JP2018528609A - コンポーネントモジュールおよびパワーモジュール - Google Patents

コンポーネントモジュールおよびパワーモジュール Download PDF

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JP2018528609A
JP2018528609A JP2018504906A JP2018504906A JP2018528609A JP 2018528609 A JP2018528609 A JP 2018528609A JP 2018504906 A JP2018504906 A JP 2018504906A JP 2018504906 A JP2018504906 A JP 2018504906A JP 2018528609 A JP2018528609 A JP 2018528609A
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component
component module
open
cooling
contact
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JP6596570B2 (ja
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シュテグマイアー、シュテファン
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Siemens AG
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Siemens AG
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Abstract

コンポーネントモジュールは、少なくとも１つの接触部を備えたコンポーネントを含み、この少なくとも１つの接触部に開気孔接触片が結合され、コンポーネントモジュールが冷却流体による冷却のための冷却システムを有し、この構造が開気孔接触片の孔により形成された１つまたは多数の冷却チャネルを含む。パワーモジュールはこのようなコンポーネントモジュールを含む。
【選択図】図１

Description

本発明は、コンポーネントモジュールおよびパワーモジュールに関する。
電子機器、特にパワー電子機器においては半導体デバイス、特にＩＧＢＴ、ダイオード、ＭＯＳＦＥＴなどにおける電流のスイッチングや導通は損失電力を生じる。このような損失電力は、半導体デバイスを加熱させずに効率的な運転を保証するように、冷却器により吸収しなければならない。パワーデバイスの下側を空洞の無いろう付け、拡散ろう付けまたは焼結により基板（ＤＣＢ、ＡＭＢなど）上に取り付け、基板を平面状に冷却器に結合することが知られている。しかし冷却は効果的でないことが多い。その結果生じるこのようなパワーデバイスの加熱は通常はパワーデバイスの故障率の増大並びに熱劣化による早期の故障の原因となる。上側ではパワーデバイスの冷却は特に困難であることが多い。なぜならワイヤボンディングまたはリボンボンディング技術を使用するために電気絶縁用の熱エネルギー放出を妨げる材料が鋳込まれるからである。
それゆえ本発明の課題は、デバイスの冷却を改良したコンポーネントモジュールおよびパワーモジュールを提供することにある。
この本発明の課題は、請求項１に記載の特徴を有するコンポーネントモジュール並びに請求項９に記載の特徴を有するパワーモジュールにより解決される。本発明の有利な発展形態は従属請求項、以下の説明および図面により明らかにされる。
本発明によるコンポーネントモジュールは少なくとも１つの電気接触部を備えたコンポーネントを有する。本発明によるコンポーネントモジュールではこの少なくとも１つの接触部に少なくとも１つの開気孔接触片が電気接触のために結合される。本発明によるコンポーネントモジュールはさらにコンポーネントを冷却流体で冷却するための冷却システムを有する。この冷却システムは開気孔接触片の孔により形成される１つまたは多数の冷却チャネルを含む。
この場合本発明によれば、開気孔接触片はしたがって電気接触のためだけでなく、この接触片は冷却流体との熱接触も可能にする。このようにして熱放出は直接コンポーネントで行われるので、熱放出は特に効果的になる。特に熱放出は多数の層の上で行われる必要はないので、これらの層の熱伝導率は可能な熱放出を制限しない。むしろ冷却流体による熱放出は本発明によるコンポーネントモジュールではコンポーネントへの空間的に任意の近さで行われる。効率的な熱放出によりコンポーネントモジュールの非故障率並びに場合によって用いられる絶縁材料の耐性は明らかに高められる。
