TW202109643A - 雷射加工裝置 - Google Patents
雷射加工裝置 Download PDFInfo
- Publication number
- TW202109643A TW202109643A TW109129040A TW109129040A TW202109643A TW 202109643 A TW202109643 A TW 202109643A TW 109129040 A TW109129040 A TW 109129040A TW 109129040 A TW109129040 A TW 109129040A TW 202109643 A TW202109643 A TW 202109643A
- Authority
- TW
- Taiwan
- Prior art keywords
- unit
- laser beam
- output
- laser
- light
- Prior art date
Links
- 238000012545 processing Methods 0.000 title claims abstract description 95
- 230000001678 irradiating effect Effects 0.000 claims abstract description 6
- 230000000644 propagated effect Effects 0.000 claims abstract description 3
- 238000005259 measurement Methods 0.000 claims description 79
- 238000012546 transfer Methods 0.000 claims description 21
- 230000005540 biological transmission Effects 0.000 claims description 5
- 230000010355 oscillation Effects 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 8
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 description 7
- 239000010410 layer Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 238000005096 rolling process Methods 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 6
- 238000003384 imaging method Methods 0.000 description 5
- 230000001360 synchronised effect Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- 239000000470 constituent Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910009372 YVO4 Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 229910052743 krypton Inorganic materials 0.000 description 1
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 235000012149 noodles Nutrition 0.000 description 1
- 238000011158 quantitative evaluation Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
- G01J1/4257—Photometry, e.g. photographic exposure meter using electric radiation detectors applied to monitoring the characteristics of a beam, e.g. laser beam, headlamp beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
