JPWO2020089762A5 - - Google Patents
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- Publication number
- JPWO2020089762A5 JPWO2020089762A5 JP2020554607A JP2020554607A JPWO2020089762A5 JP WO2020089762 A5 JPWO2020089762 A5 JP WO2020089762A5 JP 2020554607 A JP2020554607 A JP 2020554607A JP 2020554607 A JP2020554607 A JP 2020554607A JP WO2020089762 A5 JPWO2020089762 A5 JP WO2020089762A5
- Authority
- JP
- Japan
- Prior art keywords
- region
- layer
- insulating layer
- insulating
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004065 semiconductor Substances 0.000 claims 14
- 229910044991 metal oxide Inorganic materials 0.000 claims 6
- 150000004706 metal oxides Chemical class 0.000 claims 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 2
- 229910052739 hydrogen Inorganic materials 0.000 claims 2
- 239000001257 hydrogen Substances 0.000 claims 2
- 150000004767 nitrides Chemical class 0.000 claims 2
- 239000011800 void material Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024106823A JP2024153637A (ja) | 2018-11-02 | 2024-07-02 | 半導体装置 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018207250 | 2018-11-02 | ||
| PCT/IB2019/059207 WO2020089762A1 (ja) | 2018-11-02 | 2019-10-28 | 半導体装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024106823A Division JP2024153637A (ja) | 2018-11-02 | 2024-07-02 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2020089762A1 JPWO2020089762A1 (https=) | 2020-05-07 |
| JPWO2020089762A5 true JPWO2020089762A5 (https=) | 2022-10-31 |
Family
ID=70463997
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020554607A Withdrawn JPWO2020089762A1 (https=) | 2018-11-02 | 2019-10-28 | |
| JP2024106823A Pending JP2024153637A (ja) | 2018-11-02 | 2024-07-02 | 半導体装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024106823A Pending JP2024153637A (ja) | 2018-11-02 | 2024-07-02 | 半導体装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US12100747B2 (https=) |
| JP (2) | JPWO2020089762A1 (https=) |
| WO (1) | WO2020089762A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102764319B1 (ko) * | 2020-09-02 | 2025-02-07 | 삼성전자주식회사 | 반도체 소자 및 이를 포함하는 반도체 장치 |
| CN115769293A (zh) * | 2021-06-25 | 2023-03-07 | 京东方科技集团股份有限公司 | 驱动基板、发光装置及其制备方法、拼接显示装置 |
| KR20230097544A (ko) | 2021-12-24 | 2023-07-03 | 엘지디스플레이 주식회사 | 표시 장치 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7019457B2 (en) | 2000-08-03 | 2006-03-28 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device having both electrodes formed on the insulating layer |
| US7339187B2 (en) | 2002-05-21 | 2008-03-04 | State Of Oregon Acting By And Through The Oregon State Board Of Higher Education On Behalf Of Oregon State University | Transistor structures |
| US20040229051A1 (en) | 2003-05-15 | 2004-11-18 | General Electric Company | Multilayer coating package on flexible substrates for electro-optical devices |
| KR101221951B1 (ko) | 2005-12-28 | 2013-01-15 | 엘지디스플레이 주식회사 | 액정표시장치용 어레이 기판 및 그 제조방법 |
| WO2011132591A1 (en) | 2010-04-23 | 2011-10-27 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| JP2012015436A (ja) | 2010-07-05 | 2012-01-19 | Sony Corp | 薄膜トランジスタおよび表示装置 |
| JP5668917B2 (ja) | 2010-11-05 | 2015-02-12 | ソニー株式会社 | 薄膜トランジスタおよびその製造方法 |
| US8569754B2 (en) | 2010-11-05 | 2013-10-29 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| JP6104522B2 (ja) | 2011-06-10 | 2017-03-29 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US8772130B2 (en) | 2011-08-23 | 2014-07-08 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of SOI substrate |
| US8748240B2 (en) | 2011-12-22 | 2014-06-10 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| US8956912B2 (en) | 2012-01-26 | 2015-02-17 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| US8916424B2 (en) | 2012-02-07 | 2014-12-23 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| JP5946318B2 (ja) * | 2012-05-02 | 2016-07-06 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| CN107591316B (zh) | 2012-05-31 | 2021-06-08 | 株式会社半导体能源研究所 | 半导体装置 |
| JP6112886B2 (ja) * | 2013-02-01 | 2017-04-12 | 三菱電機株式会社 | 薄膜トランジスタアレイ基板およびその製造方法 |
| JP6345023B2 (ja) * | 2013-08-07 | 2018-06-20 | 株式会社半導体エネルギー研究所 | 半導体装置およびその作製方法 |
| US9443876B2 (en) | 2014-02-05 | 2016-09-13 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, display device including the semiconductor device, display module including the display device, and electronic device including the semiconductor device, the display device, and the display module |
| US10361290B2 (en) | 2014-03-14 | 2019-07-23 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device comprising adding oxygen to buffer film and insulating film |
| CN106409919A (zh) * | 2015-07-30 | 2017-02-15 | 株式会社半导体能源研究所 | 半导体装置以及包括该半导体装置的显示装置 |
| JPWO2017085591A1 (ja) * | 2015-11-20 | 2018-09-06 | 株式会社半導体エネルギー研究所 | 半導体装置、該半導体装置を有する表示装置、及び該半導体装置を有する電子機器 |
| US9954058B1 (en) * | 2017-06-12 | 2018-04-24 | International Business Machines Corporation | Self-aligned air gap spacer for nanosheet CMOS devices |
-
2019
- 2019-10-28 WO PCT/IB2019/059207 patent/WO2020089762A1/ja not_active Ceased
- 2019-10-28 US US17/286,530 patent/US12100747B2/en active Active
- 2019-10-28 JP JP2020554607A patent/JPWO2020089762A1/ja not_active Withdrawn
-
2024
- 2024-07-02 JP JP2024106823A patent/JP2024153637A/ja active Pending
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