本発明によるコンポーネントモジュールでは、接触片は電気的におよび／または焼結によりおよび／またはろう付けによりおよび／または拡散ろう付けによりおよび／またはプレスによりおよび／または締め付けによりおよび／または接着によりコンポーネントの少なくとも１つの接触部に結合されると合目的的である。上述の方法により同時に特に良好な電気接触並びに熱放出のための特に良好な熱接触が本発明によるコンポーネントモジュールの接触片により保証される。まさに集積回路の場合には効率的な熱放出は特に使用上重要である。まさに本発明のこのような発展例ではしたがって本発明により可能となる効率的な熱放出は特に有利である。本発明によるコンポーネントモジュールの合目的的な発展例では、このモジュールは少なくとも２つまたは多数のコンポーネントを有し、これらはそれぞれ開気孔接触片により１つの共通のプリント基板に結合される。本発明のこの発展例では熱は局所的に各コンポーネントで直接放出されるので、コンポーネントモジュールの非故障率は著しく高められる。
本発明によるコンポーネントモジュールでは、少なくとも１つの開気孔接触片は金属、特にニッケルおよび／または銀および／または金および／または錫および／または銅から成るかまたは備え、好適には発泡金属、特に銅発泡体として形成されるのが好適である。本発明によるコンポーネントモジュールのこの発展例では、開気孔接触片は電気接触片として特に簡単に導電的に形成される。同時に上述の材料は開気孔の形成物を可能にする。
本発明によるコンポーネントモジュールでは、少なくとも１つの接触片は織物状および／または発泡状および／または網状構造を備え、特に金属網として形成された構造で形成される。代替的にまたは付加的に開気孔接触片はリードフレームの積層体で形成することができる。この発展例では接触片の開気孔が容易に保証される。
“開気孔”とは本出願の意味においては、接触片の孔が接触片の表面に、外側から流体たとえば冷却流体を接触片に侵入させることのできる入口を形成するものと解釈されると合目的的である。接触片の開気孔材料はさらにオープンセル構造を有するものとし、これを通って冷却流体が効率的に通過でき、好適には冷却流体が接触片を貫流するようにすると理想的である。
本発明によるコンポーネントモジュールでは、本発明により設けられた開気孔接触片がその孔を通して冷却流体、特に冷却液を導くのに特に適しているようにすると合目的的である。
本発明によるコンポーネントモジュールでは、冷却システムはヒートパイプを含むのが理想的である。ヒートパイプにより特に効率的な冷却循環路が実現される。
本発明によるパワーモジュールは上述のような本発明によるコンポーネントモジュールを１つ含む。本発明によるパワーモジュールでは少なくとも１つのコンポーネントがパワーコンポーネントであると有利である。まさにパワーモジュールでは効率的な熱放出の問題が増大する。なぜならここでは特に大きなエネルギー量が熱エネルギーに変換されるからである。本発明によるパワーモジュールでは、したがって本発明によるコンポーネントモジュールで可能な効率的な熱放出が大きな利点となる。
以下に本発明を図面に示した実施例に基づき詳細に説明する。
図１はコンポーネントモジュールの開気孔接触片により実現された冷却システムを備えた本発明によるコンポーネントモジュールを備えた本発明によるパワーモジュールの第１の実施例の概略縦断面図を示す。 図２はコンポーネントモジュールの開気孔接触片により形成されたヒートパイプを備えた本発明によるコンポーネントモジュールを備えた本発明によるパワーモジュールの第２の実施例の概略縦断面図を示す。 図３は図１、２による実施例の開気孔接触片の結合部の詳細を示す原理スケッチ縦断面図を示す。
図１に示したパワーコンポーネント１０は絶縁ゲート電極を備えたバイポーラトランジスタ（英語：”Insulated-Gate Bipolar Transistor”: IGBT）であり、第１の平坦面２０と第２の平坦面３０を有しており、これらの面は互いに反対側を向いている。第１の平坦面２０と第２の平坦面３０に沿ってパワーコンポーネント１０の薄層状の平面状接触部４０、５０が延びており、これらは平面状のチップメタライジングとして形成されている。図示の実施例ではパワーコンポーネントの図１の上側に配置された平面状接触部４０が銅から成るのに対し、パワーコンポーネントの下側に配置された平面状接触部５０は銀から成る。原理的には上側の平面状接触部４０も銀から成るかこれを備えるまたはＡｌＳｉＣｕ、その他の金属または他の導電材料から成るかこれらを備えることができるのに対し、下側の平面状接触部５０も金および／または他の金属または他の導電材料から成るかこれらを備えることができる。
これらの平面状接触部４０、５０の接触化のために平面状接触部４０、５０に当接して開気孔材料の接触片６０、７０が設置され、これらの接触片はほぼ平面状接触部４０、５０に沿って延びている。図示の実施例では接触片６０、７０は導電性に形成され、銅発泡体として実現されている。当然ながら、他のことさら示していない実施例では図面により説明する実施例にほぼ相当はするが開気孔接触片６０、７０は他の開気孔導電性材料から成ることができる、たとえば織物または網状またはその他の多孔性構造から形成されたアルミニウムまたはチタン接触片またはその他の金属からまたはそれと共に形成された接触片である。たとえば導電性材料で部分的に成層されたまたは導電性粒子で置き換えられたポリマー発泡体も接触片として用いることができる。他の実施例では図示の実施例に他の点では相当するが、開気孔接触片はリードフレームの積層体で形成することができる。