- B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least in three axial directions, e.g. manipulators, robots
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/705—Beam measuring device
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/707—Auxiliary equipment for monitoring laser beam transmission optics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
- G01J1/44—Electric circuits
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/406—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by monitoring or safety
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/4155—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by programme execution, i.e. part programme or machine function execution, e.g. selection of a programme
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/34—Director, elements to supervisory
- G05B2219/34031—Synchronous detector
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45041—Laser cutting
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45154—Forming workpiece by using thermal energy, laser forming
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Automation & Control Theory (AREA)
- Human Computer Interaction (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Robotics (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
Abstract
本發明係一種雷射加工裝置,其課題為提供:可在加工被加工物同時,未中斷加工而監控加工中的雷射光束之輸出的雷射加工裝置。
解決手段為雷射加工裝置之雷射光束照射單元係包含:雷射振盪器,和反射自雷射振盪器所出射之雷射光束而傳播至加工點的反射鏡,和測定未由反射鏡所反射而透過之雷射光束的漏光之輸出的輸出測定單元,和將經由反射鏡所傳播之雷射光束進行集光而照射至被加工物之集光透鏡。控制單元係對於被加工物而言,照射雷射光束同時,由輸出測定單元而進行雷射光束的漏光之輸出測定。
Description
本發明係有關雷射加工裝置。
作為加工半導體晶圓等之被加工物的方法,知道有將具有吸收性的波長之雷射光束照射至被加工物的表面而形成加工溝的方法,或對於被加工物而言,集光照射具有透過性之波長的雷射光束於被加工物的內部而形成成為分割起點之改質層的方法(參照專利文獻1,2)。
[先前技術文獻]
[專利文獻]
[專利文獻1]日本特開2003-320466號公報
[專利文獻2]日本特開2002-192370號公報
[發明欲解決之課題]
對於進行上述之雷射加工的雷射加工裝置,經由監視加工中的雷射光束之輸出變化,抑制被加工物的分割不良等之需求增高。作為測定雷射光束之輸出的方法係進行有由輸出測定單元而遮斷光路之方法,或中斷加工而對於輸出測定單元照射雷射光束之方法。但此等方法係必須中斷加工,而將被加工物進行加工同時,測定輸出則為困難。
因而,本發明之目的係提供:加工被加工物同時,未中斷加工而可監視加工中之雷射光束的輸出之雷射加工裝置。
為了解決課題之手段
