CN117480599A - 半导体装置用基板 - Google Patents

半导体装置用基板 Download PDF

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Publication number
CN117480599A
CN117480599A CN202280040561.7A CN202280040561A CN117480599A CN 117480599 A CN117480599 A CN 117480599A CN 202280040561 A CN202280040561 A CN 202280040561A CN 117480599 A CN117480599 A CN 117480599A
Authority
CN
China
Prior art keywords
copper plate
semiconductor device
recess
plate
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280040561.7A
Other languages
English (en)
Chinese (zh)
Inventor
高井智生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
NGK Electronics Devices Inc
Original Assignee
NGK Insulators Ltd
NGK Electronics Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd, NGK Electronics Devices Inc filed Critical NGK Insulators Ltd
Publication of CN117480599A publication Critical patent/CN117480599A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/652—Cross-sectional shapes
    • H10W70/6525—Cross-sectional shapes for securing the interconnections to the substrate, e.g. to prevent peeling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/80—Arrangements for protection of devices protecting against overcurrent or overload, e.g. fuses or shunts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/658—Shapes or dispositions of interconnections for devices provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN202280040561.7A 2021-06-09 2022-03-15 半导体装置用基板 Pending CN117480599A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021096735A JP7652631B2 (ja) 2021-06-09 2021-06-09 半導体装置用基板
JP2021-096735 2021-06-09
PCT/JP2022/011601 WO2022259676A1 (ja) 2021-06-09 2022-03-15 半導体装置用基板

Publications (1)

Publication Number Publication Date
CN117480599A true CN117480599A (zh) 2024-01-30

Family

ID=84425824

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280040561.7A Pending CN117480599A (zh) 2021-06-09 2022-03-15 半导体装置用基板

Country Status (4)

Country Link
JP (1) JP7652631B2 (https=)
CN (1) CN117480599A (https=)
DE (1) DE112022002069T5 (https=)
WO (1) WO2022259676A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10332695A1 (de) 2003-07-18 2005-02-03 Robert Bosch Gmbh Anordnung zur Befestigung eines Bauelements
JP5056325B2 (ja) 2007-10-04 2012-10-24 富士電機株式会社 半導体装置の製造方法および半田ペースト塗布用のメタルマスク
WO2019167509A1 (ja) 2018-03-01 2019-09-06 富士電機株式会社 半導体装置

Also Published As

Publication number Publication date
JP2022188583A (ja) 2022-12-21
WO2022259676A1 (ja) 2022-12-15
DE112022002069T5 (de) 2024-01-25
JP7652631B2 (ja) 2025-03-27

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