JP7475012B2 - 樹脂組成物 - Google Patents
樹脂組成物 Download PDFInfo
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- JP7475012B2 JP7475012B2 JP2022521594A JP2022521594A JP7475012B2 JP 7475012 B2 JP7475012 B2 JP 7475012B2 JP 2022521594 A JP2022521594 A JP 2022521594A JP 2022521594 A JP2022521594 A JP 2022521594A JP 7475012 B2 JP7475012 B2 JP 7475012B2
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- epoxy resin
- resin composition
- epoxy resins
- type epoxy
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- 239000011342 resin composition Substances 0.000 title claims description 53
- 239000003822 epoxy resin Substances 0.000 claims description 120
- 229920000647 polyepoxide Polymers 0.000 claims description 120
- 239000003795 chemical substances by application Substances 0.000 claims description 32
- 238000013007 heat curing Methods 0.000 claims description 22
- -1 phthalic acid modified epoxy resins Chemical class 0.000 claims description 21
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 20
- 239000000126 substance Substances 0.000 claims description 17
- 239000000654 additive Substances 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- 150000001875 compounds Chemical class 0.000 claims description 11
- XNGIFLGASWRNHJ-UHFFFAOYSA-N o-dicarboxybenzene Natural products OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 claims description 10
- 230000000996 additive effect Effects 0.000 claims description 9
- 125000004450 alkenylene group Chemical group 0.000 claims description 9
- 125000002947 alkylene group Chemical group 0.000 claims description 9
- 125000004432 carbon atom Chemical group C* 0.000 claims description 9
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 9
- 239000011521 glass Substances 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 8
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 claims description 7
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 6
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims description 6
- 229920003986 novolac Polymers 0.000 claims description 6
- 125000000962 organic group Chemical group 0.000 claims description 6
- 125000000524 functional group Chemical group 0.000 claims description 5
- LWNGJAHMBMVCJR-UHFFFAOYSA-N (2,3,4,5,6-pentafluorophenoxy)boronic acid Chemical compound OB(O)OC1=C(F)C(F)=C(F)C(F)=C1F LWNGJAHMBMVCJR-UHFFFAOYSA-N 0.000 claims description 4
- 239000003517 fume Substances 0.000 claims description 4
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 claims description 4