當根據本發明時,提供:一種雷射加工裝置,其中具備:保持被加工物之夾頭座,和照射脈衝狀之雷射光束於保持在該夾頭座的被加工物之雷射光束照射單元,和相對性加工傳送該夾頭座與該雷射光束照射單元之加工傳送單元,和相對性推斷傳送該夾頭座與該雷射光束照射單元之推斷傳送單元,和控制單元;該雷射光束照射單元係包含:雷射振盪器,和反射自該雷射振盪器所出射之雷射光束而傳播至加工點的反射鏡,和測定未由該反射鏡所反射而透過之雷射光束的漏光之輸出的輸出測定單元,和將經由該反射鏡所傳播之雷射光束進行集光而照射至被加工物的集光透鏡;該控制單元係對於被加工物而言,照射雷射光束,同時由該輸出測定單元而進行該雷射光束的漏光之輸出測定的雷射加工裝置。
理想係該控制單元為包含:生成控制該雷射振盪器之脈衝振盪的時間之信號的信號生成部,和使由該信號生成部所生成之信號與該輸出測定單元所致之雷射光束的漏光之輸出測定的時間同步之信號同步部;僅自該雷射振盪器振盪脈衝雷射之期間,進行該輸出測定單元所致之雷射光束的漏光之輸出測定。
理想係該雷射光束的漏光係通過配設在該輸出測定單元之前方的僅透過使用於加工之波長的雷射光束的波長選擇濾波器而入射至該輸出測定單元。
理想係該輸出測定單元係自PSD(Position Sensing Device)所構成。
理想係該控制單元係更包含:若經由該輸出測定單元所測定到的雷射光束之漏光的輸出成為特定的臨界值之範圍外,則通報警告之警告通報部。
理想係該輸出測定單元係與雷射光束的漏光之輸出同時測定位置資訊。
理想係該控制單元係更包含:判定經由該輸出測定單元所測定到的雷射光束之漏光的位置之變動量是否為特定之臨界值的範圍內之是否判定部,和記錄經由該輸出測定單元所測定到的資料之記錄部之至少任一者。
發明效果
當根據本申請發明時,可在加工被加工物同時,未中斷加工而監視加工中的雷射光束之輸出者。
以下,對於本發明之實施形態,參照圖面同時進行詳細說明。並非經由記載於以下的實施形態之內容而限定本發明者。另外,對於以下所記載之構成要素,係包含該業者容易想定之構成,實質上同一之構成。更且,以下所記載之構成係可做適宜組合者。另外,在不脫離本發明之內容範圍,可進行構成之各種省略,置換或變更者。
首先,對於有關本發明之實施形態的雷射加工裝置1之構成,依據圖面進行說明。圖1係顯示有關實施形態之雷射加工裝置1之構成例的斜視圖。圖2係模式性顯示圖1所示之雷射加工裝置1的雷射光束照射單元20之構成的模式圖。圖3係顯示經由有關實施形態之輸出測定單元24的測定值之一例的模式性的圖表。圖4係顯示對於圖3所示之測定值,與脈衝振盪的閘極信號811同步情況之測定值的一例的模式性的圖表。圖5係顯示經由有關實施形態之輸出測定單元24的漏光31的測定位置之一例的模式圖。在以下的說明中,X軸方向係在水平面之一方向。Y軸方向係在水平面中,正交於X軸方向的方向。Z軸方向係正交於X軸方向及Y軸方向的方向。實施形態的雷射加工裝置1係加工傳送方向為X軸方向,而推斷傳送方向為Y軸方向。
如圖1所示,雷射加工裝置1係具備:夾頭座10,和雷射光束照射單元20,和加工傳送單元40,和推斷傳送單元50,和攝像單元60,和顯示單元70,和控制單元80。有關實施形態之雷射加工裝置1係經由對於加工對象之被加工物100而言,照射雷射光束30之時,加工被加工物100之裝置。經由雷射加工裝置1之被加工物100的加工係例如,經由隱形切割而形成改質層於被加工物100之內部的改質層形成加工,形成溝於被加工物100之表面的溝加工,或沿著分割預定線而切斷被加工物100之切斷加工等。
被加工物100係具有矽,藍寶石,砷化鎵等之基板的圓板狀之半導體裝置晶圓,光裝置晶圓等之晶圓。被加工物100係具有設定為格子狀於基板表面之複數的分割預定線,和形成於經由分割預定線而區隔之範圍的裝置。裝置係例如為IC(Integrated Circuit)、或LSI(Large Scale Integration)等之集成電路、CCD(Charge Coupled Device)、或CMOS(Complementary Metal Oxide
Semiconductor)等之圖像感知器,或MEMS(Micro Electro Mechanical Systems)等。被加工物100係沿著分割預定線而分割成各個裝置,製造成晶片。晶片係包含基板的一部分,和基板上的裝置。晶片的平面形狀係例如,正方形狀或長方形狀。
經由雷射加工裝置1所加工的被加工物100係在實施形態中,由環狀框體101及擴張膠帶102所支持。環狀框體101係具有較被加工物100的外徑為大的開口。擴張膠帶102係貼附於環狀框體101之背面側。擴張膠帶102係例如,包含:以具有伸縮性的合成樹脂所構成之基材層,和由層積於基材層,且具有伸縮性及黏著性的合成樹脂所構成之黏著層。被加工物100係經由作為定位於環狀框體101之開口的特定位置,而背面則貼附於擴張膠帶102之時,固定於環狀框體101及擴張膠帶102。
