JP2022188583A5 - - Google Patents

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Publication number
JP2022188583A5
JP2022188583A5 JP2021096735A JP2021096735A JP2022188583A5 JP 2022188583 A5 JP2022188583 A5 JP 2022188583A5 JP 2021096735 A JP2021096735 A JP 2021096735A JP 2021096735 A JP2021096735 A JP 2021096735A JP 2022188583 A5 JP2022188583 A5 JP 2022188583A5
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JP
Japan
Prior art keywords
copper plate
recesses
semiconductor device
plate
opening
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Application number
JP2021096735A
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English (en)
Japanese (ja)
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JP7652631B2 (ja
JP2022188583A (ja
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Priority to JP2021096735A priority Critical patent/JP7652631B2/ja
Priority claimed from JP2021096735A external-priority patent/JP7652631B2/ja
Priority to PCT/JP2022/011601 priority patent/WO2022259676A1/ja
Priority to DE112022002069.5T priority patent/DE112022002069T5/de
Priority to CN202280040561.7A priority patent/CN117480599A/zh
Publication of JP2022188583A publication Critical patent/JP2022188583A/ja
Publication of JP2022188583A5 publication Critical patent/JP2022188583A5/ja
Application granted granted Critical
Publication of JP7652631B2 publication Critical patent/JP7652631B2/ja
Active legal-status Critical Current
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JP2021096735A 2021-06-09 2021-06-09 半導体装置用基板 Active JP7652631B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2021096735A JP7652631B2 (ja) 2021-06-09 2021-06-09 半導体装置用基板
PCT/JP2022/011601 WO2022259676A1 (ja) 2021-06-09 2022-03-15 半導体装置用基板
DE112022002069.5T DE112022002069T5 (de) 2021-06-09 2022-03-15 Substrat für Halbleitervorrichtung
CN202280040561.7A CN117480599A (zh) 2021-06-09 2022-03-15 半导体装置用基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021096735A JP7652631B2 (ja) 2021-06-09 2021-06-09 半導体装置用基板

Publications (3)

Publication Number Publication Date
JP2022188583A JP2022188583A (ja) 2022-12-21
JP2022188583A5 true JP2022188583A5 (https=) 2023-12-11
JP7652631B2 JP7652631B2 (ja) 2025-03-27

Family

ID=84425824

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021096735A Active JP7652631B2 (ja) 2021-06-09 2021-06-09 半導体装置用基板

Country Status (4)

Country Link
JP (1) JP7652631B2 (https=)
CN (1) CN117480599A (https=)
DE (1) DE112022002069T5 (https=)
WO (1) WO2022259676A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10332695A1 (de) * 2003-07-18 2005-02-03 Robert Bosch Gmbh Anordnung zur Befestigung eines Bauelements
JP5056325B2 (ja) * 2007-10-04 2012-10-24 富士電機株式会社 半導体装置の製造方法および半田ペースト塗布用のメタルマスク
DE112019001086T5 (de) * 2018-03-01 2020-11-12 Fuji Electric Co., Ltd. Halbleitervorrichtung

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