- 230000004580 weight loss Effects 0.000 claims description 4
- LXKJVPYVHOYTPZ-UHFFFAOYSA-N (4-acetyloxyphenyl)-benzyl-methylsulfanium Chemical compound C=1C=C(OC(C)=O)C=CC=1[S+](C)CC1=CC=CC=C1 LXKJVPYVHOYTPZ-UHFFFAOYSA-N 0.000 claims description 3
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 claims description 3
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims description 3
- IXLWEDFOKSJYBD-UHFFFAOYSA-M 1-ethyl-3-methylimidazol-3-ium;methanesulfonate Chemical compound CS([O-])(=O)=O.CC[N+]=1C=CN(C)C=1 IXLWEDFOKSJYBD-UHFFFAOYSA-M 0.000 claims description 3
- SHKUUQIDMUMQQK-UHFFFAOYSA-N 2-[4-(oxiran-2-ylmethoxy)butoxymethyl]oxirane Chemical compound C1OC1COCCCCOCC1CO1 SHKUUQIDMUMQQK-UHFFFAOYSA-N 0.000 claims description 3
- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 claims description 3
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 claims description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims description 3
- MECNWXGGNCJFQJ-UHFFFAOYSA-N 3-piperidin-1-ylpropane-1,2-diol Chemical compound OCC(O)CN1CCCCC1 MECNWXGGNCJFQJ-UHFFFAOYSA-N 0.000 claims description 3
- FAUAZXVRLVIARB-UHFFFAOYSA-N 4-[[4-[bis(oxiran-2-ylmethyl)amino]phenyl]methyl]-n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC(CC=2C=CC(=CC=2)N(CC2OC2)CC2OC2)=CC=1)CC1CO1 FAUAZXVRLVIARB-UHFFFAOYSA-N 0.000 claims description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N Bisphenol A Natural products C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000002202 Polyethylene glycol Substances 0.000 claims description 3
- XUCHXOAWJMEFLF-UHFFFAOYSA-N bisphenol F diglycidyl ether Chemical compound C1OC1COC(C=C1)=CC=C1CC(C=C1)=CC=C1OCC1CO1 XUCHXOAWJMEFLF-UHFFFAOYSA-N 0.000 claims description 3
- 229930003836 cresol Natural products 0.000 claims description 3
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 claims description 3
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- 239000004843 novolac epoxy resin Substances 0.000 claims description 3
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 claims description 3
- 229920003192 poly(bis maleimide) Polymers 0.000 claims description 3
- 229920001223 polyethylene glycol Polymers 0.000 claims description 3
- 229920001451 polypropylene glycol Polymers 0.000 claims description 3
- 125000001453 quaternary ammonium group Chemical group 0.000 claims description 3
- PYVOHVLEZJMINC-UHFFFAOYSA-N trihexyl(tetradecyl)phosphanium Chemical group CCCCCCCCCCCCCC[P+](CCCCCC)(CCCCCC)CCCCCC PYVOHVLEZJMINC-UHFFFAOYSA-N 0.000 claims description 3