夾頭座10係在保持面11而保持被加工物100。保持面11係自多孔性陶瓷等所形成之圓盤形狀。保持面11係在實施形態中,與水平方向平行之平面。保持面11係例如,藉由真空吸引路徑而與真空吸引源連接。夾頭座10係吸引保持載置於保持面11上之被加工物100。對於夾頭座10之周圍係複數配置有夾持支持被加工物100之環狀框體101的箝位部12。夾頭座10係經由旋轉單元13而旋轉於與Z軸方向平行之軸心周圍。旋轉單元13係由X軸方向移動板14所支持。旋轉單元13及夾頭座10係藉由X軸方向移動板14,經由加工傳送單元40而移動至X軸方向。旋轉單元13及夾頭座10係藉由X軸方向移動板14,加工傳送單元40及Y軸方向移動板15,經由推斷傳送單元50而移動至Y軸方向。
雷射光束照射單元20係對於由夾頭座10所保持之被加工物100而言,照射脈衝狀之雷射光束30的單元。雷射光束照射單元20係包含:雷射振盪器21,和反射鏡22,和集光透鏡23,和輸出測定單元24,和波長選擇濾波器25。
雷射振盪器21係振盪具有為了加工被加工物100之特定的波長之脈衝雷射。雷射光束照射單元20所照射之雷射光束30係對於被加工物100而言具有透過性的波長亦可,而亦可為對於被加工物100而言具有吸收性的波長。雷射振盪器21係例如,包含YAG雷射振盪器,YVO4雷射振盪器等。
反射鏡22係反射自雷射振盪器21所出射的雷射光束30,傳播至保持於夾頭座10之保持面11之被加工物100的加工點。例如,自雷射振盪器21所出射的雷射光束30則為UV(紫外線)的情況,對於反射鏡22係形成有反射UV之反射膜。形成於反射鏡22之反射膜係幾乎反射雷射光束30,但未反射雷射光束30之數%程度而透過。另外,自雷射振盪器21所出射的雷射光束30係有著為UV,或混入存在有IR(紅外線)或發綠光等之波長的光之情況。此情況,反射鏡22係未反射透過UV以外的IR或發綠光等之雷射光束30。
反射鏡22係在實施形態中,包含:第一反射鏡221,和第二反射鏡222,和第三反射鏡223。第一反射鏡221係將雷射振盪器21所振盪之雷射光束30,作為第一雷射光束301,朝向第二反射鏡222而進行反射。第二反射鏡222係將經由第一反射鏡221所反射之第一雷射光束301,作為第二雷射光束302,朝向第三反射鏡223而進行反射。第三反射鏡223係將經由第二反射鏡222所反射之第二雷射光束302,作為第三雷射光束303,朝向被加工物100而進行反射。
集光透鏡23係將經由反射鏡22所反射的雷射光束30進行集光而形成集光點32,照射於被加工物100。
輸出測定單元24係測定未由反射鏡22所反射而透過的雷射光束30之漏光31的輸出。另外,輸出測定單元24係檢出在測定雷射光束30之漏光31的測定面245(參照圖5)內之雷射光束30的位置。輸出測定單元24係在實施形態中,含有位置檢出元件(PSD:Position Sensing Device),但例如亦可為熱電堆功率計或光偵測功率計等。PSD係經由光線入射而測定流動的電流之電流值。例如,後述之控制單元80係依據經由PSD所測定之電流值,換算為雷射光束30之漏光31的輸出。輸出測定單元24則含有PSD之情況,藉由均等吸收光量的ND(Neutral Density)濾光器而將雷射光束30的漏光31進行受光。PSD係依據流入至4分割之阻抗層之電流的各個電流比而測定光所入射之位置。例如,後述之控制單元80係依據經由PSD所測定之各個電流比,判定光所入射的位置。輸出測定單元24係在實施形態中,在每一定時間間隔,將測定結果輸出至控制單元80。
輸出測定單元24係在實施形態中,包含:第一輸出測定單元241,和第二輸出測定單元242,和第三輸出測定單元243。第一輸出測定單元241係將未由第一反射鏡221所反射而透過之雷射光束30的漏光31,作為第一漏光311而測定其輸出。第二輸出測定單元242係將未由第二反射鏡222所反射而透過之雷射光束30的漏光31,作為第二漏光312而測定其輸出。第三輸出測定單元243係將未由第三反射鏡223所反射而透過之雷射光束30的漏光31,作為第三漏光313而測定其輸出。
波長選擇濾波器25係配設於輸出測定單元24之前方。波長選擇濾波器25係僅透過使用於加工之波長的雷射光束30之濾波器。例如,自雷射振盪器21所出射的雷射光束30為UV之情況,波長選擇濾波器25係僅使UV透過。波長選擇濾波器25係例如,帶通洰波器,二向色濾波器,高通濾波器及短通濾波器之任一,或組合此等之構成的濾波器。帶通洰波器係任意選擇特定的波長而使其透過的濾波器。二向色濾波器係反射特定的波長範圍的光,使剩餘之波長範圍的光透過的濾波器。高通濾波器係使較特定的波長為長之波長的光透過之濾波器。短通濾波器係使較特定的波長為短之波長的光透過之濾波器。
