CN109207920B - 掩模版 - Google Patents

掩模版 Download PDF

Info

Publication number
CN109207920B
CN109207920B CN201811338402.7A CN201811338402A CN109207920B CN 109207920 B CN109207920 B CN 109207920B CN 201811338402 A CN201811338402 A CN 201811338402A CN 109207920 B CN109207920 B CN 109207920B
Authority
CN
China
Prior art keywords
opening area
density opening
low
reticle
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201811338402.7A
Other languages
English (en)
Chinese (zh)
Other versions
CN109207920A (zh
Inventor
白珊珊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to CN201811338402.7A priority Critical patent/CN109207920B/zh
Publication of CN109207920A publication Critical patent/CN109207920A/zh
Priority to US16/770,183 priority patent/US12221684B2/en
Priority to EP19884926.7A priority patent/EP3882369A4/en
Priority to JP2020560749A priority patent/JP7499186B2/ja
Priority to PCT/CN2019/117513 priority patent/WO2020098645A1/zh
Application granted granted Critical
Publication of CN109207920B publication Critical patent/CN109207920B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
CN201811338402.7A 2018-11-12 2018-11-12 掩模版 Active CN109207920B (zh)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN201811338402.7A CN109207920B (zh) 2018-11-12 2018-11-12 掩模版
US16/770,183 US12221684B2 (en) 2018-11-12 2019-11-12 Mask plate and manufacturing method thereof
EP19884926.7A EP3882369A4 (en) 2018-11-12 2019-11-12 MASK AND ITS MANUFACTURING METHOD
JP2020560749A JP7499186B2 (ja) 2018-11-12 2019-11-12 マスクプレートおよびその製造方法
PCT/CN2019/117513 WO2020098645A1 (zh) 2018-11-12 2019-11-12 掩膜板及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811338402.7A CN109207920B (zh) 2018-11-12 2018-11-12 掩模版

Publications (2)

Publication Number Publication Date
CN109207920A CN109207920A (zh) 2019-01-15
CN109207920B true CN109207920B (zh) 2021-02-09

Family

ID=64995490

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811338402.7A Active CN109207920B (zh) 2018-11-12 2018-11-12 掩模版

Country Status (5)

Country Link
US (1) US12221684B2 (https=)
EP (1) EP3882369A4 (https=)
JP (1) JP7499186B2 (https=)
CN (1) CN109207920B (https=)
WO (1) WO2020098645A1 (https=)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109207920B (zh) 2018-11-12 2021-02-09 京东方科技集团股份有限公司 掩模版
CN109487206B (zh) * 2018-12-11 2020-08-11 武汉华星光电半导体显示技术有限公司 掩膜版及采用该掩膜版的掩膜装置
CN110764362B (zh) * 2019-01-31 2020-12-29 昆山国显光电有限公司 掩膜条、阵列基板、显示屏及显示装置
CN110760791A (zh) * 2019-02-28 2020-02-07 云谷（固安）科技有限公司 掩膜板及掩膜组件
CN110760790A (zh) * 2019-02-28 2020-02-07 云谷（固安）科技有限公司 掩膜板及掩膜组件
KR102563190B1 (ko) * 2019-04-23 2023-08-02 애플 인크. 디스플레이 아래의 센서들의 성능을 개선하기 위한 방법 및 구성
KR102932280B1 (ko) * 2019-07-25 2026-02-27 삼성디스플레이 주식회사 표시 장치, 표시 장치의 제조장치 및 표시 장치의 제조방법
CN210916231U (zh) * 2019-10-18 2020-07-03 昆山国显光电有限公司 一种掩膜版
KR20210054644A (ko) * 2019-11-05 2021-05-14 삼성디스플레이 주식회사 마스크 어셈블리, 표시 장치의 제조장치, 및 표시 장치의 제조방법
US11805678B2 (en) 2019-11-21 2023-10-31 Samsung Display Co., Ltd. Display device, mask assembly, method of manufacturing the mask assembly, apparatus for manufacturing the display device, and method of manufacturing the display device
KR20210114594A (ko) 2020-03-10 2021-09-24 삼성디스플레이 주식회사 금속 마스크
CN113471136B (zh) * 2020-03-30 2024-10-22 中芯国际集成电路制造(上海)有限公司 半导体器件及形成方法
KR102836687B1 (ko) 2020-05-11 2025-07-22 삼성디스플레이 주식회사 마스크 검사 장치 및 이를 이용한 마스크 검사 방법
KR102741001B1 (ko) * 2020-05-14 2024-12-12 삼성디스플레이 주식회사 디스플레이 장치
US12419138B2 (en) * 2020-09-22 2025-09-16 Enkris Semiconductor, Inc. Method of manufacturing a semiconductor structure, which can be applied to full-color LED
CN112662994B (zh) * 2020-12-04 2023-04-25 合肥维信诺科技有限公司 掩膜版及其制备方法
CN115116959B (zh) * 2021-03-18 2024-11-15 长鑫存储技术有限公司 半导体结构及其形成方法
US11939658B2 (en) * 2021-04-09 2024-03-26 Dai Nippon Printing Co., Ltd. Deposition mask, deposition mask apparatus, deposition apparatus, and manufacturing method for organic device
KR102850627B1 (ko) * 2021-05-11 2025-08-26 삼성디스플레이 주식회사 마스크 조립체 및 디스플레이 장치의 제조방법
CN114107895A (zh) * 2021-11-26 2022-03-01 京东方科技集团股份有限公司 一种精细金属掩膜板及有机电致发光显示面板

