TWI593071B - 組件端子周邊內具有周邊凹部的引線框架 - Google Patents

組件端子周邊內具有周邊凹部的引線框架 Download PDF

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Publication number
TWI593071B
TWI593071B TW102135781A TW102135781A TWI593071B TW I593071 B TWI593071 B TW I593071B TW 102135781 A TW102135781 A TW 102135781A TW 102135781 A TW102135781 A TW 102135781A TW I593071 B TWI593071 B TW I593071B
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Taiwan
Prior art keywords
recess
perimeter
lead frame
terminal
component
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TW102135781A
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English (en)
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TW201428920A (zh
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朗道夫 克魯茲
洛伊德 米爾頓 小卡本特
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英特希爾美國公司
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Publication of TW201428920A publication Critical patent/TW201428920A/zh
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Description

組件端子周邊內具有周邊凹部的引線框架
本發明通常涉及封裝集成電路，尤其涉及封裝集成電路的引線框架。
傳統封裝電路中的引線框架具有平坦的邊緣。在某些封裝設計中，在回流事件期間焊料可在平坦邊緣與相鄰材料(比如，模具化合物或焊料掩膜材料)之間引出。洩漏的焊料可引起導電部分之間的無意耦合。
一個實施方案涉及一種製造裝置的方法。所述方法包括：在引線框架的內表面中蝕刻至少一個凹部圖案，所述至少一個凹部圖案包括限定安裝區域的周邊的周邊凹部。所述方法還包括將組件蝕刻至所述引線框架的內表面，使得所述組件的單個端子被附接在安裝區域中且所述單個端子覆蓋周邊凹部，其中所述周邊凹部具有使得凹部接近單個端子的周邊的尺寸和形狀。
100‧‧‧電路
102‧‧‧引線框架
103‧‧‧外表面
104‧‧‧端子
105‧‧‧內表面
106‧‧‧組件附接粘合劑
107‧‧‧端子
108‧‧‧周邊凹部
110‧‧‧阻焊劑
116‧‧‧組件
118‧‧‧焊線
122‧‧‧模制化合物
202‧‧‧安裝區域
204‧‧‧周邊
302‧‧‧引線框架
304‧‧‧非導電材料
308‧‧‧周邊凹部
502‧‧‧引線框架
504‧‧‧凸起表面
506‧‧‧十字凹部
508‧‧‧周邊凹部
510‧‧‧周邊
602‧‧‧框架
604‧‧‧表面
