TWI856026B - 導熱性片 - Google Patents

導熱性片 Download PDF

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Publication number
TWI856026B
TWI856026B TW108134691A TW108134691A TWI856026B TW I856026 B TWI856026 B TW I856026B TW 108134691 A TW108134691 A TW 108134691A TW 108134691 A TW108134691 A TW 108134691A TW I856026 B TWI856026 B TW I856026B
Authority
TW
Taiwan
Prior art keywords
thermally conductive
conductive sheet
anisotropic filler
filler
anisotropic
Prior art date
Application number
TW108134691A
Other languages
English (en)
Chinese (zh)
Other versions
TW202036816A (zh
Inventor
岩崎弘通
Original Assignee
日商積水保力馬科技股份有限公司
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Publication of TW202036816A publication Critical patent/TW202036816A/zh
Application granted granted Critical
Publication of TWI856026B publication Critical patent/TWI856026B/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/042—Graphene or derivatives, e.g. graphene oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/16—Compositions of unspecified macromolecular compounds the macromolecular compounds being biodegradable
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0812—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/08—Oxygen-containing compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731—Ceramic materials or glass

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
TW108134691A 2018-09-26 2019-09-25 導熱性片 TWI856026B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018180192 2018-09-26
JPJP2018-180192 2018-09-26

Publications (2)

Publication Number Publication Date
TW202036816A TW202036816A (zh) 2020-10-01
TWI856026B true TWI856026B (zh) 2024-09-21

Family

ID=69949643

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108134691A TWI856026B (zh) 2018-09-26 2019-09-25 導熱性片

Country Status (7)

Country Link
US (1) US11987687B2 (enExample)
EP (1) EP3860321B1 (enExample)
JP (2) JP7618954B2 (enExample)
KR (1) KR102761499B1 (enExample)
CN (1) CN112715059B (enExample)
TW (1) TWI856026B (enExample)
WO (1) WO2020067141A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021148910A1 (en) * 2020-01-22 2021-07-29 3M Innovative Properties Company Thermal interface layer
US20230049873A1 (en) * 2020-01-22 2023-02-16 3M Innovative Properties Company Electrically conductive adhesive layer
WO2022070680A1 (ja) * 2020-09-30 2022-04-07 積水ポリマテック株式会社 熱伝導性シート
JP6989675B1 (ja) * 2020-10-21 2022-01-05 デクセリアルズ株式会社 熱伝導性シート及び熱伝導性シートの製造方法
US20240067121A1 (en) * 2021-02-05 2024-02-29 Asahi Kasei Kabushiki Kaisha Multilayer composite for airbag
JP2022126535A (ja) * 2021-02-18 2022-08-30 デクセリアルズ株式会社 熱伝導性シートの製造方法及び熱伝導性シート
WO2022210419A1 (ja) * 2021-03-31 2022-10-06 積水ポリマテック株式会社 熱伝導性シートの製造方法

Citations (4)

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JP2007326976A (ja) * 2006-06-08 2007-12-20 Polymatech Co Ltd 熱伝導性成形体及びその製造方法
JP2008251747A (ja) * 2007-03-29 2008-10-16 Polymatech Co Ltd 熱伝導性シート
TW201830615A (zh) * 2016-12-28 2018-08-16 日商日立化成股份有限公司 導熱片、導熱片的製造方法以及散熱裝置
CN108407425A (zh) * 2018-02-11 2018-08-17 东莞市明骏智能科技有限公司 一种石墨烯-碳纳米管纤维基导热垫片及其制备方法

