JP7558397B2 - 容器 - Google Patents
容器 Download PDFInfo
- Publication number
- JP7558397B2 JP7558397B2 JP2023517222A JP2023517222A JP7558397B2 JP 7558397 B2 JP7558397 B2 JP 7558397B2 JP 2023517222 A JP2023517222 A JP 2023517222A JP 2023517222 A JP2023517222 A JP 2023517222A JP 7558397 B2 JP7558397 B2 JP 7558397B2
- Authority
- JP
- Japan
- Prior art keywords
- container
- storage space
- lid
- container body
- space forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Closures For Containers (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Weting (AREA)
Description
前記貯留空間形成部に設けられる前記処理液の吐出口と、
前記吐出口から前記処理液が吐出されるように前記貯留空間を加圧する進入部を前記貯留空間形成部の内部に進入させる進入路を形成するために、当該進入部の押圧で裂けるように当該貯留空間形成部に設けられる脆弱部と、
を備える。
2 容器
20 容器ノズル
25 吐出口
47 脆弱部
47A 進入路
59 貯留空間
68 給排気管
Claims (11)
- 基板を処理するための処理液を貯留する貯留空間が内部に形成された貯留空間形成部と、
前記貯留空間形成部に設けられる前記処理液の吐出口と、
前記吐出口から前記処理液が吐出されるように前記貯留空間を加圧する進入部を前記貯留空間形成部の内部に進入させる進入路を形成するために、当該進入部の押圧で裂けるように当該貯留空間形成部に設けられる脆弱部と、
を備える容器。 - 前記吐出口は下方に開口し、
前記貯留空間形成部に対して着脱自在であり、当該貯留空間形成部に装着した状態で前記吐出口を下方から塞ぐ下蓋が設けられる請求項1記載の容器。 - 前記貯留空間形成部は係合部を備え、
前記下蓋は、前記係合部に対して係合する被係合部を備える請求項2記載の容器。 - 前記貯留空間形成部は、前記吐出口が形成された容器本体と、当該容器本体に対して着脱自在な上蓋と、を備え、
前記上蓋は、前記進入部を備えると共に前記貯留空間形成部を搬送する搬送部に密着することで、前記進入路が形成された前記貯留空間形成部の内部をシールするためのシール面を備える請求項1ないし3のいずれか一つに記載の容器。 - 前記脆弱部は前記上蓋に設けられている請求項4記載の容器。
- 前記上蓋の下方における前記容器本体の側面には、当該容器本体の外方へ向けて突出すると共に当該側面と一体成形され、前記搬送部に把持されるように当該容器本体の周方向に沿った凸部が設けられる請求項4または5記載の容器。
- 前記脆弱部には局所的に凹部が設けられ、当該凹部の底部は、当該凹部の外側よりも厚さが小さい薄肉部をなす請求項1ないし6のいずれか一つに記載の容器。
- 前記脆弱部について、破壊強度が5N~40Nであり且つ破壊変位が4mm以下である請求項1ないし7のいずれか一つに記載の容器。
- 前記貯留空間形成部により囲まれる空間を前記脆弱部に臨む上方側空間と、前記貯留空間をなす下方側空間とに仕切る内蓋が設けられ、
前記内蓋には平面視で前記脆弱部と重ならない位置に、前記上方側空間と前記下方側空間とを連通させる貫通孔が設けられる請求項1ないし8のいずれか一つに記載の容器。 - 前記内蓋の外周面は、前記貯留空間形成部における内周面に接する接触部を備える請求項9記載の容器。
- 前記貯留空間形成部は、前記吐出口が形成された容器本体と、当該容器本体に対して着脱自在な上蓋と、を備え、
前記貯留空間形成部により囲まれる空間を前記脆弱部に臨む上方側空間と、前記貯留空間をなす下方側空間とに仕切る内蓋が設けられ、
前記内蓋は、前記上蓋の脆弱部を含む第1の面に向き合う第2の面を備え、
当該第2の面について、前記脆弱部に対向する領域がその周囲の領域よりも前記第1の面寄りに位置するように盛り上がる請求項1ないし3のいずれか一つに記載の容器。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021076528 | 2021-04-28 | ||
| JP2021076528 | 2021-04-28 | ||
| PCT/JP2022/016775 WO2022230613A1 (ja) | 2021-04-28 | 2022-03-31 | 容器 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022230613A1 JPWO2022230613A1 (ja) | 2022-11-03 |
| JPWO2022230613A5 JPWO2022230613A5 (ja) | 2024-03-05 |
| JP7558397B2 true JP7558397B2 (ja) | 2024-09-30 |
Family
ID=83848058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023517222A Active JP7558397B2 (ja) | 2021-04-28 | 2022-03-31 | 容器 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20240219839A1 (ja) |
| EP (1) | EP4331732A4 (ja) |
| JP (1) | JP7558397B2 (ja) |
| KR (1) | KR20240000554A (ja) |
| CN (1) | CN117178347A (ja) |
| TW (1) | TW202303713A (ja) |
| WO (1) | WO2022230613A1 (ja) |
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| JP2004172201A (ja) | 2002-11-18 | 2004-06-17 | Tokyo Electron Ltd | 基板処理装置及び基板処理方法 |
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-
2022
- 2022-03-31 EP EP22795529.1A patent/EP4331732A4/en active Pending
- 2022-03-31 KR KR1020237040076A patent/KR20240000554A/ko active Pending
- 2022-03-31 JP JP2023517222A patent/JP7558397B2/ja active Active
- 2022-03-31 WO PCT/JP2022/016775 patent/WO2022230613A1/ja not_active Ceased
- 2022-03-31 CN CN202280029628.7A patent/CN117178347A/zh active Pending
- 2022-03-31 US US18/557,744 patent/US20240219839A1/en active Pending
- 2022-04-19 TW TW111114792A patent/TW202303713A/zh unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002059055A (ja) | 2000-08-18 | 2002-02-26 | Tdk Corp | 液体材料吐出装置、当該装置における液体材料の温度制御装置および制御方法 |
| JP2004172201A (ja) | 2002-11-18 | 2004-06-17 | Tokyo Electron Ltd | 基板処理装置及び基板処理方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117178347A (zh) | 2023-12-05 |
| EP4331732A1 (en) | 2024-03-06 |
| JPWO2022230613A1 (ja) | 2022-11-03 |
| WO2022230613A1 (ja) | 2022-11-03 |
| KR20240000554A (ko) | 2024-01-02 |
| US20240219839A1 (en) | 2024-07-04 |
| EP4331732A4 (en) | 2025-07-30 |
| TW202303713A (zh) | 2023-01-16 |
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