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108269837A (zh) * 2018-01-23 2018-07-10 京东方科技集团股份有限公司 一种电致发光显示面板、掩膜板及制作方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3878904B2 (ja) * 2002-10-29 2007-02-07 京セラ株式会社 スクリーン印刷用マスク及びそれを用いた電子部品の製造方法
JP5262226B2 (ja) * 2007-08-24 2013-08-14 大日本印刷株式会社 蒸着マスクおよび蒸着マスクの製造方法
CN103190005A (zh) * 2010-11-04 2013-07-03 皇家飞利浦电子股份有限公司 基于结晶弛豫结构的固态发光器件
NO334241B1 (no) * 2011-05-18 2014-01-20 Aker Subsea As Koblingsanordning
CN103205687B (zh) * 2012-01-16 2016-03-02 昆山允升吉光电科技有限公司 蒸镀掩模板及其制作方法
JP2014194062A (ja) * 2013-03-29 2014-10-09 Sony Corp マスクフレームユニット、マスク装置及び処理方法
KR102160695B1 (ko) 2013-05-10 2020-09-29 삼성디스플레이 주식회사 마스크
KR102106336B1 (ko) * 2013-07-08 2020-06-03 삼성디스플레이 주식회사 증착용 마스크
KR102237428B1 (ko) * 2014-02-14 2021-04-08 삼성디스플레이 주식회사 마스크 프레임 조립체 및 그 제조방법
CN204434717U (zh) 2014-12-05 2015-07-01 信利（惠州）智能显示有限公司 一种掩膜板
KR102404576B1 (ko) * 2015-04-24 2022-06-03 삼성디스플레이 주식회사 마스크 프레임 조립체, 그 제조 방법 및 표시 장치의 제조 방법
TWI550108B (zh) * 2015-04-28 2016-09-21 友達光電股份有限公司 遮罩
CN105803389B (zh) * 2016-05-18 2019-01-22 京东方科技集团股份有限公司 掩膜板及其制作方法
CN106294935B (zh) * 2016-07-28 2019-08-20 上海华力微电子有限公司 一种基于图形密度的工艺模型建模与修正方法
KR102632617B1 (ko) * 2016-08-08 2024-02-02 삼성디스플레이 주식회사 마스크 조립체, 이를 이용한 표시 장치의 제조장치, 이를 이용한 표시 장치의 제조방법 및 표시 장치
KR102642345B1 (ko) * 2016-09-06 2024-02-29 삼성디스플레이 주식회사 분할 마스크
WO2018139822A1 (ko) * 2017-01-24 2018-08-02 주식회사 다원시스 반도체 도너 기판과, 반도체 도너 기판의 제조 방법과, 유기 발광 장치의 제조 방법 및 도너 기판 모듈
CN108666420B (zh) * 2017-03-27 2021-01-22 京东方科技集团股份有限公司 掩模板及其制作方法
CN107740065B (zh) * 2017-09-26 2020-03-31 京东方科技集团股份有限公司 一种掩模版及其成膜方法、成膜设备
CN107435131B (zh) * 2017-09-29 2019-08-02 上海天马微电子有限公司 掩膜装置、蒸镀设备以及掩膜装置制备方法
CN107885030B (zh) * 2017-12-01 2021-02-26 信利（惠州）智能显示有限公司 掩膜板
CN208013662U (zh) * 2018-03-30 2018-10-26 昆山国显光电有限公司 显示面板及制作显示面板用掩模板
CN108642440B (zh) 2018-05-14 2019-09-17 昆山国显光电有限公司 掩膜板及掩膜组件
CN109207920B (zh) 2018-11-12 2021-02-09 京东方科技集团股份有限公司 掩模版

