JP7499186B2 - マスクプレートおよびその製造方法 - Google Patents

マスクプレートおよびその製造方法 Download PDF

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JP7499186B2
JP7499186B2 JP2020560749A JP2020560749A JP7499186B2 JP 7499186 B2 JP7499186 B2 JP 7499186B2 JP 2020560749 A JP2020560749 A JP 2020560749A JP 2020560749 A JP2020560749 A JP 2020560749A JP 7499186 B2 JP7499186 B2 JP 7499186B2
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mask plate
opening region
opening
region
pattern
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Japanese (ja)
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JP2022503355A (ja
JP2022503355A5 (https=
JPWO2020098645A5 (https=
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▲珊▼▲珊▼ 白
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BOE Technology Group Co Ltd
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BOE Technology Group Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
JP2020560749A 2018-11-12 2019-11-12 マスクプレートおよびその製造方法 Active JP7499186B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201811338402.7A CN109207920B (zh) 2018-11-12 2018-11-12 掩模版
CN201811338402.7 2018-11-12
PCT/CN2019/117513 WO2020098645A1 (zh) 2018-11-12 2019-11-12 掩膜板及其制造方法

Publications (4)

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JP2022503355A JP2022503355A (ja) 2022-01-12
JP2022503355A5 JP2022503355A5 (https=) 2022-11-17
JPWO2020098645A5 JPWO2020098645A5 (https=) 2022-11-17
JP7499186B2 true JP7499186B2 (ja) 2024-06-13

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JP2020560749A Active JP7499186B2 (ja) 2018-11-12 2019-11-12 マスクプレートおよびその製造方法

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US (1) US12221684B2 (https=)
EP (1) EP3882369A4 (https=)
JP (1) JP7499186B2 (https=)
CN (1) CN109207920B (https=)
WO (1) WO2020098645A1 (https=)

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CN110764362B (zh) * 2019-01-31 2020-12-29 昆山国显光电有限公司 掩膜条、阵列基板、显示屏及显示装置
CN110760791A (zh) * 2019-02-28 2020-02-07 云谷（固安）科技有限公司 掩膜板及掩膜组件
CN110760790A (zh) * 2019-02-28 2020-02-07 云谷（固安）科技有限公司 掩膜板及掩膜组件
KR102563190B1 (ko) * 2019-04-23 2023-08-02 애플 인크. 디스플레이 아래의 센서들의 성능을 개선하기 위한 방법 및 구성
KR102932280B1 (ko) * 2019-07-25 2026-02-27 삼성디스플레이 주식회사 표시 장치, 표시 장치의 제조장치 및 표시 장치의 제조방법
CN210916231U (zh) * 2019-10-18 2020-07-03 昆山国显光电有限公司 一种掩膜版
KR20210054644A (ko) * 2019-11-05 2021-05-14 삼성디스플레이 주식회사 마스크 어셈블리, 표시 장치의 제조장치, 및 표시 장치의 제조방법
US11805678B2 (en) 2019-11-21 2023-10-31 Samsung Display Co., Ltd. Display device, mask assembly, method of manufacturing the mask assembly, apparatus for manufacturing the display device, and method of manufacturing the display device
KR20210114594A (ko) 2020-03-10 2021-09-24 삼성디스플레이 주식회사 금속 마스크
CN113471136B (zh) * 2020-03-30 2024-10-22 中芯国际集成电路制造(上海)有限公司 半导体器件及形成方法
KR102836687B1 (ko) 2020-05-11 2025-07-22 삼성디스플레이 주식회사 마스크 검사 장치 및 이를 이용한 마스크 검사 방법
KR102741001B1 (ko) * 2020-05-14 2024-12-12 삼성디스플레이 주식회사 디스플레이 장치
US12419138B2 (en) * 2020-09-22 2025-09-16 Enkris Semiconductor, Inc. Method of manufacturing a semiconductor structure, which can be applied to full-color LED
CN112662994B (zh) * 2020-12-04 2023-04-25 合肥维信诺科技有限公司 掩膜版及其制备方法
CN115116959B (zh) * 2021-03-18 2024-11-15 长鑫存储技术有限公司 半导体结构及其形成方法
US11939658B2 (en) * 2021-04-09 2024-03-26 Dai Nippon Printing Co., Ltd. Deposition mask, deposition mask apparatus, deposition apparatus, and manufacturing method for organic device
KR102850627B1 (ko) * 2021-05-11 2025-08-26 삼성디스플레이 주식회사 마스크 조립체 및 디스플레이 장치의 제조방법
CN114107895A (zh) * 2021-11-26 2022-03-01 京东方科技集团股份有限公司 一种精细金属掩膜板及有机电致发光显示面板

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CN108642440A (zh) 2018-05-14 2018-10-12 昆山国显光电有限公司 掩膜板及掩膜组件

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Publication number Publication date
JP2022503355A (ja) 2022-01-12
WO2020098645A9 (zh) 2020-12-30
WO2020098645A1 (zh) 2020-05-22
EP3882369A4 (en) 2022-08-10
US20210301386A1 (en) 2021-09-30
EP3882369A1 (en) 2021-09-22
US12221684B2 (en) 2025-02-11
CN109207920A (zh) 2019-01-15
CN109207920B (zh) 2021-02-09

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