606‧‧‧凹部
608‧‧‧凹部
610‧‧‧周邊
702‧‧‧引線框架
706‧‧‧十字凹部
708‧‧‧周邊凹部
710‧‧‧周邊
802‧‧‧引線框架
804‧‧‧凸起表面
806‧‧‧十字凹部
808‧‧‧周邊凹部
900‧‧‧方法
902‧‧‧步驟
904‧‧‧步驟
905‧‧‧步驟
906‧‧‧步驟
908‧‧‧步驟
910‧‧‧步驟
912‧‧‧步驟
914‧‧‧步驟
916‧‧‧步驟
圖1A是在組件端子的周邊內具有周邊凹部的引線框架的封裝電路的 實施方案的剖面圖。
圖1B是圖1A的封裝電路的部分放大圖。
圖2是圖1A和圖1B的封裝電路的實施方案的平面圖。
圖3A是圖1A和圖1B中的封裝電路的引線框架的一部分的實施方案的放大剖面圖。
圖3B是圖1A和圖1B的封裝電路的引線框架的一部分的另一實施方案的放大剖面圖。
圖4A是在組件端子的周邊內具有周邊凹部的引線框架的實施方案的俯視圖。
圖4B是圖4A的引線框架的透視圖。
圖5A是在組件端子的周邊內具有周邊凹部的引線框架的另一實施方案的俯視圖。
圖5B是圖5A的引線框架的透視圖。
圖6A是在組件端子的周邊內具有周邊凹部的引線框架的又另一實施方案的俯視圖。
圖6B是圖6A的引線框架的透視圖。
圖7A是在組件端子的周邊內具有周邊凹部的引線框架的又另一實施方案的俯視圖。
圖7B是圖7A的引線框架的透視圖。
圖8A是在組件端子的周邊內具有周邊凹部的引線框架的又另一實施方案的俯視圖。
圖8B是圖8A的引線框架的透視圖。
圖9是製造具有限定在引線框架中的周邊凹部的封裝電路的實例方法的流程圖。
圖1A是在組件端子104的周邊內具有周邊凹部108的引線框架102的封裝電路100的實施方案的剖面圖。引線框架102由比如金屬的導電材料組成。在實例中，引線框架102由銅組成。引線框架102包括兩個主要表面：外表面103和內表面105。外表面103是在封裝電路100的外部上的表面(在已經塗覆模制化合物之後)且包括多個外部端子107以將引線框架102(且因此封裝電路100)耦接至外部電路(例如印刷電路板)。內表面105包括一個或多個墊以安裝組件116和任何其它有源或無源組件。
組件116被安裝至引線框架102的內表面105。雖然圖1A所示的實例圖示了單個組件116，但是在其它實例中，額外有源或無源組件可安裝至引線框架102。在實例中，封裝電路100在多芯片封裝中包括多個管芯以比如，例如實施功率轉換系統。功率轉換系統可包括功率級以及用於功率級的控制器和/或驅動器。例如，組件116可被包封或不包封且包括高側FET、低側FET、二極管(例如，肖特基二極管)或用於功率級的控制器/驅動器。其它組件(比如，電感器或無源管芯)也可安裝在引線框架102上。在實例中，功率轉換系統可包括一個或多個以下項：DC-DC功率轉換器、充電器、熱插拔控制器、AC-DC轉換器、橋式驅動器、降壓轉換器、升壓轉換器、降壓-升壓轉換器、同步降壓轉換器或任何這些電路的一部分。在另一個實例中，封裝電路100在單芯片封裝中包括單個管芯以比如，例如實施分立裝置。
組件116包括其底側上的端子104以安裝至引線框架的內表面105。端子104可被構造來電和/或熱耦接在引線框架102與組件116之間。因此，端子104包括組件116上的導電墊，其通常被非導電材料圍繞。組件116還可包括其它端子。出於教學目的，僅示出組件116的單個端子104，但是，應理解，組件116可具有一個以上端子。
組件附接粘合劑106可布置在端子104與引線框架102的內表面105之間以將端子104機械附接和電以及/或熱耦接至引線框架102。組件附接粘合劑106可包括焊料或導電或絕緣環氧樹脂。