パワーコンポーネント１０の一方の平面状接触部５０は、窒化アルミニウム（ＡｌＮ）から成るセラミックコア１００を備えたセラミック基板９０のもう一つの平面状接触部８０に対向している。原理的にはセラミックコア１００は他のことさら示していない実施例では別の材料、たとえば別のセラミック材料またはポリマー、たとえばＰＣＢまたはＦＲ４から成ることもできる。セラミック基板９０のもう一つの平面状接触部８０は表面が基板メタライジング、図示の実施例では銅基板メタライジングとして形成される。セラミック基板９０に対向するパワーコンポーネント１０の平面状接触部５０およびセラミック基板９０のもう１つの平面状接触部８０は互いに平行に延び、この場合空隙を形成する。セラミック基板９０に対向する平面状接触部５０に配置された接触片７０はこの平坦な空隙を完全に満たし、全面でパワーコンポーネント１０のこの平面状接触部５０並びにセラミック基板９０のもう１つの平面状接触部８０に当接する。接触片７０はしたがってパワーコンポーネント１０およびセラミック基板９０の接触化のために配置されているものである。
開気孔接触片６０、７０は電気的にそれぞれの基板メタライジングまたはチップメタライジングに接触しているので、一連の導電性金属による接触のために各平面状接触部４０、５０、８０間の導電接続が作られる。
平面状接触部４０、５０、８０は互いにおよび場合によってはその周囲にある他の電気的ポテンシャルから、平面状接触部４０、５０、８０が接触片６０、７０と当接していない表面領域において電気絶縁材料、ここに記載の実施例では合成材料で覆われる（図面には詳細には示していない）ことにより、電気的に絶縁される。
開気孔接触片６０、７０のめっき結合により金属、図示の実施例では銅が開気孔接触片６０、７０と平面状接触部４０、５０、８０の間の領域に析出される（図３）。図示の実施例では析出材料により層が形成され、これらの層は面状にチップメタライジングまたはセラミック基板メタライジング並びに接触片６０、７０に沿って延びている。この析出によりそれぞれ開気孔接触片６０、７０はパワーコンポーネントに接続される。全接触片６０、７０は同時に各平面状接触部４０、５０、８０に接続され、これらにそれぞれ当接する。他のことさら示していない実施例では図面により説明する実施例にほぼ相当はするが、接触片はめっき結合されずに、焼結またはろう付けまたは拡散ろう付けまたはプレスまたは締め付けまたは接着により結合される。
セラミック基板９０および接触化されたパワーコンポーネント１０により形成されたパワーモジュールはパワーモジュールの冷却システムの流体流路１７０に配置される（図１）。パワーモジュールの冷却システムは冷却流体をＲ方向に流体流路を通って導くように形成される。図示の実施例では流体流路１７０は空気流路である。他のことさら示していない実施例では図面により説明する実施例にほぼ相当はするが、別の流体流、たとえば冷却ガス流または冷却液体流、たとえば冷却水流が冷却用に使用される。冷却流体は流体流路１７０内で開気孔接触片７０を通過し、接触片７０の開気孔材料が冷却チャネルを形成するようにできる。当然ながら他のことさら示していない実施例では冷却流体は必ずしも付加的に使用される流れ材料により積極的に流される必要はない。むしろ流体流はある程度既に自動的に熱対流により形成することもできる。
図２に示した別の実施例は図１に示した実施例にほぼ相当するが、冷却循環路の空気流の代わりにヒートパイプ１８０が設けられている。ヒートパイプ１８０はパワーコンポーネント１０とセラミック基板９０の間に配置された接触片７０により形成される。ヒートパイプ１８０は開気孔接触片７０により形成される。開気孔材料はヒートパイプ１８０の内部を形成する。接触片７０の材料の開気孔により冷却流体はヒートパイプ１８０を通流できる。ヒートパイプ１８０はこのため液密のハウジング１８２を有する。このハウジング１８２は、たとえばめっきまたは蒸着またはろう付けにより外周に取り付けられるので、冷却流体は損失無くヒートパイプ１８０の間を案内される。
ヒートパイプ１８０はこの場合それ自体は公知のように冷却液のための循環路を形成し、蒸発および凝縮により熱がこれにより吸収または放出される。このためヒートパイプ１８０はパワーコンポーネント１０から遠い端部で冷却体１８５に結合されるので、冷却液はヒートパイプ１８０のこの遠い端部で凝縮する。
１０ パワーコンポーネント
２０ 平坦面
３０ 平坦面
４０ 平面状接触部
５０ 平面状接触部
６０ 開気孔接触片
７０ 開気孔接触片
８０ 平面状接触部
９０ セラミック基板
１００ セラミックコア
１７０ 流体流路
１８０ ヒートパイプ
１８２ ハウジング
１８５ 冷却体