- 125000001931 aliphatic group Chemical group 0.000 claims description 2
- 125000004122 cyclic group Chemical group 0.000 claims description 2
- MGFYSGNNHQQTJW-UHFFFAOYSA-N iodonium Chemical compound [IH2+] MGFYSGNNHQQTJW-UHFFFAOYSA-N 0.000 claims description 2
- 230000009974 thixotropic effect Effects 0.000 claims description 2
- 238000002834 transmittance Methods 0.000 claims description 2
- 238000001723 curing Methods 0.000 description 21
- 239000000203 mixture Substances 0.000 description 16
- 238000006243 chemical reaction Methods 0.000 description 15
- 239000000047 product Substances 0.000 description 14
- 230000001070 adhesive effect Effects 0.000 description 12
- 239000000853 adhesive Substances 0.000 description 11
- 230000000704 physical effect Effects 0.000 description 9
- 239000004593 Epoxy Substances 0.000 description 8
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 125000003700 epoxy group Chemical group 0.000 description 4
- 239000004848 polyfunctional curative Substances 0.000 description 4
- 150000001412 amines Chemical class 0.000 description 3
- 230000001588 bifunctional effect Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000012776 electronic material Substances 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- HHRACYLRBOUBKM-UHFFFAOYSA-N 2-[(4-tert-butylphenoxy)methyl]oxirane Chemical compound C1=CC(C(C)(C)C)=CC=C1OCC1OC1 HHRACYLRBOUBKM-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- OECTYKWYRCHAKR-UHFFFAOYSA-N 4-vinylcyclohexene dioxide Chemical compound C1OC1C1CC2OC2CC1 OECTYKWYRCHAKR-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- JNFRNXKCODJPMC-UHFFFAOYSA-N aniline;boric acid Chemical compound OB(O)O.NC1=CC=CC=C1 JNFRNXKCODJPMC-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000012769 display material Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 230000003203 everyday effect Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000004817 gas chromatography Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- QCGKUFZYSPBMAY-UHFFFAOYSA-N methyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1C(C(=O)OC)CCC2OC21 QCGKUFZYSPBMAY-UHFFFAOYSA-N 0.000 description 1
- 239000003094 microcapsule Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/36—Epoxy compounds containing three or more epoxy groups together with mono-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4078—Curing agents not provided for by the groups C08G59/42 - C08G59/66 boron containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/72—Complexes of boron halides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Epoxy Resins (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Graft Or Block Polymers (AREA)