圖1A、圖1B和圖2所示的實例引線框架102包括由周邊凹部108組成的凹部圖案。出於本說明書的目的，術語凹部圖案指的是引線框架102在組件104的端子104的周邊內的內表面105中形成的任何凹部。在圖1A所示的實例中，凹部圖案由周邊凹部108組成；但是，在其它實例中，凹部圖案可包括在比如圖5A-8B所示的端子104的周邊內的其它凹部。
再次參考圖1A，周邊凹部108包括引線框架102的內表面105的內凹部分(例如，溝槽)。此外，周邊凹部108具有包封一定區域的形狀。引線框架102的內表面105上由周邊凹部108包封的區域本文稱為安裝區域202且示於圖2中，其示出封裝電路100的俯視圖。在圖2所示的實例中，周邊凹部108具有包括矩形周邊(例如，正方形)的形狀。因此，安裝區域202也具有大致矩形的形狀。在其它實例中，周邊凹部108可具有其它形狀，比如圓形或其它多邊形。如與周邊凹部108比較，圖2的實例安裝區域202包括凸起的表面。組件116的端子104被安裝至安裝區域202中的這個凸起表面。因此，組件附接粘合劑106被布置在端子104與引線框架 102之間的安裝區域202的凸起表面上。
圖1B是封裝電路100的放大圖。如所示，在製造封裝電路100之後的第二級回流事件期間，組件附接粘合劑106可軟化安裝區域202且從其中膨脹。這個第二級回流事件包括在將封裝電路100安裝至印刷電路板時等等。在這些第二級回流事件期間，包括周邊凹部108的凹部圖案提供組件附接粘合劑106可膨脹至其中而不會從封裝中漏出的間隙。此外，作為凹部，周邊凹部108提供多個阻斷特徵，包括阻止組件附接粘合劑106流動的外壁表面。因此，隨著組件附接粘合劑106在回流事件期間膨脹，周邊凹部108幫助在端子104的周邊內包含組件附接粘合劑，且因此，幫助減少或消除組件附接粘合劑106泄漏至封裝的外側。通常，凹部圖案被用在具有大量組件附接粘合劑106的大型端子上。周邊凹部108提供用於組件附接粘合劑106的間隙且阻止組件附接粘合劑106在端子104的所有側上流動。
顯然，周邊凹部108在端子104的周邊204內。即，當組件116被安裝在安裝區域202中時，端子104的周邊204比周邊凹部108的外邊緣更大，且相反，周邊凹部108在端子104的周邊204的下面和內部。這在可包括周邊凹部108而不在從端子104向外的引線框架102的內表面上使用區域方面是有利的，使從端子104向外的這種區域能够用於其它目的，比如引線框架鎖定特徵。此外，這使內表面105能够與組件116的周邊204相同尺寸，同時仍阻止組件附接粘合劑106的流動。在實例中，內表面105上的周邊凹部108的外部形狀被構造來匹配端子104的形狀使得當在安裝區域202中安裝端子104時，周邊凹部108接近端子104的周邊204。因此， 用於端子104的組件附接粘合劑106被布置在安裝區域202中(即，內接周邊凹部108)且周邊凹部108在第一級焊料回流期間為組件附接粘合劑106提供周邊包含。端子104是單個端子且在一些實例中，端子104僅在安裝區域202中耦接至引線框架102。即，端子104不在周邊凹部108外側耦接至引線框架102。另外，在一些實例中，其它端子或互連機構(來自相同或其它組件)並未耦接在安裝區域202中。在具有附接至內表面105的其它端子、組件和/或互連機構的實例中，這些其它端子、組件和/或互連機構附接至區域中的內表面105而不是安裝區域202(即，在其外側)。
組件116的頂部表面可通過一個或多個焊線118、銅夾、鋁帶或其它互聯機構耦接至引線框架102的內表面105。焊線118可附接至引線框架102的內表面105以及組件116的頂部表面。模制化合物122可圍繞組件116並在引線框架102周圍部分地延伸。模制化合物122可包括任何合適的模制化合物，比如熱固性材料、熱固性環氧基樹脂或熱塑性材料。
