JP7418169B2 - レーザー加工装置 - Google Patents
レーザー加工装置 Download PDFInfo
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- JP7418169B2 JP7418169B2 JP2019155067A JP2019155067A JP7418169B2 JP 7418169 B2 JP7418169 B2 JP 7418169B2 JP 2019155067 A JP2019155067 A JP 2019155067A JP 2019155067 A JP2019155067 A JP 2019155067A JP 7418169 B2 JP7418169 B2 JP 7418169B2
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
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- B23K2101/40—Semiconductor devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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Description
まず、本発明の実施形態に係るレーザー加工装置1の構成について図面に基づいて説明する。図1は、実施形態に係るレーザー加工装置1の構成例を示す斜視図である。図2は、図1に示されたレーザー加工装置1のレーザービーム照射ユニット20の構成を模式的に示す模式図である。図3は、実施形態に係る出力測定ユニット24による測定値の一例を示す模式的なグラフである。図4は、図3に示す測定値についてパルス発振のゲート信号811と同期させた場合の測定値の一例を示す模式的なグラフである。図5は、実施形態に係る出力測定ユニット24による漏れ光31の測定位置の一例を示す模式図である。以下の説明において、X軸方向は、水平面における一方向である。Y軸方向は、水平面において、X軸方向に直交する方向である。Z軸方向は、X軸方向およびY軸方向に直交する方向である。実施形態のレーザー加工装置1は、加工送り方向がX軸方向であり、割り出し送り方向がY軸方向である。
10 チャックテーブル
20 レーザービーム照射ユニット
21 レーザー発振器
22 ミラー
23 集光レンズ
24 出力測定ユニット
25 波長選択フィルタ
30 レーザービーム
31 漏れ光
32 集光点
40 加工送りユニット
50 割り出し送りユニット
60 撮像ユニット
70 表示ユニット
80 制御部
81 信号生成部
82 信号同期部
83 合否判定部
84 警告報知部
85 記録部
100 被加工物
Claims (7)
- 被加工物を保持するチャックテーブルと、
該チャックテーブルに保持された被加工物にパルス状のレーザービームを照射するレーザービーム照射ユニットと、
該チャックテーブルと該レーザービーム照射ユニットとを相対的に加工送りする加工送りユニットと、
該チャックテーブルと該レーザービーム照射ユニットとを相対的に割り出し送りする割り出し送りユニットと、
制御部と、
を備えるレーザー加工装置であって、
該レーザービーム照射ユニットは、
レーザー発振器と、
該レーザー発振器から発振されたレーザービームを反射して加工点へと伝播する複数のミラーと、
各々の該ミラーで反射されずに透過したレーザービームの漏れ光の出力を測定する複数の出力測定ユニットと、
複数の該ミラーによって伝播されたレーザービームを集光して被加工物に照射する集光レンズと、を含み、
該制御部は、
該出力測定ユニットにより測定されたレーザービームの漏れ光の出力が所定の閾値の範囲内かどうかを判定する合否判定部と、
該合否判定部が複数の該出力測定ユニットのうち少なくともひとつの出力測定ユニットの測定結果が所定の閾値の範囲外であると判定した場合、報知部に予め定められた警告情報を報知させる警告報知部と、を含んで、
被加工物に対してレーザービームを照射しながら、該出力測定ユニットで該レーザービームの漏れ光の出力測定を行うことを特徴とする、レーザー加工装置。 - 該制御部は、
該レーザー発振器のパルス発振のタイミングを制御する信号を生成する信号生成部と、
該信号生成部で生成された信号と該出力測定ユニットによるレーザービームの漏れ光の出力測定のタイミングを同期させる信号同期部と、
をさらに含み、
該レーザー発振器からパルスが発振されている間だけ該出力測定ユニットによるレーザービームの漏れ光の出力測定を行うことを特徴とする、
請求項1に記載のレーザー加工装置。 - 該レーザービームの漏れ光は、
該出力測定ユニットの前方に配設された、加工に使用する波長のレ-ザービームのみを透過する波長選択フィルタを通過して該出力測定ユニットに入射されることを特徴とする、 請求項1または2に記載のレーザー加工装置。 - 該出力測定ユニットは、
PSD(Position Sensing Device)であることを特徴とする、
請求項1乃至3のいずれか1項に記載のレーザー加工装置。 - 該出力測定ユニットは、
レーザービームの漏れ光の出力と同時に位置情報を測定することを特徴とする、
請求項1乃至4のいずれか1項に記載のレーザー加工装置。 - 該合否判定部は、該出力測定ユニットにより測定されたレーザービームの漏れ光の位置の変動量が所定の閾値の範囲内かどうかを判定するとともに、
該制御部は、該合否判定部と、該出力測定ユニットにより測定されたデータを記録する記録部と、
の少なくともいずれかを有することを特徴とする、
請求項5に記載のレーザー加工装置。 - 該合否判定部は、該出力測定ユニットにより測定されたレーザービームの漏れ光の位置の変動量が所定の閾値の範囲内かどうかを判定するとともに、
該警告報知部は、該合否判定部が該出力測定ユニットにより測定されたレーザービームの漏れ光の出力および位置の変動量の少なくとも一方が所定の閾値の範囲外になると判定した場合、該報知部に予め定められた警告情報を報知させることを特徴とする、
請求項1乃至6のいずれか1項に記載のレーザー加工装置。
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KR1020200092628A KR20210025479A (ko) | 2019-08-27 | 2020-07-24 | 레이저 가공 장치 |
SG10202007680RA SG10202007680RA (en) | 2019-08-27 | 2020-08-11 | Laser processing apparatus |
CN202010854560.9A CN112439991A (zh) | 2019-08-27 | 2020-08-24 | 激光加工装置 |
TW109129040A TW202109643A (zh) | 2019-08-27 | 2020-08-26 | 雷射加工裝置 |
DE102020210788.2A DE102020210788A1 (de) | 2019-08-27 | 2020-08-26 | Laserbearbeitungsvorrichtung |
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