CN112715059B - 导热片 - Google Patents

导热片 Download PDF

Info

Publication number
CN112715059B
CN112715059B CN201980061521.9A CN201980061521A CN112715059B CN 112715059 B CN112715059 B CN 112715059B CN 201980061521 A CN201980061521 A CN 201980061521A CN 112715059 B CN112715059 B CN 112715059B
Authority
CN
China
Prior art keywords
conductive sheet
thermally conductive
anisotropic filler
anisotropic
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201980061521.9A
Other languages
English (en)
Chinese (zh)
Other versions
CN112715059A (zh
Inventor
岩崎弘通
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Polymatech Co Ltd
Original Assignee
Polymatech Japan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polymatech Japan Co Ltd filed Critical Polymatech Japan Co Ltd
Publication of CN112715059A publication Critical patent/CN112715059A/zh
Application granted granted Critical
Publication of CN112715059B publication Critical patent/CN112715059B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/042—Graphene or derivatives, e.g. graphene oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/16—Compositions of unspecified macromolecular compounds the macromolecular compounds being biodegradable
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0812—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/08—Oxygen-containing compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731—Ceramic materials or glass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
CN201980061521.9A 2018-09-26 2019-09-25 导热片 Active CN112715059B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018180192 2018-09-26
JP2018-180192 2018-09-26
PCT/JP2019/037554 WO2020067141A1 (ja) 2018-09-26 2019-09-25 熱伝導性シート

Publications (2)

Publication Number Publication Date
CN112715059A CN112715059A (zh) 2021-04-27
CN112715059B true CN112715059B (zh) 2024-09-06

Family

ID=69949643

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980061521.9A Active CN112715059B (zh) 2018-09-26 2019-09-25 导热片

Country Status (7)

Country Link
US (1) US11987687B2 (enExample)
EP (1) EP3860321B1 (enExample)
JP (2) JP7618954B2 (enExample)
KR (1) KR102761499B1 (enExample)
CN (1) CN112715059B (enExample)
TW (1) TWI856026B (enExample)
WO (1) WO2020067141A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115024027A (zh) * 2020-01-22 2022-09-06 3M创新有限公司 热界面层
US20230049873A1 (en) * 2020-01-22 2023-02-16 3M Innovative Properties Company Electrically conductive adhesive layer
CN116096792B (zh) * 2020-09-30 2025-02-25 积水保力马科技株式会社 导热性片
JP6989675B1 (ja) * 2020-10-21 2022-01-05 デクセリアルズ株式会社 熱伝導性シート及び熱伝導性シートの製造方法
EP4289679A4 (en) * 2021-02-05 2024-07-10 Asahi Kasei Kabushiki Kaisha MULTILAYER COMPOSITE FOR AIRBAG
JP2022126535A (ja) * 2021-02-18 2022-08-30 デクセリアルズ株式会社 熱伝導性シートの製造方法及び熱伝導性シート
WO2022210419A1 (ja) * 2021-03-31 2022-10-06 積水ポリマテック株式会社 熱伝導性シートの製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101309576A (zh) * 2007-03-29 2008-11-19 保力马科技株式会社 导热片及其制造方法