在實例中，引線框架102由多個不同且大致平坦的導電材料區段組成，其中所述區段被定向使得區段整體具有大致平坦的構造。在實例中，一個或多個導電材料區段可以是浮動的，即，一個或多個導電材料區段不鄰接封裝電路100的封裝的邊緣(周邊)。在這類實例中，封裝電路100可在引線框架102的區段之間中在其底邊緣上包括阻焊劑110。阻焊劑110可由非導電焊料掩膜材料(阻劑)(包括有機和非有機焊料掩膜材料)組成。
圖3A是示出周邊凹部108的引線框架102的一部分的放大剖面圖。在這個實例中，周邊凹部108的表面是暴露的引線框架(例如， 銅)。圖3B是具有周邊凹部308的另一實例引線框302的一部分的放大剖面圖。在這個實例中，周邊凹部308塗敷非導電材料304，比如焊料掩膜材料(阻劑)，其可包括有機和非有機焊料掩膜材料二者。在回流事件期間用非導電材料304塗敷周邊凹部308表面可減少組件附接粘合劑106的濕潤度，並幫助允許在回流事件之後將組件附接粘合劑106撤回至其先前位置。
圖4A-8B圖示了具有各種凹部圖案的引線框架的不同實施方案。圖4A和圖4B圖示了圖1A、圖1B和圖2所示的引線框架102。如所示，引線框架102包括凹部圖案，其包括限定安裝區域202周圍的周邊的周邊凹部108。周邊凹部108限定安裝區域202作為端子104安裝至其的單個凸起表面。安裝區域202的單個凸起表面塗敷組件附接粘合劑用於端子104的安裝。端子104的周邊204從周邊凹部108向外延伸。
圖5A和圖5B圖示了引線框架502的另一實例。引線框架502包括凹部圖案，其包括周邊凹部508和多個十字凹部506。周邊凹部508限定安裝區域中的多個凸起表面504周圍的周邊。多個凸起表面504由周邊凹部508和橫跨安裝區域延伸的兩個十字凹部506限定。類似於周邊凹部508，十字凹部506是引線框架502的內表面中的凹部。十字凹部506在被周邊凹部508包封的區域中，其中周邊凹部508包括圖5A和圖5B所示的凹部的外環部分。在這個實例中，十字凹部506始終橫跨周邊凹部508包封的區域延伸，使得其端接在周邊凹部508的每個端處。在這個實例中，十字凹部506彼此正交地延伸形成導致四個大致相同尺寸且凸起的表面504的十字。四個凸起表面504塗敷組件附接粘合劑且端子104可附接至其處。端子104的周邊510從周邊凹部508向外延伸。有利的是，十字凹部506在 端子104周邊內提供組件附接粘合劑可在回流事件期間膨脹至其中的額外間隙。
圖6A和圖6B圖示了引線框架602的另一實例。引線框架602包括凹部圖案，其包括周邊凹部608和多個十字凹部606。周邊凹部608限定安裝區域中的多個凸起表面604周圍的周邊。多個凸起表面604由周邊凹部608和橫跨安裝區域延伸的四個十字凹部606限定。類似於周邊凹部608，十字凹部606是引線框架602的內表面中的凹部。十字凹部606在被周邊凹部608包封的區域中，其中周邊凹部608包括圖6A和圖6B所示的凹部的外環部分。在這個實例中，十字凹部606始終橫跨周邊凹部608包封的區域延伸，使得其端接在周邊凹部608的每個端處。在這個實例中，兩個十字凹部606正交地延伸至另外兩個十字凹部606形成導致六個大致相同尺寸且凸起的表面604的井字板(tick-tack-toe board)圖案。六個凸起表面604塗敷組件附接粘合劑且端子104可附接至其處。端子104的周邊610從周邊凹部608向外延伸。有利的是，十字凹部606在端子104周邊內提供組件附接粘合劑可在回流事件期間膨脹至其中的額外間隙。