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108269837A (zh) * 2018-01-23 2018-07-10 京东方科技集团股份有限公司 一种电致发光显示面板、掩膜板及制作方法

Also Published As

Publication number Publication date
JP7499186B2 (ja) 2024-06-13
JP2022503355A (ja) 2022-01-12
WO2020098645A9 (zh) 2020-12-30
WO2020098645A1 (zh) 2020-05-22
EP3882369A4 (en) 2022-08-10
US20210301386A1 (en) 2021-09-30
EP3882369A1 (en) 2021-09-22
US12221684B2 (en) 2025-02-11
CN109207920A (zh) 2019-01-15

Similar Documents

Publication Publication Date Title
CN109207920B (zh) 掩模版
TWI728777B (zh) 顯示面板
US9975134B2 (en) Deposition mask and method of manufacturing the same
KR20220038308A (ko) 증착용마스크 및 이를 이용한 oled 패널
CN110838505B (zh) 显示结构和显示装置
CN108365134B (zh) 掩模板及其制造方法、掩模装置、蒸镀方法
CN110783498B (zh) 一种掩膜板组件及其制备方法、电致发光显示面板
KR102373442B1 (ko) 박막증착용 마스크와, 이의 제조방법
CN109487206B (zh) 掩膜版及采用该掩膜版的掩膜装置
US20210336147A1 (en) Mask
CN105789223B (zh) 一种阵列基板及其制作方法、显示面板、显示装置
CN110098239B (zh) 像素结构、显示基板、掩模板及蒸镀方法
CN110863176A (zh) 一种掩膜版及其制作方法、显示面板
CN107829065A (zh) 一种开口掩膜板、母板及其制备方法、基板、显示装置
WO2019153804A1 (en) Phase shift mask, array substrate, fabrication method thereof and display apparatus
CN110098232A (zh) Oled显示面板
CN110423983B (zh) 掩膜版
WO2022022072A1 (zh) 显示基板、显示面板及显示装置
KR101504544B1 (ko) 패턴 형성용 마스크 및 이를 이용한 패턴 형성 방법
WO2022082428A1 (zh) 掩膜组件及其制造方法、显示面板、显示装置
WO2019184911A1 (zh) 柔性显示面板及其制作方法、显示装置
JP2009116068A (ja) カラーフィルタの製造方法及びカラーフィルタ
CN105137516A (zh) 一种彩色滤光片及其制备方法和显示母板
US8013524B2 (en) Organic EL display
CN113675249A (zh) 显示面板和显示装置

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant