JP7652631B2 - 半導体装置用基板 - Google Patents

半導体装置用基板 Download PDF

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Publication number
JP7652631B2
JP7652631B2 JP2021096735A JP2021096735A JP7652631B2 JP 7652631 B2 JP7652631 B2 JP 7652631B2 JP 2021096735 A JP2021096735 A JP 2021096735A JP 2021096735 A JP2021096735 A JP 2021096735A JP 7652631 B2 JP7652631 B2 JP 7652631B2
Authority
JP
Japan
Prior art keywords
copper plate
semiconductor device
substrate
recess
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021096735A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022188583A5 (https=
JP2022188583A (ja
Inventor
智生 高井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
NGK Electronics Devices Inc
Original Assignee
NGK Insulators Ltd
NGK Electronics Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd, NGK Electronics Devices Inc filed Critical NGK Insulators Ltd
Priority to JP2021096735A priority Critical patent/JP7652631B2/ja
Priority to PCT/JP2022/011601 priority patent/WO2022259676A1/ja
Priority to DE112022002069.5T priority patent/DE112022002069T5/de
Priority to CN202280040561.7A priority patent/CN117480599A/zh
Publication of JP2022188583A publication Critical patent/JP2022188583A/ja
Publication of JP2022188583A5 publication Critical patent/JP2022188583A5/ja
Application granted granted Critical
Publication of JP7652631B2 publication Critical patent/JP7652631B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/652—Cross-sectional shapes
    • H10W70/6525—Cross-sectional shapes for securing the interconnections to the substrate, e.g. to prevent peeling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/80—Arrangements for protection of devices protecting against overcurrent or overload, e.g. fuses or shunts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/658—Shapes or dispositions of interconnections for devices provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2021096735A 2021-06-09 2021-06-09 半導体装置用基板 Active JP7652631B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2021096735A JP7652631B2 (ja) 2021-06-09 2021-06-09 半導体装置用基板
PCT/JP2022/011601 WO2022259676A1 (ja) 2021-06-09 2022-03-15 半導体装置用基板
DE112022002069.5T DE112022002069T5 (de) 2021-06-09 2022-03-15 Substrat für Halbleitervorrichtung
CN202280040561.7A CN117480599A (zh) 2021-06-09 2022-03-15 半导体装置用基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021096735A JP7652631B2 (ja) 2021-06-09 2021-06-09 半導体装置用基板

Publications (3)

Publication Number Publication Date
JP2022188583A JP2022188583A (ja) 2022-12-21
JP2022188583A5 JP2022188583A5 (https=) 2023-12-11
JP7652631B2 true JP7652631B2 (ja) 2025-03-27

Family

ID=84425824

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021096735A Active JP7652631B2 (ja) 2021-06-09 2021-06-09 半導体装置用基板

Country Status (4)

Country Link
JP (1) JP7652631B2 (https=)
CN (1) CN117480599A (https=)
DE (1) DE112022002069T5 (https=)
WO (1) WO2022259676A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10332695A1 (de) 2003-07-18 2005-02-03 Robert Bosch Gmbh Anordnung zur Befestigung eines Bauelements
JP2009094135A (ja) 2007-10-04 2009-04-30 Fuji Electric Device Technology Co Ltd 半導体装置、半導体装置の製造方法、および半田ペースト塗布用のメタルマスク
WO2019167509A1 (ja) 2018-03-01 2019-09-06 富士電機株式会社 半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10332695A1 (de) 2003-07-18 2005-02-03 Robert Bosch Gmbh Anordnung zur Befestigung eines Bauelements
JP2009094135A (ja) 2007-10-04 2009-04-30 Fuji Electric Device Technology Co Ltd 半導体装置、半導体装置の製造方法、および半田ペースト塗布用のメタルマスク
WO2019167509A1 (ja) 2018-03-01 2019-09-06 富士電機株式会社 半導体装置

Also Published As

Publication number Publication date
DE112022002069T5 (de) 2024-01-25
WO2022259676A1 (ja) 2022-12-15
CN117480599A (zh) 2024-01-30
JP2022188583A (ja) 2022-12-21

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