圖7A和圖7B圖示了引線框架702的又另一實例。引線框架702包括凹部圖案，其包括周邊凹部708和多個十字凹部706。周邊凹部708限定安裝區域中的多個凸起表面704周圍的周邊。多個凸起表面704由周邊凹部708和橫跨安裝區域延伸的兩個十字凹部706限定。類似於周邊凹部708，十字凹部706是引線框架702的內表面中的凹部。十字凹部706在被周邊凹部708包封的區域中，其中周邊凹部708包括圖7A和圖7B所示的凹部的外環部分。在這個實例中，十字凹部706始終橫跨周邊凹部708 包封的區域延伸，使得其端接在周邊凹部708的每個端處。在這個實例中，兩個十字凹部706彼此平行地延伸導致三個矩形、相同尺寸且凸起的表面704。三個凸起表面704塗敷組件附接粘合劑且端子104可附接至其處。端子104的周邊710從周邊凹部708向外延伸。有利的是，十字凹部706在端子104周邊內提供組件附接粘合劑可在回流事件期間膨脹至其中的額外間隙。
圖8A和圖8B圖示了引線框架802的另一實例。引線框架802包括凹部圖案，其包括周邊凹部808和多個十字凹部806。周邊凹部808限定安裝區域中的單個凸起表面804周圍的周邊。單個凸起表面804由周邊凹部808限定。凸起表面804在其中包括十字凹部部分806。類似於周邊凹部808，十字凹部806是引線框架802的內表面中的凹部。十字凹部806在由周邊凹部808包圍的區域中。在這個實例中，十字凹部806不與周邊凹部808連接，且代以在周邊凹部808包封的區域中限定島狀凹部。這種島狀凹部可以是在頂部安裝組件116之後填充的空氣。在這個實例中，十字凹部806為十字形狀；但是，也可使用其它形狀。在這個實例中，凸起表面804塗敷組件附接粘合劑且端子104可附接至其處。端子104的周邊810從周邊凹部808向外延伸。有利的是，十字凹部806在端子104周邊內提供組件附接粘合劑可在回流事件期間膨脹至其中的額外間隙。
在實例中，周邊凹部的邊緣與引線框架或其部分的邊緣之間的空隙為至少0.10mm。在實例中，周邊凹部延伸在引線框架的內表面下面延伸至少0.063mm。在實例中，兩個鄰近凹部(例如，周邊凹部和十字凹部)之間的空隙為至少0.50mm。在實例中，凹部(例如周邊凹部和十字凹 部)的寬度為至少0.10mm。以上任一凹部(例如，周邊凹部和十字凹部)在包封封裝電路100之後可填充模制化合物、空氣或部分填充兩者。
將電路100製造入封裝可包括同時製造多個封裝電路100。例如，多個引線框架102可彼此相鄰組裝，每個芯片引線框架上安裝有合適的組件(116)。一旦被組裝，引線框架102和關聯的組件可被單片化分割以形成獨立的封裝系統。以下描述涉及形成單個封裝電路100的過程，但是應理解，該過程可包括同時形成多個封裝電路100。
圖9是製造具有引線框架102的封裝電路的實例方法900的流程圖，所述引線框架102具有包括周邊凹部108的凹部圖案。獲得引線框架102、要安裝在引線框架102上的組件116和任何其它組件(步驟902)。組件116和任何其它組件可包括高側FET、低側FET、二極管(例如，肖特基二極管)、驅動器/控制器、電感器或有源管芯和其它組件。在包括一個或多個管芯的實例(例如，單塊襯底)中，這類一個或多個管芯可使用合適半導體程序製造。
引線框架102可根據所需凹部圖案從內(頂部)表面105部分地蝕刻(步驟904)。凹部圖案可包括周邊凹部108和周邊凹部108包封的區域中的任何十字凹部。部分蝕刻僅延伸穿過引線框架102的一部分，從內表面105朝外(底部)表面103。部分蝕刻導致了引線框架102的內表面105上限定有凹部圖案。為了進行部分蝕刻，阻劑被放置在引線框架102的內表面105上，但是阻劑不會被放置在隨著蝕刻進行引線框架102將被移除的部分上。在實例中，部分蝕刻延伸穿過引線框架102的25%至60%。在凹部圖案包括非導電材料塗層的實例中，這種非導電材料可被塗覆至具有 凹部圖案的凹部。在其它實例中，部分蝕刻可延伸至其它情形。在部分蝕刻之後，可對引線框架102的內表面105沉積鍍層。
在一些實例中，凹部圖案表面可塗敷非導電材料304(步驟905)。
引線框架102的內表面105可使用焊料掩膜和軟焊塗料或多個焊球將組件附接粘合劑106塗敷在引線框架102的內表面105上(步驟906)。這可包括用焊膏塗敷周邊凹部108包封的安裝區域中的凸起表面。
組件116可安裝在引線框架102的凸起表面的組件附接粘合劑106上(步驟908)。可使用倒裝芯片安裝技術使組件116與引線框架102對準並將其放置在引線框架102上。尤其是，組件116可被放置使得端子104覆蓋凹部圖案且周邊204被布置在周邊凹部108的外部。在包括其它組件的實例中，其它組件也可安裝至引線框架102的內表面105。在一些實例中，一旦組件116和任何其它組件在引線框架102上就位，組件附接粘合劑106便可回流。
在一些實例中，焊線118、銅夾、鋁帶或其它互聯機構可附接至組件116、其它組件和/或引線框架102以獲得所需的耦接(步驟910)。一旦組件116和任何其它組件已被安裝且已製造了所有合適的電連接，便可使模制化合物122流過組件116、任何其它組件和引線框架102以包封組件116、任何其它組件和引線框架102(步驟912)。在同時形成多個封裝電路的過程中，可使模制化合物122流過多個組裝電路。一旦被塗覆，模制化合物122便可被固化或凝固。
可在任何合適封裝技術中包括具有限定在內表面的凹部環 的引線框架。例如，引線框架可包括在具有單件引線框架的封裝中，或可包括在引線框架由多個不同且電隔離的導電材料區段的封裝中。
在引線框架由多個材料區段組成的實例中，任何區段可被蝕刻成包括所需凹部環和任何十字凹部(步驟914)。在這類實例中，除了以上行動之外，製造封裝電路的過程可包括沿分界線部分蝕刻引線框架102的內表面105，其對應於最後引線框架102的區段之間的間隙。一旦模制化合物122被固化，便可在引線框架102的未來區段之間的分界線處蝕刻引線框架102的外表面103。這種部分蝕刻從外表面103向內表面105延伸穿過引線框架的一部分。外表面103上的部分蝕刻可與內表面105上的部分蝕刻對準，使得在分界線蝕刻組合斷開且電耦接引線框架102的不同區段。
在實例中，比如焊料掩膜材料(例如阻劑)110的非導電材料可被塗覆至引線框架102的外表面103(步驟916)。焊料掩膜材料可包括有機和非有機掩膜材料。此外，輸入/輸出地面鍍層、焊料等等可塗覆至引線框架102的外表面103。
當同時形成多個封裝電路時，組合多個封裝電路可接著被單片化分割以形成多個封裝電路。
本申請中陳述和圖示的方向性參考頂部和底部不應理解為限制性的。頂部和底部方向僅僅是說明性的，並不與絕對定向對應。即，“頂部”或“底部”表面僅指相對於引線框架而言的相對定向，並非絕對方向。例如，在實際電子應用中，也可使封裝電路轉向其“側面”，使得本文描述的“底部表面”面向側向。
實例實施方案
實例1包括一種製造裝置的方法，所述方法包括：在引線框架的內表面中蝕刻至少一個凹部圖案，所述至少一個凹部圖案包括限定安裝區域的周邊的周邊凹部；和將組件蝕刻至所述引線框架的所述內表面，使得所述組件的單個端子被附接在所述安裝區域中且所述單個端子覆蓋所述周邊凹部，其中所述周邊凹部具有使得所述凹部接近所述單個端子的周邊的尺寸和形狀。
實例2包括實例1的方法，其中所述組件的所述單個端子包括所述組件上的導電墊。
實例3包括實例1或2中任一項的方法，包括：將一個或多個其它組件附接至在所示安裝區域外部的所述引線框架的所述內表面。
