JP7440180B2 - 積層セラミックキャパシタ - Google Patents
積層セラミックキャパシタ Download PDFInfo
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- JP7440180B2 JP7440180B2 JP2020040225A JP2020040225A JP7440180B2 JP 7440180 B2 JP7440180 B2 JP 7440180B2 JP 2020040225 A JP2020040225 A JP 2020040225A JP 2020040225 A JP2020040225 A JP 2020040225A JP 7440180 B2 JP7440180 B2 JP 7440180B2
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- 239000003985 ceramic capacitor Substances 0.000 title claims description 48
- 238000007747 plating Methods 0.000 claims description 93
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 52
- 229910052759 nickel Inorganic materials 0.000 claims description 22
- 239000010949 copper Substances 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 12
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- 239000010936 titanium Substances 0.000 description 11
- 239000003990 capacitor Substances 0.000 description 9
- 239000010931 gold Substances 0.000 description 8
- 238000010304 firing Methods 0.000 description 7
- 239000000919 ceramic Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000011575 calcium Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- 239000010937 tungsten Substances 0.000 description 4
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 3
- 229910002113 barium titanate Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000003637 basic solution Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000002715 modification method Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
- H01G4/0085—Fried electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
- H01G4/302—Stacked capacitors obtained by injection of metal in cavities formed in a ceramic body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
Claims (15)
- 誘電体層及び前記誘電体層を挟んで配置される第1及び第2内部電極を含み、
第1方向に対向する第5及び第6面、第2方向に対向する第3及び第4面、第3方向に対向する第1及び第2面を含む本体と、
前記本体を貫通して前記第1内部電極と連結される第1貫通電極と、
前記本体を貫通して前記第2内部電極と連結される第2貫通電極と、
前記第1面及び第2面に配置され、前記第1貫通電極と連結される第1及び第2外部電極と、
前記第1及び第2外部電極から離隔し、前記第2貫通電極と連結される第3及び第4外部電極と、
を含み、
前記第1から第4外部電極はニッケルを含む焼成電極であり、前記焼成電極上に順次積層された第1めっき層及び第2めっき層をそれぞれ含み、
前記第1めっき層及び第2めっき層は前記本体の第3面及び第4面にそれぞれ延びて配置され、
前記第1外部電極の前記第1めっき層及び第2めっき層と前記第2外部電極の前記第1めっき層及び第2めっき層とは前記本体の第3面において互いに離隔し、
前記第3外部電極の前記第1めっき層及び第2めっき層と前記第4外部電極の前記第1めっき層及び第2めっき層とは前記本体の第4面において互いに離隔し、
前記第1及び第2内部電極はそれぞれビアホールを含み、
前記第1貫通電極は前記第2内部電極のビアホールを貫通し、
前記第2貫通電極は前記第1内部電極のビアホールを貫通する、積層セラミックキャパシタ。 - 前記焼成電極は、前記本体の第1面及び第2面のみに配置される、請求項1に記載の積層セラミックキャパシタ。
- 前記第1貫通電極は第1及び第2外部電極と接続する第1及び第4連結電極を含み、
前記第2貫通電極は第3及び第4外部電極と接続する第2及び第3連結電極を含む、請求項1または2に記載の積層セラミックキャパシタ。 - 第1及び第2内部電極は互いに点対称をなすT字型であり、
前記第1及び第4連結電極は第2内部電極の未配置領域を貫通し、
前記第2及び第3連結電極は第1内部電極の未配置領域を貫通する、請求項3に記載の積層セラミックキャパシタ。 - 第1及び第2内部電極は互いに点対称をなす長方形であり、
前記第1内部電極は第2及び第3ビアホールを含み、
前記第2内部電極は第1及び第4ビアホールを含み、
前記第1及び第4連結電極は第2内部電極の第1及び第4ビアホールを貫通し、