波長選擇濾波器25係在實施形態中,包含:第一波長選擇濾波器251,和第二波長選擇濾波器252,和第三波長選擇濾波器253。第一波長選擇濾波器251係配設於第一輸出測定單元241之前方。第一波長選擇濾波器251係僅將雷射光束30之第一漏光311之中,使用於加工之波長的雷射光束30透過。第二波長選擇濾波器252係配設於第二輸出測定單元242之前方。第二波長選擇濾波器252係僅將雷射光束30之第二漏光312之中,使用於加工之波長的雷射光束30透過。第三波長選擇濾波器253係配設於第三輸出測定單元243之前方。第三波長選擇濾波器253係僅將雷射光束30之第三漏光313之中,使用於加工之波長的雷射光束30透過。
如圖1所示,加工傳送單元40係使夾頭座10,和雷射光束照射單元20,相對移動於加工傳送方向的X軸方向之單元。加工傳送單元40係在實施形態中,使夾頭座10移動至X軸方向。加工傳送單元40係在實施形態中,設置於雷射加工裝置1之裝置主體2上。加工傳送單元40係將X軸方向移動板14移動自在而支持於X軸方向。加工傳送單元40係包含:周知的滾動螺旋41,和周知的脈衝馬達42,和周知的導軌43。滾動螺旋41係旋轉自在而設置於軸心周圍。脈衝馬達42係使滾動螺旋41旋轉於軸心周圍。導軌43係將X軸方向移動板14移動自在而支持於X軸方向。導軌43係固定設置於Y軸方向移動板15。
推斷傳送單元50係使夾頭座10,和雷射光束照射單元20,相對移動至推斷傳送方向之Y軸方向的單元。推斷傳送單元50係在實施形態中,使夾頭座10移動至Y軸方向。推斷傳送單元50係在實施形態中,設置於雷射加工裝置1之裝置主體2上。推斷傳送單元50係移動自在而支持Y軸方向移動板15於Y軸方向。推斷傳送單元50係包含:周知的滾動螺旋51,和周知的脈衝馬達52,和周知的導軌53。滾動螺旋51係旋轉自在而設置於軸心周圍。脈衝馬達52係使滾動螺旋51旋轉於軸心周圍。導軌53係將Y軸方向移動板15移動自在而支持於Y軸方向。導軌53係固定設置於裝置主體2。
雷射加工裝置1係含有使包含於雷射光束照射單元20之集光透鏡移動於Z軸方向之Z軸移動單元亦可。Z軸移動單元係例如,設置於自裝置主體2立設的柱3,移動自在而支持雷射光束照射單元20之集光透鏡於Z軸方向。
攝像單元60係攝像保持於夾頭座10之被加工物100。攝像單元60係包含攝像保持於夾頭座10之被加工物100之CCD攝影機或紅外線攝影機。
顯示單元70係經由液晶顯示裝置等而構成之顯示部。顯示單元70係包含顯示面71,和通報部72。顯示面71係顯示加工動作的狀態或畫像等。通報部72係發出聲音或光之至少一方而通報預先訂定於雷射加工裝置1之運算子的通報資訊。通報部72係亦可為擴音器或發光裝置等之外部通報裝置。顯示面71為包含觸摸面板之情況,顯示單元70係包含輸入部亦可。輸入部係可接受運算子登錄加工內容資訊等之各種操作。輸入部係亦可為鍵盤等之外部輸入裝置。顯示單元70係經由來自輸入部等之操作而切換顯示於顯示面71之資訊或畫像。顯示單元70係連接於控制單元80。
控制單元80係各控制雷射加工裝置1之上述的各構成要素,使雷射加工裝置1執行對於被加工物100之加工動作。控制單元80係控制雷射光束照射單元20,加工傳送單元40,推斷傳送單元50,攝像單元60及顯示單元70。控制單元80係包含作為演算手段之演算處理裝置,和作為記憶手段之記憶裝置,和作為通信手段之輸出入介面裝置之電腦。演算處理裝置係例如,包含CPU(Central Processing Unit)等之微處理器。記憶裝置係具有ROM (Read Only Memory)或RAM(Random Access Memory)等之記憶體。演算處理裝置係依據收納於記憶裝置之特定的程式而進行各種的演算。演算處理裝置係依照演算結果,藉由輸出入介面裝置而輸出各種控制信號於上述之各構成要素,進行雷射加工裝置1的控制。
控制單元80係由攝像單元60攝像被加工物100。控制單元80係進行經由攝像單元60而攝像之畫像的畫像處理。控制單元80係經由畫像處理而檢出被加工物100之分割預定線。控制單元80係雷射光束30之集光點32則呈沿著分割預定線移動而使加工傳送單元40及推斷傳送單元50驅動同時,照射雷射光束30於雷射光束照射單元20。控制單元80係照射雷射光束30於雷射光束照射單元20同時,由輸出測定單元24而進行雷射光束30之漏光31的輸出測定。控制單元80係在實施形態中,包含:信號生成部81,和信號同步部82,和是否判定部83,和警告通報部84,和記錄部85。
信號生成部81係生成控制雷射光束照射單元20之雷射振盪器21的脈衝振盪的時間之閘極信號811。信號生成部81係將閘極信號811輸出至信號同步部82及記錄部85。