實例4包括實例1-3中任一項的方法，其中所述周邊凹部具有矩形周邊的形狀。
實例5包括實例1-4中任一項的方法，其中所述安裝區域包括單個凸起表面。
實例6包括實例1-5中任一項的方法，其中蝕刻所述至少一個凹部圖案包括蝕刻橫跨所述安裝區域延伸的一個或多個十字凹部，從而將所述安裝區域分成多個凸起表面。
實例7包括實例1-6中任一項的方法，其中所述一個或多個十字凹部通過與所述周邊凹部連接而端接在每個端上。
實例8包括實例1-7中任一項的方法，包括：將組件附接粘合劑放置在所述安裝區域中的一個或多個凸起表面上；和將模制化合物塗覆在所述引線框架上且塗覆在所述組件周圍。
實例9包括一種封裝電路，其包括：引線框架，其包括在其內表面上的至少一個凹部圖案，所述至少一個凹部圖案包括在一個或多個凸起表面周圍限定周邊的周邊凹部；具有一個或多個端子的組件，所述端子中的一個被安裝至所述一個或多個凸起表面，使得所述端子覆蓋所述周邊凹部，其中所述周邊凹部具有使得所述凹部接近所述端子的周邊的尺寸和形狀；和組件附接粘合劑，其在所述組件的所述單個端子與所述引線框架的所述一個或多個凸起表面之間。
實例10包括實例9的封裝電路，其中所述組件的所述端子包括在所述組件上的導電墊。
實例11包括實例10的封裝電路，其中所述導電墊被非導電材料圍繞。
實例12包括實例9-11中任一項的封裝電路，其中所述周邊凹部具有矩形周邊的形狀。
實例13包括實例9-12中任一項的封裝電路，其中所述一個或多個凸起表面包括單個凸起表面。
實例14包括實例9-13中任一項的封裝電路，其中所述至少一個凹部圖案包括內接至所述周邊凹部的一個或多個十字凹部，使得所述一個或多個凸起表面包括多個凸起表面。
實例15包括實例9-14中任一項的封裝電路，其中所述一個或多個十字凹部通過與所述周邊凹部連接而端接在每個端上。
實例16包括實例9-15中任一項的封裝電路，包括：組件附接粘合劑，其在所述引線框架與所述組件之間的所述一個或多個凸起表面 上。
實例17包括一種製造裝置的方法，所述方法包括：在引線框架的內表面中蝕刻凹部圖案，所述凹部圖案包括在一個或多個凸起表面周圍限定周邊的周邊凹部；將組件附接粘合劑放置在所述一個或多個凸起表面上；將組件附接至所述引線框架的所述內表面，使得所述組件的單個端子附接至所述一個或多個凸起表面且所述單個端子覆蓋所述周邊凹部，其中所述周邊凹部具有使得所述凹部接近所述單個端子的周邊的尺寸和形狀；和將模制化合物塗覆在所述引線框架上和塗覆在所述組件周圍。
實例18包括實例17的方法，其中所述一個或多個凸起表面包括組成內接所述周邊凹部的整個區域的單個表面。
實例19包括實例17或18的方法，其中蝕刻所述凹部圖案包括蝕刻內接至所述周邊凹部的一個或多個十字凹部，使得所述一個或多個凸起表面包括多個凸起表面。
實例20包括實例17-19的方法，其中所述周邊凹部具有矩形周邊的形狀。
100‧‧‧電路
102‧‧‧引線框架
103‧‧‧外表面
104‧‧‧端子
105‧‧‧內表面
106‧‧‧組件附接粘合劑
107‧‧‧端子
108‧‧‧周邊凹部
110‧‧‧阻焊劑
116‧‧‧組件
122‧‧‧模制化合物
202‧‧‧安裝區域
204‧‧‧周邊

Claims (20)

  1. 一種製造裝置的方法，所述方法包括：在引線框架的內表面中蝕刻至少一個凹部圖案，所述至少一個凹部圖案包括限定安裝區域的周邊的周邊凹部；將組件附接粘合劑放置在所述安裝區域中的一個或多個凸起表面上；和將組件附接至所述引線框架的所述內表面，使得所述組件的單個端子被附接在所述安裝區域中且所述單個端子覆蓋所述周邊凹部，其中所述周邊凹部具有使得所述凹部接近所述單個端子的周邊的尺寸和形狀，其中所述周邊凹部限定一連續外壁以用於阻止所述組件附接粘合劑的流動。