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6178389U (enExample) 1984-10-29 1986-05-26
JP2001156227A (ja) * 1999-11-30 2001-06-08 Polymatech Co Ltd 異方性熱伝導性シート
CN100404242C (zh) 2005-04-14 2008-07-23 清华大学 热界面材料及其制造方法
JP4814550B2 (ja) 2005-06-03 2011-11-16 ポリマテック株式会社 熱伝導性成形体の製造方法
JP4897360B2 (ja) 2006-06-08 2012-03-14 ポリマテック株式会社 熱伝導性成形体及びその製造方法
JP5254870B2 (ja) 2009-04-22 2013-08-07 ポリマテック株式会社 熱伝導性シート及びその製造方法
JP5416174B2 (ja) * 2011-07-08 2014-02-12 ポリマテック株式会社 熱伝導性成形体
JP5953160B2 (ja) 2012-07-27 2016-07-20 ポリマテック・ジャパン株式会社 熱伝導性成形体の製造方法
JP2015073067A (ja) 2013-09-06 2015-04-16 バンドー化学株式会社 熱伝導性樹脂成形品
JP6397229B2 (ja) 2014-06-12 2018-09-26 国立研究開発法人産業技術総合研究所 厚み方向に高い熱伝導率を有する熱伝導性部材及び積層体
JP6178389B2 (ja) 2014-12-25 2017-08-09 デクセリアルズ株式会社 熱伝導シートの製造方法、熱伝導シート、及び半導体装置
JP6723610B2 (ja) 2015-06-25 2020-07-15 積水ポリマテック株式会社 熱伝導性シート
WO2016208509A1 (ja) * 2015-06-25 2016-12-29 コニカミノルタ株式会社 成形型、光学素子、及び光学素子の製造方法
JP6524831B2 (ja) 2015-07-16 2019-06-05 富士ゼロックス株式会社 情報処理装置及びプログラム
KR102490491B1 (ko) * 2015-07-29 2023-01-19 나믹스 코포레이션 조면화 처리 구리박, 동장 적층판 및 프린트 배선판
JP2017135137A (ja) 2016-01-25 2017-08-03 東洋紡株式会社 絶縁高熱伝導性シート、およびその製法、および積層体
WO2017179318A1 (ja) * 2016-04-11 2017-10-19 ポリマテック・ジャパン株式会社 熱伝導性シート
KR102338103B1 (ko) * 2016-04-14 2021-12-10 미쓰이금속광업주식회사 표면 처리 동박, 캐리어를 구비하는 동박, 그리고 그것들을 사용한 동장 적층판 및 프린트 배선판의 제조 방법
US10495788B2 (en) * 2016-05-17 2019-12-03 Canon Kabushiki Kaisha Resin molded product, interchangeable lens for camera, and method of manufacturing resin molded product
JP2018056315A (ja) 2016-09-28 2018-04-05 デクセリアルズ株式会社 電磁波吸収熱伝導シート、電磁波吸収熱伝導シートの製造方法及び半導体装置
JPWO2018123012A1 (ja) * 2016-12-28 2019-10-31 日立化成株式会社 熱伝導シート、熱伝導シートの製造方法及び放熱装置
CN108407425A (zh) * 2018-02-11 2018-08-17 东莞市明骏智能科技有限公司 一种石墨烯-碳纳米管纤维基导热垫片及其制备方法
KR102646809B1 (ko) * 2018-06-22 2024-03-13 세키수이 폴리머텍 가부시키가이샤 열전도성 시트
US20220289932A1 (en) * 2019-09-30 2022-09-15 Sekisui Polymatech Co., Ltd. Thermally conductive sheet and method for producing same
KR102452165B1 (ko) * 2019-11-01 2022-10-11 세키수이 폴리머텍 가부시키가이샤 열전도성 시트 및 그 제조 방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101309576A (zh) * 2007-03-29 2008-11-19 保力马科技株式会社 导热片及其制造方法

Also Published As

Publication number Publication date
US20210388175A1 (en) 2021-12-16
EP3860321A4 (en) 2022-06-29
KR102761499B1 (ko) 2025-02-04
US11987687B2 (en) 2024-05-21
EP3860321B1 (en) 2024-10-02
EP3860321A1 (en) 2021-08-04
KR20210063339A (ko) 2021-06-01
JP2023181341A (ja) 2023-12-21
TW202036816A (zh) 2020-10-01
JP7618954B2 (ja) 2025-01-22
CN112715059A (zh) 2021-04-27
TWI856026B (zh) 2024-09-21
JPWO2020067141A1 (ja) 2021-09-30
WO2020067141A1 (ja) 2020-04-02

Similar Documents

Publication Publication Date Title
CN112715059B (zh) 导热片
CN116355425B (zh) 导热片及其制造方法
CN112655085B (zh) 导热性片
CN112313795A (zh) 热传导性片
JP6650175B1 (ja) 熱伝導性シート
CN116075547A (zh) 导热性片、其安装方法及制造方法
TWI885197B (zh) 導熱性片
WO2022210419A1 (ja) 熱伝導性シートの製造方法
WO2023190587A1 (ja) 熱伝導性シート及び熱伝導性シートの製造方法
US20250203815A1 (en) Thermally-conductive sheet

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant