JP7618954B2 - 熱伝導性シート - Google Patents

熱伝導性シート Download PDF

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Publication number
JP7618954B2
JP7618954B2 JP2020549280A JP2020549280A JP7618954B2 JP 7618954 B2 JP7618954 B2 JP 7618954B2 JP 2020549280 A JP2020549280 A JP 2020549280A JP 2020549280 A JP2020549280 A JP 2020549280A JP 7618954 B2 JP7618954 B2 JP 7618954B2
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Japan
Prior art keywords
thermally conductive
conductive sheet
anisotropic filler
filler
anisotropic
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JP2020549280A
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English (en)
Japanese (ja)
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JPWO2020067141A1 (ja
Inventor
弘通 岩▲崎▼
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Sekisui Polymatech Co Ltd
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Sekisui Polymatech Co Ltd
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Publication of JPWO2020067141A1 publication Critical patent/JPWO2020067141A1/ja
Priority to JP2023184730A priority Critical patent/JP2023181341A/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/042—Graphene or derivatives, e.g. graphene oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/16—Compositions of unspecified macromolecular compounds the macromolecular compounds being biodegradable
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0812—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/08—Oxygen-containing compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731—Ceramic materials or glass

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP2020549280A 2018-09-26 2019-09-25 熱伝導性シート Active JP7618954B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023184730A JP2023181341A (ja) 2018-09-26 2023-10-27 熱伝導性シート

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018180192 2018-09-26
JP2018180192 2018-09-26
PCT/JP2019/037554 WO2020067141A1 (ja) 2018-09-26 2019-09-25 熱伝導性シート

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023184730A Division JP2023181341A (ja) 2018-09-26 2023-10-27 熱伝導性シート

Publications (2)

Publication Number Publication Date
JPWO2020067141A1 JPWO2020067141A1 (ja) 2021-09-30
JP7618954B2 true JP7618954B2 (ja) 2025-01-22

Family

ID=69949643

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2020549280A Active JP7618954B2 (ja) 2018-09-26 2019-09-25 熱伝導性シート
JP2023184730A Withdrawn JP2023181341A (ja) 2018-09-26 2023-10-27 熱伝導性シート

Family Applications After (1)

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JP2023184730A Withdrawn JP2023181341A (ja) 2018-09-26 2023-10-27 熱伝導性シート

Country Status (7)

Country Link
US (1) US11987687B2 (enExample)
EP (1) EP3860321B1 (enExample)
JP (2) JP7618954B2 (enExample)
KR (1) KR102761499B1 (enExample)
CN (1) CN112715059B (enExample)
TW (1) TWI856026B (enExample)
WO (1) WO2020067141A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115024027A (zh) * 2020-01-22 2022-09-06 3M创新有限公司 热界面层
US20230049873A1 (en) * 2020-01-22 2023-02-16 3M Innovative Properties Company Electrically conductive adhesive layer
CN116096792B (zh) * 2020-09-30 2025-02-25 积水保力马科技株式会社 导热性片
JP6989675B1 (ja) * 2020-10-21 2022-01-05 デクセリアルズ株式会社 熱伝導性シート及び熱伝導性シートの製造方法
EP4289679A4 (en) * 2021-02-05 2024-07-10 Asahi Kasei Kabushiki Kaisha MULTILAYER COMPOSITE FOR AIRBAG
JP2022126535A (ja) * 2021-02-18 2022-08-30 デクセリアルズ株式会社 熱伝導性シートの製造方法及び熱伝導性シート
WO2022210419A1 (ja) * 2021-03-31 2022-10-06 積水ポリマテック株式会社 熱伝導性シートの製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007326976A (ja) 2006-06-08 2007-12-20 Polymatech Co Ltd 熱伝導性成形体及びその製造方法
JP2008251747A (ja) 2007-03-29 2008-10-16 Polymatech Co Ltd 熱伝導性シート
WO2017179318A1 (ja) 2016-04-11 2017-10-19 ポリマテック・ジャパン株式会社 熱伝導性シート