  2. 如申請專利範圍第1項所述的方法，其中所述組件的所述單個端子包括所述組件上的導電墊。
  3. 如申請專利範圍第1項所述的方法，包括：將一個或多個其它組件附接至在所述安裝區域外部的所述引線框架的所述內表面。
  4. 如申請專利範圍第1項所述的方法，其中所述周邊凹部具有矩形周邊的形狀。
  5. 如申請專利範圍第1項所述的方法，其中所述安裝區域包括單個凸起表面。
  6. 如申請專利範圍第1項所述的方法，其中蝕刻所述至少一個凹部圖案包括蝕刻橫跨所述安裝區域延伸的一個或多個十字凹部，從而將所述安裝區域分成多個凸起表面。
  7. 如申請專利範圍第1項所述的方法，其中所述一個或多個十字凹部通過與所述周邊凹部連接而端接在每個端上。
  8. 如申請專利範圍第1項所述的方法，包括：將模制化合物施加在所述引線框架上且施加在所述組件周圍。
  9. 一種封裝電路，其包括：引線框架，其包括在其內表面上的至少一個凹部圖案，所述至少一個凹部圖案包括一周邊凹部，所述周邊凹部限定圍繞一個或多個凸起表面的周邊；具有一個或多個端子的組件，所述端子中的一個被安裝至所述一個或多個凸起表面，使得所述端子覆蓋整個所述周邊凹部，其中所述周邊凹部具有使得所述凹部在所述端子的整個周邊內接近所述端子的周邊的尺寸和形狀；和組件附接粘合劑，其在所述組件的所述單個端子與所述引線框架的所述一個或多個凸起表面之間，其中所述周邊凹部在所述端子的整個周邊內限定一連續外壁以用於阻止所述組件附接粘合劑的流動。
  10. 如申請專利範圍第9項所述的封裝電路，其中所述組件的所述端子包括在所述組件上的導電墊。
  11. 如申請專利範圍第10項所述的封裝電路，其中所述導電墊係由非導電材料所圍繞。
  12. 如申請專利範圍第9項所述的封裝電路，其中所述周邊凹部具有矩形周邊的形狀。
  13. 如申請專利範圍第9項所述的封裝電路，其中所述一個或多個凸起 表面包括單個凸起表面。
  14. 如申請專利範圍第9所述的封裝電路，其中所述至少一個凹部圖案包括內接至所述周邊凹部的一個或多個十字凹部，使得所述一個或多個凸起表面包括多個凸起表面。
  15. 如申請專利範圍第9項所述的封裝電路，其中所述一個或多個十字凹部通過與所述周邊凹部連接而端接在每個端上。
  16. 如申請專利範圍第9項所述的封裝電路，包括：組件附接粘合劑，其在所述引線框架與所述組件之間的所述一個或多個凸起表面上。
  17. 一種製造裝置的方法，所述方法包括：在引線框架的內表面中蝕刻凹部圖案，所述凹部圖案包括在一個或多個凸起表面周圍限定周邊的周邊凹部；將組件附接粘合劑放置在所述一個或多個凸起表面上；將組件附接至所述引線框架的所述內表面，使得所述組件的單個端子附接至所述一個或多個凸起表面且所述單個端子覆蓋所述周邊凹部，其中所述周邊凹部具有使得所述凹部接近所述單個端子的周邊的尺寸和形狀，其中所述周邊凹部提供所述組件附接粘合劑可膨脹至其中的間隙；和將模制化合物施加在所述引線框架上和施加在所述組件周圍。
  18. 如申請專利範圍第17項所述的方法，其中所述一個或多個凸起表面包括構成內接所述周邊凹部的整個區域的單個表面。
  19. 如申請專利範圍第17項所述的方法，其中蝕刻所述凹部圖案包括蝕刻內接至所述周邊凹部的一個或多個十字凹部，使得所述一個或多個凸 起表面包括多個凸起表面。
  20. 如申請專利範圍第17所述的方法，其中所述周邊凹部具有矩形周邊的形狀。
TW102135781A 2012-12-20 2013-10-03 組件端子周邊內具有周邊凹部的引線框架 TWI593071B (zh)

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