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JPS6178389U (enExample) 1984-10-29 1986-05-26
JP2001156227A (ja) * 1999-11-30 2001-06-08 Polymatech Co Ltd 異方性熱伝導性シート
CN100404242C (zh) * 2005-04-14 2008-07-23 清华大学 热界面材料及其制造方法
JP4814550B2 (ja) 2005-06-03 2011-11-16 ポリマテック株式会社 熱伝導性成形体の製造方法
JP5254870B2 (ja) 2009-04-22 2013-08-07 ポリマテック株式会社 熱伝導性シート及びその製造方法
JP5416174B2 (ja) * 2011-07-08 2014-02-12 ポリマテック株式会社 熱伝導性成形体
JP5953160B2 (ja) 2012-07-27 2016-07-20 ポリマテック・ジャパン株式会社 熱伝導性成形体の製造方法
JP2015073067A (ja) 2013-09-06 2015-04-16 バンドー化学株式会社 熱伝導性樹脂成形品
JP6397229B2 (ja) 2014-06-12 2018-09-26 国立研究開発法人産業技術総合研究所 厚み方向に高い熱伝導率を有する熱伝導性部材及び積層体
JP6178389B2 (ja) 2014-12-25 2017-08-09 デクセリアルズ株式会社 熱伝導シートの製造方法、熱伝導シート、及び半導体装置
JP7133923B2 (ja) 2015-06-25 2022-09-09 大塚製薬株式会社 成形型、光学素子、及び光学素子の製造方法
JP6723610B2 (ja) 2015-06-25 2020-07-15 積水ポリマテック株式会社 熱伝導性シート
JP6524831B2 (ja) 2015-07-16 2019-06-05 富士ゼロックス株式会社 情報処理装置及びプログラム
CN107923047B (zh) 2015-07-29 2020-05-01 纳美仕有限公司 粗糙化处理铜箔、覆铜层叠板及印刷电路板
JP2017135137A (ja) 2016-01-25 2017-08-03 東洋紡株式会社 絶縁高熱伝導性シート、およびその製法、および積層体
US10964620B2 (en) 2016-04-11 2021-03-30 Sekisui Polymatech Co., Ltd. Thermally conductive sheet
WO2017179416A1 (ja) * 2016-04-14 2017-10-19 三井金属鉱業株式会社 表面処理銅箔、キャリア付銅箔、並びにそれらを用いた銅張積層板及びプリント配線板の製造方法
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JP2018056315A (ja) 2016-09-28 2018-04-05 デクセリアルズ株式会社 電磁波吸収熱伝導シート、電磁波吸収熱伝導シートの製造方法及び半導体装置
ES2956260T3 (es) * 2018-06-22 2023-12-18 Sekisui Polymatech Co Ltd Lámina térmicamente conductora
WO2021065522A1 (ja) * 2019-09-30 2021-04-08 積水ポリマテック株式会社 熱伝導性シート及びその製造方法
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Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007326976A (ja) * 2006-06-08 2007-12-20 Polymatech Co Ltd 熱伝導性成形体及びその製造方法
JP2008251747A (ja) * 2007-03-29 2008-10-16 Polymatech Co Ltd 熱伝導性シート
TW201830615A (zh) * 2016-12-28 2018-08-16 日商日立化成股份有限公司 導熱片、導熱片的製造方法以及散熱裝置
CN108407425A (zh) * 2018-02-11 2018-08-17 东莞市明骏智能科技有限公司 一种石墨烯-碳纳米管纤维基导热垫片及其制备方法

Also Published As

Publication number Publication date
EP3860321A4 (en) 2022-06-29
US20210388175A1 (en) 2021-12-16
JP2023181341A (ja) 2023-12-21
US11987687B2 (en) 2024-05-21
JP7618954B2 (ja) 2025-01-22
CN112715059A (zh) 2021-04-27
KR102761499B1 (ko) 2025-02-04
EP3860321A1 (en) 2021-08-04
KR20210063339A (ko) 2021-06-01
JPWO2020067141A1 (ja) 2021-09-30
EP3860321B1 (en) 2024-10-02
CN112715059B (zh) 2024-09-06
TW202036816A (zh) 2020-10-01
WO2020067141A1 (ja) 2020-04-02

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