Description
X3及びX4はそれぞれ独立して置換もしくは無置換の炭素数1~100のアルキレン又はアルケニレンであり、
kは1~10の整数であり、
p及びqはそれぞれ独立して0~10の整数である。)
本発明における第1エポキシ樹脂は、エポキシ基が1つ含まれている1~4官能性エポキシ樹脂であって、高信頼性を与え、組成物の硬化構造に寄与し、ディスプレイの各基板間の応力を解消するうえ、チップと基板への接着力を高める役割を果たす。
本発明における第2エポキシ樹脂は、エポキシ基が1つ含まれている1~4官能性エポキシ樹脂、又はエポキシ基が3つ以上含まれている多官能性エポキシ樹脂であって、高信頼性を与えながら組成物の硬化構造に寄与し、ディスプレイの各基板間の応力を解消し、チップと基板への接着力を高め、製品に透明度を向上させるうえ、高透明性を提供する役割を果たす。
本発明における熱硬化剤は、熱硬化性ポリマーであってエポキシ樹脂の機能発揮のためのものであり、前記熱硬化剤は、硬化反応を介して、エポキシ樹脂が保有した固有の特性を発現させる役割を果たす。
本発明による樹脂組成物は、第1エポキシ化合物、第2エポキシ化合物及び熱硬化剤を含むが、必要に応じて添加剤をさらに含むことができる。
第1エポキシ樹脂と第2エポキシ樹脂をプラネタリーミキサーに添加し、互いに均一性相となるように2時間常温及び常圧で攪拌した後、熱硬化剤と添加剤を定量した。熱硬化剤又は熱硬化剤/添加剤混合物を添加してから2時間、常温、常圧で攪拌した。その後、真空で脱泡した後、粘稠性の液体を得た。実施例1~8、比較例に使用した各成分及び配合比含有量(重量部)は、下記表1に示す。
A-2:2官能液状エポキシ樹脂、ホルムアルデヒド・フェノール重合物のグリシジルエーテル(Phenol, polymer with formaldehyde, glycidyl ether)
B-1:2官能液状エポキシ樹脂、(3’,4’-エポキシシクロヘキサン)メチル3,4-エポキシシクロヘキシルカルボキシレート(3’,4’-Epoxycyclohexane)methyl 3,4-epoxycyclohexylcarboxylate)
B-2:3官能液状エポキシ樹脂、2,2-ビス(ヒドロキシメチル)-1-ブタノールの1,2-エポキシ-4-(2-オキシラニル)シクロヘキサン(1,2-epoxy-4-(2-oxiranyl)cyclohexane of 2,2-bis(hydroxy methyl)-1-butanol)
B-3:1官能液状エポキシ樹脂、p-第三級ブチルフェニルグリシジルエーテル(p-tertiary butyl phenyl glycidyl ether)
C:熱硬化剤、フェニルアミンボレート(Phenyl amine borate)
D:添加剤、モノ[p-(α-メチルベンジル)]エーテルグリコールポリエチレン(Mono[p-(alpha-methylbenzyl)]ether glycol polyethylene)
前記実施例1~8で製造された樹脂組成物、及び比較例で製造された樹脂組成物の硬化物外観、粘度、接着力、屈折率、耐湿性、安定性(25℃)、安定性(40℃)を以下の基準に従って評価した。その結果を表2に示す。
2.粘度:ブルックフィールドDV2T粘度計、コーンアンドプレート型CPA-51Zスピンドルを用いて、25±5℃で測定し、30分を据え置いた後、粘度計チャンバーにスケールが発生せず、300~500mpa・sの間であれば、粘度数値を記載。
3.接着力:76mm×26mm×3mmのガラス板に樹脂組成物0.01gを塗布した後、圧着し、100℃、50分に調整されたオーブンで硬化させ、しかる後に、UTMで接着力を測定し、2kgf/cm2以上であればOと表記し、2kgf/cm2未満であればXと表記。
4.屈折率:樹脂組成物に対して25±5℃でアッベ屈折計によって屈折率を測定。
5.耐湿性:樹脂組成物をガラス板に0.01gを塗布した後、100℃、50分に調整されたオーブンで硬化させて試験片を作製し、試験片を85℃、85%のチャンバー内に静置した後、7日間放置して組成物とガラス板との間或いは組成物同士の間に割れが生じなければOと記載し、割れが生じればXと記載。
6.安定性(25℃):ゴム栓でシールされたガラス瓶に樹脂組成物と窒素ガスを充填し、25±5℃で放置し、7日単位で粘度を測定し、粘度変化率が初期粘度に対して1.2倍以下であれば記載する。
7.安定性(40℃):ゴム栓でシールされたガラス瓶に樹脂組成物と窒素ガスを充填し、40±5℃で放置し、1日単位で粘度を測定し、粘度変化率が初期粘度に対して1.2倍以下であれば記載する。
8.重量損失:ペトリ皿に樹脂組成物を1g秤量し、YMRTC社製の高真空オーブン(モデル名:VC-500S)チャンバーに入れた後、25℃で2時間減圧を行う。
秤量した樹脂組成物をA(g)として測定し、減圧が進んだ樹脂をB(g)として測定し、重量損失(%)を{100-(B/A)×100}で計算して記載する。
9.ヒュームの評価:樹脂組成物を、両面の離型紙を敷いて300μmのガラス厚さでコーティングし、露光機を用いて硬化させた後、フィルムを得た。
Gas-chromatography装備(島津製作所製のQP2010 Ultra)内で得られたフィルムを入れた後、装備を100℃で1時間放置し、放置の前と後に捕集されたヒュームの重量を測定して記載する。
Claims (12)
- 第1エポキシ樹脂、第2エポキシ樹脂及び熱硬化剤を含む樹脂組成物であって、