Claims (10)

  1. 少なくとも１つの電気接触部（４０、５０）を有するコンポーネント（１０）を備えたコンポーネントモジュールであって、
    前記少なくとも１つの接触部（４０、５０）に開気孔接触片（６０、７０）が結合されるコンポーネントモジュールが冷却流体による冷却のための冷却システムを有し、
    前記冷却システムが前記開気孔接触片（６０、７０）の孔により形成された１つまたは複数の冷却チャネルを含むコンポーネントモジュール。
  2. 前記開気孔接触片（６０、７０）が、めっきによりおよび／または焼結によりおよびろう付けによりおよび／または拡散ろう付けおよび／またはプレスおよび／または締め付けおよび／または接着により結合される請求項１記載のコンポーネントモジュール。
  3. 少なくとも１つの集積回路を有し、
    前記開気孔接触片（６０、７０）が前記少なくとも１つの集積回路に結合される請求項１または２記載のコンポーネントモジュール。
  4. プリント基板（９０）が少なくとも２つのコンポーネントを有し、
    前記コンポーネントがそれぞれ開気孔接触片により共通に前記プリント基板（９０）に結合される請求項１から３のいずれか１項に記載のコンポーネントモジュール。
  5. 前記少なくとも１つの開気孔接触片（６０、７０）が金属、特にニッケルおよび／または銀および／または金および／または錫および／または銅、特に銅発泡体からまたはこれらを備えて形成される請求項１から４のいずれか１項に記載のコンポーネントモジュール。
  6. 前記少なくとも１つの開気孔接触片（６０、７０）が織物状および／または発泡体状および／または網状の構造または積層状のリードフレームにより形成される請求項１から５のいずれか１項に記載のコンポーネントモジュール。
  7. 前記冷却流体が水および／または他の冷却液で形成される請求項１から６のいずれか１項に記載のコンポーネントモジュール。
  8. 前記冷却システムがヒートパイプ（１８０）を含む請求項１から７のいずれか１項に記載のコンポーネントモジュール。
  9. 請求項１から８のいずれか１項に記載のコンポーネントモジュールを含むパワーモジュール。
  10. 前記少なくとも１つのコンポーネントがパワーコンポーネントであるパワーモジュール。
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