-19 柳州梓博科技有限公司 一种芯片及电子设备

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