前記第2及び第3連結電極は第1内部電極の第2及び第3ビアホールを貫通する、請求項3に記載の積層セラミックキャパシタ。 - 前記第1ビアホールと第2ビアホールの間の幅D3に対する第1及び第4連結電極の間隔又は第2及び第3連結電極の間隔D1の割合(D1/D3)は2.08から4.7の範囲内である、請求項5に記載の積層セラミックキャパシタ。
- 前記第1ビアホールと第2ビアホールの間の幅D3に対する第1連結電極又は第2連結電極の直径D2の割合(D2/D3)は0.375から0.52の範囲内である、請求項5に記載の積層セラミックキャパシタ。
- 前記本体の厚さT1に対する、前記第1又は第2めっき層が前記本体の第3面及び第4面に延びた長さT2の割合(T2/T1)は1/3から2/5の範囲内である、請求項1から7のいずれか一項に記載の積層セラミックキャパシタ。
- 前記焼成電極は中心線平均粗さ(Ra)が1nmから100nmの範囲内である、請求項1から8のいずれか一項に記載の積層セラミックキャパシタ。
- 前記本体の第3面及び第4面に延びた第1めっき層の厚さをt2とし、前記焼成電極上に配置される第1めっき層の厚さをt1とするとき、t2≧t1の関係を満たす、請求項1から9のいずれか一項に記載の積層セラミックキャパシタ。
- 前記本体の第3面及び第4面に延びた第2めっき層の厚さをt4とし、前記第1めっき層上に配置される第2めっき層の厚さをt3とするとき、t4≧t3の関係を満たす、請求項1から10のいずれか一項に記載の積層セラミックキャパシタ。
- 前記第1めっき層はニッケルを含む、請求項1から11のいずれか一項に記載の積層セラミックキャパシタ。
- 前記第2めっき層は銅又はスズを含む、請求項1から12のいずれか一項に記載の積層セラミックキャパシタ。
- 前記第1及び第2内部電極はニッケルを含む、請求項1から13のいずれか一項に記載の積層セラミックキャパシタ。
- 前記第1及び第2貫通電極はニッケルを含む、請求項1から14のいずれか一項に記載の積層セラミックキャパシタ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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KR1020190094177A KR20190116145A (ko) | 2019-08-02 | 2019-08-02 | 적층 세라믹 커패시터 |
KR10-2019-0094177 | 2019-08-02 |
Publications (2)
Publication Number | Publication Date |
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JP2021027319A JP2021027319A (ja) | 2021-02-22 |
JP7440180B2 true JP7440180B2 (ja) | 2024-02-28 |
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JP2020040225A Active JP7440180B2 (ja) | 2019-08-02 | 2020-03-09 | 積層セラミックキャパシタ |
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US (2) | US11335510B2 (ja) |
JP (1) | JP7440180B2 (ja) |
KR (1) | KR20190116145A (ja) |
CN (2) | CN112309716B (ja) |
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JP2020136533A (ja) * | 2019-02-21 | 2020-08-31 | 株式会社村田製作所 | 積層セラミックコンデンサおよび積層セラミックコンデンサの実装構造 |
KR20190116122A (ko) * | 2019-07-04 | 2019-10-14 | 삼성전기주식회사 | 적층 세라믹 커패시터 |
KR102333086B1 (ko) | 2019-08-19 | 2021-12-01 | 삼성전기주식회사 | 적층 세라믹 커패시터 |
KR20190116145A (ko) * | 2019-08-02 | 2019-10-14 | 삼성전기주식회사 | 적층 세라믹 커패시터 |
JP2022149065A (ja) * | 2021-03-25 | 2022-10-06 | 太陽誘電株式会社 | 積層セラミック電子部品及び回路基板 |
CN113517137B (zh) * | 2021-07-15 | 2022-08-09 | 江门市东有科技有限公司 | 一种多层陶瓷电容器 |
CN115274300B (zh) * | 2022-08-26 | 2023-12-12 | 池州昀冢电子科技有限公司 | 一种多层陶瓷电容器 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014082434A (ja) | 2012-10-12 | 2014-05-08 | Samsung Electro-Mechanics Co Ltd | 積層セラミックキャパシタ |
US20150090485A1 (en) | 2013-10-01 | 2015-04-02 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor and board having the same |
US20150124371A1 (en) | 2013-11-06 | 2015-05-07 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor |
JP2019041093A (ja) | 2017-08-23 | 2019-03-14 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | キャパシタ部品及びその製造方法 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100905879B1 (ko) * | 2007-09-28 | 2009-07-03 | 삼성전기주식회사 | 적층형 캐패시터 |