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6178389U (enExample) 1984-10-29 1986-05-26
JP2001156227A (ja) * 1999-11-30 2001-06-08 Polymatech Co Ltd 異方性熱伝導性シート
CN100404242C (zh) 2005-04-14 2008-07-23 清华大学 热界面材料及其制造方法
JP4814550B2 (ja) 2005-06-03 2011-11-16 ポリマテック株式会社 熱伝導性成形体の製造方法
JP5254870B2 (ja) 2009-04-22 2013-08-07 ポリマテック株式会社 熱伝導性シート及びその製造方法
JP5416174B2 (ja) * 2011-07-08 2014-02-12 ポリマテック株式会社 熱伝導性成形体
JP5953160B2 (ja) 2012-07-27 2016-07-20 ポリマテック・ジャパン株式会社 熱伝導性成形体の製造方法
JP2015073067A (ja) 2013-09-06 2015-04-16 バンドー化学株式会社 熱伝導性樹脂成形品
JP6397229B2 (ja) 2014-06-12 2018-09-26 国立研究開発法人産業技術総合研究所 厚み方向に高い熱伝導率を有する熱伝導性部材及び積層体
JP6178389B2 (ja) 2014-12-25 2017-08-09 デクセリアルズ株式会社 熱伝導シートの製造方法、熱伝導シート、及び半導体装置
JP6723610B2 (ja) 2015-06-25 2020-07-15 積水ポリマテック株式会社 熱伝導性シート
WO2016208509A1 (ja) * 2015-06-25 2016-12-29 コニカミノルタ株式会社 成形型、光学素子、及び光学素子の製造方法
JP6524831B2 (ja) 2015-07-16 2019-06-05 富士ゼロックス株式会社 情報処理装置及びプログラム
KR102490491B1 (ko) * 2015-07-29 2023-01-19 나믹스 코포레이션 조면화 처리 구리박, 동장 적층판 및 프린트 배선판
JP2017135137A (ja) 2016-01-25 2017-08-03 東洋紡株式会社 絶縁高熱伝導性シート、およびその製法、および積層体
KR102338103B1 (ko) * 2016-04-14 2021-12-10 미쓰이금속광업주식회사 표면 처리 동박, 캐리어를 구비하는 동박, 그리고 그것들을 사용한 동장 적층판 및 프린트 배선판의 제조 방법
US10495788B2 (en) * 2016-05-17 2019-12-03 Canon Kabushiki Kaisha Resin molded product, interchangeable lens for camera, and method of manufacturing resin molded product
JP2018056315A (ja) 2016-09-28 2018-04-05 デクセリアルズ株式会社 電磁波吸収熱伝導シート、電磁波吸収熱伝導シートの製造方法及び半導体装置
JPWO2018123012A1 (ja) * 2016-12-28 2019-10-31 日立化成株式会社 熱伝導シート、熱伝導シートの製造方法及び放熱装置
CN108407425A (zh) * 2018-02-11 2018-08-17 东莞市明骏智能科技有限公司 一种石墨烯-碳纳米管纤维基导热垫片及其制备方法
KR102646809B1 (ko) * 2018-06-22 2024-03-13 세키수이 폴리머텍 가부시키가이샤 열전도성 시트
US20220289932A1 (en) * 2019-09-30 2022-09-15 Sekisui Polymatech Co., Ltd. Thermally conductive sheet and method for producing same
KR102452165B1 (ko) * 2019-11-01 2022-10-11 세키수이 폴리머텍 가부시키가이샤 열전도성 시트 및 그 제조 방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007326976A (ja) 2006-06-08 2007-12-20 Polymatech Co Ltd 熱伝導性成形体及びその製造方法
JP2008251747A (ja) 2007-03-29 2008-10-16 Polymatech Co Ltd 熱伝導性シート
WO2017179318A1 (ja) 2016-04-11 2017-10-19 ポリマテック・ジャパン株式会社 熱伝導性シート

Also Published As

Publication number Publication date
US20210388175A1 (en) 2021-12-16
EP3860321A4 (en) 2022-06-29
KR102761499B1 (ko) 2025-02-04
US11987687B2 (en) 2024-05-21
CN112715059B (zh) 2024-09-06
EP3860321B1 (en) 2024-10-02
EP3860321A1 (en) 2021-08-04
KR20210063339A (ko) 2021-06-01
JP2023181341A (ja) 2023-12-21
TW202036816A (zh) 2020-10-01
CN112715059A (zh) 2021-04-27
TWI856026B (zh) 2024-09-21
JPWO2020067141A1 (ja) 2021-09-30
WO2020067141A1 (ja) 2020-04-02

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