信號同步部82係自信號生成部81取得閘極信號811。信號同步部82係在實施形態中,取得收訊閘極信號811時之經由輸出測定單元24的測定結果。信號同步部82係使在信號生成部81所生成之閘極信號811與經由輸出測定單元24的雷射光束30之漏光31的輸出測定的時間進行同步。信號同步部82係將經由同步於閘極信號811之輸出測定單元24的測定結果,輸出至是否判定部83及記錄部85。
是否判定部83係自信號同步部82,取得經由同步於閘極信號811之輸出測定單元24的測定結果。是否判定部83係判定經由輸出測定單元24而測定之雷射光束30的漏光31之輸出是否為特定之臨界值的範圍91內。臨界值的範圍91係顯示較圖4中之雷射光束30的漏光31之正規的輸出90為高之上限的臨界值92,和較正規的輸出90為低之下限的臨界值93之間的範圍。在圖4所示之一例中,當雷射光束30的漏光31之輸出低於下限的臨界值93時,是否判定部83係判定雷射光束30的漏光31之輸出成為特定之臨界值的範圍91外。是否判定部83係將顯示雷射光束30的漏光31之輸出成為特定之臨界值的範圍91外之判定結果,輸出至警告通報部84及記錄部85。
是否判定部83係更判定經由輸出測定單元24而測定之雷射光束30的漏光31之位置的變動量是否為特定之臨界值的範圍96內。位置的變動量之特定的臨界值的範圍96係例如,如圖5所示,在輸出測定單元24的測定面245中,正交於自正規的雷射光束30之光軸所通過之基準位置95的光軸之面方向的特定距離以下之範圍。位置的變動量之特定的臨界值的範圍96係在正交於光軸的面上,以正圓形狀而顯示亦可,而亦可如圖5所示之一例,以橢圓形狀而顯示。例如,輸出測定單元24則包含PSD的情況,經由依據流動於PSD之阻抗層的各個電流比之臨界值,判定漏光31之位置的變動量亦可。在圖5所示之一例中,輸出測定單元24所測定之雷射光束30的漏光31係一部分溢漏於特定的臨界值之範圍96外。此情況,是否判定部83係判定雷射光束30的漏光31之位置的變動量為特定之臨界值的範圍96外。是否判定部83係將顯示雷射光束30的漏光31之位置的變動量為特定之臨界值的範圍96外之判定結果,輸出至警告通報部84及記錄部85。
控制單元80係經由雷射加工裝置1之雷射加工中,將夾頭座10推斷傳送於Y軸方向期間係使來自雷射振盪器21之雷射光束30的振盪停止。即,如圖3所示,輸出測定單元24則經常測定雷射光束30的漏光31之輸出的情況係在閘極信號811關閉時,經由輸出測定單元24之輸出測定值則略成為零。
信號同步部82則經由使閘極信號811與雷射光束30的漏光31之輸出測定的時間作為同步之時,可將閘極信號811關閉時之輸出測定值除外。即,信號同步部82係依據僅自雷射振盪器21振盪脈衝之時間帶812之經由輸出測定單元24之輸出測定值,判定雷射光束30的漏光31之輸出是否為特定之臨界值的範圍91內。經由此,如圖4所示,成為進行輸出測定值之定量性的評估。更詳細係經由輸出測定單元24而測定之雷射光束30的漏光31之輸出則可評估為是否對於加工最佳之輸出的範圍內。
例如,漏光31之輸出低於下限的臨界值93之情況係可預測雷射振盪器21之輸出下降或光學元件的不良情況等。例如,漏光31之輸出高於上限的臨界值92之情況係可預測反射鏡22之反射膜的破損或光學元件本身的脫落等。另外,經由比較各第一輸出測定單元241,第二輸出測定單元242及第三輸出測定單元243之輸出測定值,輸出下降等之原因的調查則成為容易。
警告通報部84係取得經由是否判定部83之判定結果。警告通報部84係是否判定部83則經由輸出測定單元24而測定之雷射光束30的漏光31的輸出及位置的變動量之至少一方則作為成為特定的臨界值之範圍91,96外之判定情況,對於通報部72預先通報所訂定之警告資訊。警告通報部84係是否判定部83則判定複數之輸出測定單元241,242,243之中至少一個之輸出測定單元24之測定結果為特定的臨界值之範圍91,96外之情況,對於通報部72預先通報所訂定之警告資訊。
在圖4所示之一例中,例如,警告通報部84係當雷射光束30的漏光31之輸出低於下限的臨界值93時,自是否判定部83取得雷射光束30的漏光31之輸出成為特定之臨界值的範圍91外之判定結果。警告通報部84係依據所取得之是否判定部83的判定結果,將顯示雷射光束30的漏光31之輸出低於下限的臨界值93之特定的警告資訊,通報於通報部72。在圖5所示之一例中,例如,警告通報部84係自是否判定部83取得雷射光束30的漏光31之一部分溢出於特定的臨界值之範圍96外的判定結果。警告通報部84係依據所取得之是否判定部83的判定結果,將顯示雷射光束30的漏光31之一部分溢出於特定的臨界值的範圍96外之特定的警告資訊,通報於通報部72。