前記樹脂組成物は、フィルムに製造した後、400nm~780nmの波長範囲にてスペクトロメータで測定したときの透過率が90%以上であり、屈折計で測定したときの屈折指数(Refractive Index)が1.4以上であり、
前記第1エポキシ樹脂が、2~4官能性エポキシ樹脂であり、
前記第2エポキシ樹脂が、2~4官能性エポキシ樹脂であり、
前記樹脂組成物は第1エポキシ樹脂10~30重量部と第2エポキシ樹脂70~90重量部とを含み、前記熱硬化剤は0.5~1.4重量部を含み、
前記第1エポキシ樹脂は、下記化学式1で表される化合物を含み、
前記第2エポキシ樹脂は、下記化学式2で表される化合物を含むエポキシ樹脂を含む樹脂組成物。
- 前記樹脂組成物は、粘度計によって25度、5rpmの速度条件で測定したときに粘度(Viscosity)が10cPs~100000cPsであり、チクソ性指数(Thixotropic Index)が1~3であることを特徴とする、請求項1に記載の樹脂組成物。
- 前記樹脂組成物は、重量損失(weight loss)が1%未満であることを特徴とする、請求項1に記載の樹脂組成物。
- 前記樹脂組成物は、両面に離型紙を敷いて300μmのガラス厚さでコーティングを行い、露光機を用いて硬化させた後、コンベクションオーブン(Convection oven)を用いて90度で1時間放置し、放置の前と後に重量を測定した結果、ヒュームが1%以下であることを特徴とする、請求項1に記載の樹脂組成物。
- 前記第2エポキシ樹脂は、フタル酸変形エポキシ樹脂、透明構造を有するフタル酸変形エポキシ樹脂、透明構造を有するポリプロピレングリコール付加型エポキシ樹脂、透明構造を有するポリエチレングリコール付加型エポキシ樹脂、及びシクロ脂肪族樹脂よりなる群から選択された少なくとも1種をさらに含むことを特徴とする、請求項1に記載の樹脂組成物。
- 前記透明構造は、置換もしくは無置換の炭素数10~100のアルキレン基又はアルケニレン基又は環状脂肪族炭化水素基のうちのいずれか一つの成分で製造されたことを特徴とする、請求項5に記載の樹脂組成物。
- 前記第1エポキシ樹脂は、ビスフェノールFジグリシジルエーテル型エポキシ樹脂、ビスフェノールAジグリシジルエーテル型エポキシ樹脂、ポリオレフィン付加ビスフェノールAジグリシジルエーテル型エポキシ樹脂、ポリオレフィン付加ビスフェノールFジグリシジル型エポキシ樹脂、1,6-ヘキサンジオールジグリシジルエーテル型エポキシ樹脂、1,4-ブタンジオールジグリシジルエーテル型エポキシ樹脂、及びシクロ脂肪族ジグリシジルエーテル型エポキシ樹脂よりなる群から選択された少なくとも1種を含むことを特徴とする、請求項1に記載の樹脂組成物。
- 前記第2エポキシ樹脂は、3~4官能基の多官能性エポキシ樹脂であって、前記3~4官能基の多官能性エポキシ樹脂は、フェノールノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、ビスフェノールA変性型フェノールノボラックエポキシ樹脂、液状ビスマレイイミド付加型エポキシ樹脂、トリメチロールプロパントリグリシジルエーテル型エポキシ樹脂、多価シクロ脂肪族エポキシ樹脂、トリグリシジルイソシアヌレート型エポキシ樹脂、アミノフェノール付加ジグリシジルエーテル型エポキシ樹脂、N,N,N’,N’-テトラグリシジル-4,4’-メチレンビスベンゼンアミン樹脂、及び多価型オキセタン樹脂よりなる群から選択された少なくとも1種をさらに含むことを特徴とする、請求項1に記載の樹脂組成物。
- 前記熱硬化剤は、テトラデシル(トリヘキシル)ホスホニウムジシアンジアミド、1-ブチル-3-メチルイミダゾリウムテトラフルオロボレート、1-エチル-3-メチルイミダゾリウムテトラフルオロボレート、1-エチル-3-メチルイミダゾリウムメタンスルホネート、トリルクミルヨードニウムテトラキス(ペンタフルオロフェニル)ボレート、オプトンCP-66、オプトンCP-77(株式会社ADEKA製、日本)、2-エチル-4メチルイミダゾリウムテトラフェニルボレート、テトラフェニルホスホニウムテトラフェニルボレート、第四級アンモニウムボレート、(4-アセトキシフェニル)ベンジル(メチル)スルホニウム、テトラキス(ペンタフルオロフェニル)ボレート、SI-B2、SI-B3、SI-B3A、SI-B4及びSI-B7(サムシン化学工業(株)製、韓国)よりなる群から選択された少なくとも1種を含むことを特徴とする、請求項1に記載の樹脂組成物。
- 前記熱硬化剤は、アジキュアMY-24、アジキュアMY-H、アジキュアPN-23、アジキュアPN-H、アジキュアPN-31、アジキュアPN-40、アジキュアPN-50、VDH、VDH-J、AH-154、ADH、DDH、SAH、IDH、SDH、LDH、UDH、アンカマイン2441、アンカマイン2442、アンカマイン2014AS、テクニキュアLC-80、テクニキュアLC-100、テクニキュアLC-214、テクニキュアMDU-11、テクニキュアPDU-250、テクニキュアIPDU-8、テクニキュアTDU-200、EH-4357、ノバキュアHX-3721、ノバキュアHX-3722、ノバキュアHX-3748、ノバキュアHX-3741、ノバキュアHX-3742、ノバキュアHX-3088、ノバキュアHX-3613、ノバキュアHX-3921HP、ノバキュアHX-3941HP、ノバキュアHX-3932HP、FXR-1081、FXR-1020、及びFXR-1060Iよりなる群から選択された少なくとも1種を含むことを特徴とする、請求項1に記載の樹脂組成物。
- 前記樹脂組成物は、0.1~10重量部の添加剤をさらに含むことを特徴とする、請求項1に記載の樹脂組成物。
- 前記樹脂組成物は、液状又はペースト状であることを特徴とする、請求項1に記載の樹脂組成物。
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