JP2009147178A (ja) | 2007-12-14 | 2009-07-02 | Ngk Spark Plug Co Ltd | セラミック部品及びその製造方法、配線基板 |
JP2010123613A (ja) | 2008-11-17 | 2010-06-03 | Murata Mfg Co Ltd | セラミック電子部品及びセラミック電子部品の実装構造 |
JP5439954B2 (ja) * | 2009-06-01 | 2014-03-12 | 株式会社村田製作所 | 積層型電子部品およびその製造方法 |
JP5246215B2 (ja) * | 2010-07-21 | 2013-07-24 | 株式会社村田製作所 | セラミック電子部品及び配線基板 |
KR101497192B1 (ko) * | 2012-12-27 | 2015-02-27 | 삼성전기주식회사 | 전자부품 내장 인쇄회로기판 및 그 제조방법 |
KR101983154B1 (ko) * | 2013-11-05 | 2019-05-28 | 삼성전기주식회사 | 적층 세라믹 커패시터 |
KR101548814B1 (ko) * | 2013-11-08 | 2015-08-31 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 실장 기판 |
KR20140039016A (ko) * | 2014-02-27 | 2014-03-31 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 실장 기판 |
KR102016485B1 (ko) * | 2014-07-28 | 2019-09-02 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 실장 기판 |
US9881739B2 (en) * | 2014-09-30 | 2018-01-30 | Murata Manufacturing Co., Ltd. | Multilayer ceramic capacitor |
JP2016181663A (ja) | 2015-03-25 | 2016-10-13 | Tdk株式会社 | 積層コンデンサ |
JP2017216332A (ja) * | 2016-05-31 | 2017-12-07 | 株式会社村田製作所 | セラミックコンデンサ |
KR20180007865A (ko) * | 2016-07-14 | 2018-01-24 | 삼성전기주식회사 | 적층형 커패시터 및 그 실장 기판 |
KR101867982B1 (ko) * | 2016-07-20 | 2018-06-18 | 삼성전기주식회사 | 커패시터 및 그 실장 기판 |
US10395827B2 (en) * | 2016-09-28 | 2019-08-27 | Murata Manufacturing Co., Ltd. | Electronic component |
JP2018088451A (ja) * | 2016-11-28 | 2018-06-07 | 株式会社村田製作所 | 積層セラミックコンデンサ |
JP6933090B2 (ja) | 2017-10-30 | 2021-09-08 | Tdk株式会社 | 電子部品 |
WO2019183045A1 (en) * | 2018-03-20 | 2019-09-26 | Avx Corporation | Vertical electrode decoupling/bypass capacitor |
JP7103835B2 (ja) * | 2018-04-24 | 2022-07-20 | 太陽誘電株式会社 | 積層セラミック電子部品及びその製造方法、並びに回路基板 |
KR102137783B1 (ko) * | 2018-09-18 | 2020-07-24 | 삼성전기주식회사 | 세라믹 전자 부품 |
KR20190116122A (ko) | 2019-07-04 | 2019-10-14 | 삼성전기주식회사 | 적층 세라믹 커패시터 |
KR20190116145A (ko) * | 2019-08-02 | 2019-10-14 | 삼성전기주식회사 | 적층 세라믹 커패시터 |
-
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014082434A (ja) | 2012-10-12 | 2014-05-08 | Samsung Electro-Mechanics Co Ltd | 積層セラミックキャパシタ |
US20150090485A1 (en) | 2013-10-01 | 2015-04-02 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor and board having the same |
US20150124371A1 (en) | 2013-11-06 | 2015-05-07 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor |
JP2019041093A (ja) | 2017-08-23 | 2019-03-14 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | キャパシタ部品及びその製造方法 |
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US11763995B2 (en) | 2023-09-19 |
CN112309716B (zh) | 2022-11-01 |
US11335510B2 (en) | 2022-05-17 |
JP2021027319A (ja) | 2021-02-22 |
CN112309716A (zh) | 2021-02-02 |
KR20190116145A (ko) | 2019-10-14 |
US20220230811A1 (en) | 2022-07-21 |
US20210035739A1 (en) | 2021-02-04 |
CN115472432A (zh) | 2022-12-13 |
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