JP2013197560A - パワー半導体モジュール - Google Patents
パワー半導体モジュール Download PDFInfo
- Publication number
- JP2013197560A JP2013197560A JP2012066501A JP2012066501A JP2013197560A JP 2013197560 A JP2013197560 A JP 2013197560A JP 2012066501 A JP2012066501 A JP 2012066501A JP 2012066501 A JP2012066501 A JP 2012066501A JP 2013197560 A JP2013197560 A JP 2013197560A
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- Prior art keywords
- power semiconductor
- semiconductor module
- insulating substrate
- metal foil
- lead
- Prior art date
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Abstract
【解決手段】両側に金属箔を固着させた絶縁基板の一方の金属箔に半導体チップ1の一方の電極をはんだ接合し、絶縁基板3上の他方の金属箔を放熱ベース9にはんだ接合したパワー半導体モジュールにおいて、半導体チップ1の他方の電極に熱拡散金属板14を接合し、熱拡散金属板14にリード15の一端を接合し、リード15の他端を絶縁基板3上の金属箔に接合し、リード15の熱拡散金属板14との接合部およびリード15の絶縁基板3上の金属箔との接合部を他の部分よりも薄くする。
【選択図】 図1
Description
2 第1のはんだ
3 絶縁基板
4〜6 配線パターン
7 金属箔
8 第2のはんだ
9 放熱ベース板
10 アルミワイヤ
11 ケース
12 封止材
13 第3のはんだ
14 熱拡散金属板
15 リード
Claims (15)
- 両側に金属箔を固着させた絶縁基板の一方の金属箔に半導体チップの一方の電極を接合し、前記絶縁基板上の他方の金属箔を放熱ベースに接合したパワー半導体モジュールにおいて、
前記半導体チップの他方の電極に金属板を接合し、前記金属板に導電リードの一端を接合し、前記導電リードの他端を絶縁基板上の金属箔に接合し、前記導電リードの前記金属板との接合部および前記導電リードの前記絶縁基板上の金属箔との接合部を他の部分よりも薄くしたことを特徴とするパワー半導体モジュール。 - 請求項1記載のパワー半導体モジュールにおいて、
前記金属板と前記導電リードとの接合、並びに前記絶縁基板上の前記金属箔と前記導電リードとの接合が、超音波接合により行われることを特徴とするパワー半導体モジュール。 - 請求項1記載のパワー半導体モジュールにおいて、
前記金属板と前記導電リードとの接合、並びに前記絶縁基板上の前記金属箔と前記導電リードとの接合が、はんだ接合により行われることを特徴とするパワー半導体モジュール。 - 両側に金属箔を固着させた絶縁基板の一方の金属箔に半導体チップの一方の電極を接合し、前記絶縁基板上の他方の金属箔を放熱ベースに接合したパワー半導体モジュールにおいて、
前記半導体チップの他方の電極に金属板と導電リードが一体化したリード付金属板を接合し、前記リード付金属板の他端を絶縁基板上の金属箔に接合し、前記リード付金属板と前記絶縁基板上の金属箔との接合部を前記リード付金属板の他の部分よりも薄くしたことを特徴とするパワー半導体モジュール。 - 請求項4記載のパワー半導体モジュールにおいて、前記リード付金属板は、前記半導体チップの前記他方の電極とはんだ接合され、前記絶縁基板上の前記金属箔と超音波接合されることを特徴とするパワー半導体モジュール。
- 請求項4記載のパワー半導体モジュールにおいて、前記リード付金属板は、前記半導体チップの前記他方の電極および前記絶縁基板上の前記金属箔と、それぞれはんだ接合されることを特徴とするパワー半導体モジュール。
- 両側に金属箔を固着させた絶縁基板の一方の金属箔に半導体チップの一方の電極を接合し、前記絶縁基板上の他方の金属箔を放熱ベースに接合したパワー半導体モジュールにおいて、
前記半導体チップの他方の電極に導電リードの一端を接合し、前記導電リードの他端を絶縁基板上の金属箔に接合し、前記導電リードの前記半導体チップとの接合部および前記導電リードの絶縁基板上の金属箔との接合部を他の部分よりも薄くしたことを特徴とするパワー半導体モジュール。 - 請求項7記載のパワー半導体モジュールにおいて、
前記半導体チップの前記他方の電極に前記導電リードの前記一端が超音波接合され、前記導電リードの前記他端が前記絶縁基板上の前記金属箔に超音波接合されることを特徴とするパワー半導体モジュール。 - 請求項7記載のパワー半導体モジュールにおいて、
前記半導体チップの前記他方の電極に前記導電リードの前記一端がはんだ接合され、前記導電リードの前記他端が前記絶縁基板上の前記金属箔にはんだ接合されることを特徴とするパワー半導体モジュール。 - 請求項1乃至3記載のパワー半導体モジュールにおいて、前記導電リードの中央部分の他よりも厚い部分の内部に中空部を設け、前記中空部に作動流体を封入してヒートパイプを構成したことを特徴とするパワー半導体モジュール。
- 請求項4乃至6記載のパワー半導体モジュールにおいて、前記リード付金属板の金属板部分および導電リードの中央部分の内部に中空部を設け、前記中空部に作動流体を封入してヒートパイプを構成したことを特徴とするパワー半導体モジュール。
- 請求項6記載のパワー半導体モジュールにおいて、前記リード付金属板の金属板部分、リードの中央部分および基板との取付部分に跨ってリード付金属板の内部に中空部を設け、前記中空部に作動流体を封入してヒートパイプを構成したことを特徴とするパワー半導体モジュール。
- 請求項7乃至9記載のパワー半導体モジュールにおいて、前記導体リードの中央部分の他よりも厚い部分の内部に中空部を設け、前記中空部に作動流体を封入してヒートパイプを構成したことを特徴とするパワー半導体モジュール。
- 両側に金属箔を固着させた絶縁基板の一方の金属箔に半導体チップの一方の電極を接合し、前記絶縁基板上の他方の金属箔を放熱ベースに接合したパワー半導体モジュールにおいて、
前記半導体チップの他方の電極に導電リードの一端を接合し、前記導電リードの他端を絶縁基板上の金属箔に接合し、前記リード付金属板の金属板部分、リードの中央部分および基板との取付部分に跨ってリード付金属板の内部に中空部を設け、前記中空部に作動流体を封入してヒートパイプを構成したことを特徴とするパワー半導体モジュール。 - 両側に金属箔を固着させた絶縁基板の一方の金属箔に半導体チップの一方の電極をはんだ接合し、前記絶縁基板上の他方の金属箔を放熱ベースにはんだ接合したパワー半導体モジュールにおいて、
前記半導体チップの他方の電極に金属板をはんだ接合し、前記金属板に導電ワイヤを接続し、前記導電ワイヤの他端を絶縁基板上の金属箔に接続し、前記金属板は銅、モリブデン、タングステン、銅−インバー−銅複合材のいずれかから成り、前記金属板のワイヤ側の表面に、銅、ニッケル、銀、アルミニウムのいずれかを膜状に形成したことを特徴とするパワー半導体モジュール。
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