記錄部85係取得經由輸出測定單元24之測定結果,信號生成部81所生成之閘極信號811,經由信號同步部82而同步之輸出測定單元24的測定結果,經由是否判定部83之判定結果等的資料而進行記錄。測定結果的資料係例如,包含經由各輸出測定單元24之雷射光束30的漏光31之輸出測定值及入射位置的時間序列之資料等。控制單元80係將經由記錄部85所記錄之資料,顯示於顯示單元70之顯示面71亦可。
如以上說明,有關實施形態之雷射加工裝置1係對於被加工物100而言,照射雷射光束30之同時,輸出測定單元24則測定未由反射鏡22所反射而透過之雷射光束30的漏光31之輸出。雷射加工裝置1係經由將透過反射鏡22之雷射光束30的漏光31利用於輸出測定之時,將被加工物100進行加工同時,可未中斷加工而監視加工中之雷射光束30的輸出。隨之,例如,可盡早發現加工中之輸出降低或光學元件的破損等,而可抑制被加工物100之加工不良者。
更且,將透過雷射振盪器21之出射口之後的反射鏡22(第一反射鏡221)之第一漏光311,和透過歷經複數之光學元件的反射鏡22(第二反射鏡222或第三反射鏡223)之第二漏光312或第三漏光313,經由複數之輸出測定單元24而進行輸出測定亦可。經由此,經由比較透過設置於自雷射振盪器21的出射口至雷射光束30之集光點32之間的各反射鏡22之各漏光31之時,輸出降低等之原因的調查則成為容易。更詳細係成為可切分經由雷射振盪器21之劣化等而引起輸出降低,或傳播至集光點32之途中的光學元件為原因而引起輸出降低等。
然而,本發明係並不限定於上述實施形態者。即,在不脫離本發明之內容的範圍,可做各種變形而實施者。
例如,信號同步部82係在本發明中,僅收訊閘極信號811之時間帶812,由輸出測定單元24測定雷射光束30之漏光31的輸出,取得其測定結果亦可。此情況,輸出測定單元24係經由信號同步部82而控制輸出測定的時間。
另外,在實施形態中,是否判定部83則判定雷射光束30之漏光31的輸出及位置的變動量之各自是否為臨界值之範圍91,96內,但在本發明中,僅判定輸出及位置的變動量之任一亦可。此情況,警告通報部84係對於是否判定部83所判定之一方為臨界值之範圍91,96外的情況,對於由通報部72通報警告。另外,在實施形態中,對於雷射光束30之漏光31的輸出及位置的變動量,設定各自的臨界值之範圍91,96,但在本發明中,設定經由輸出及位置之變動量的組合之臨界值的範圍亦可。
另外,警告通報部84係在實施形態中,對於是否判定部83判定複數之輸出測定單元241、242、243之中至少一個的輸出測定單元24之測定結果為特定之臨界值的範圍91,96外之情況,由通報部72預先通報所訂定之警告資訊,但在本發明中,對於是否判定部83判定所有的輸出測定單元241、242、243之測定結果為特定之臨界值的範圍91,96外之情況,由通報部72預先通報所訂定之警告資訊亦可。
1:雷射加工裝置
10:夾頭座
20:雷射光束照射單元
21:雷射振盪器
22:反射鏡
23:集光透鏡
24:輸出測定單元
25:波長選擇濾波器
30:雷射光束
31:漏光
32:集光點
40:加工傳送單元
50:推斷傳送單元
60:攝像單元
70:顯示單元
80:控制單元
81:信號生成部
82:信號同步部
83:是否判定部
84:警告通報部
85:記錄部
100:被加工物
[圖1]係顯示有關實施形態之雷射加工裝置之構成例的斜視圖。
[圖2]係模式性顯示圖1所示之雷射加工裝置的雷射光束照射單元之構成的模式圖。
[圖3]係顯示經由有關實施形態之輸出測定單元的測定值之一例的模式性的圖表。
[圖4]係顯示對於圖3所示之測定值,與脈衝振盪的閘極信號同步情況之測定值的一例的模式性的圖表。
[圖5]係顯示經由有關實施形態之輸出測定單元的漏光的測定位置之一例的模式圖。
1:雷射加工裝置
10:夾頭座
11:保持面
20:雷射光束照射單元
21:雷射振盪器
22:反射鏡
23:集光透鏡
24:輸出測定單元
25:波長選擇濾波器
30:雷射光束
31:漏光
32:集光點
100:被加工物
101:環狀框體
102:擴張膠帶
221:第一反射鏡
222:第二反射鏡
223:第三反射鏡
241:第一輸出測定單元
242:第二輸出測定單元
243:第三輸出測定單元
251:第一波長選擇濾波器
252:第二波長選擇濾波器
253:第三波長選擇濾波器
301:第一雷射光束
302:第二雷射光束
303:第三雷射光束
311:第一漏光
312:第二漏光
313:第三漏光
Claims (7)
- 一種雷射加工裝置,其中具備: 保持被加工物之夾頭座, 和照射脈衝狀之雷射光束於保持在該夾頭座的被加工物之雷射光束照射單元, 和相對性加工傳送該夾頭座與該雷射光束照射單元之加工傳送單元, 和相對性推斷傳送該夾頭座與該雷射光束照射單元之推斷傳送單元, 和控制單元; 該雷射光束照射單元係包含: 雷射振盪器, 和反射自該雷射振盪器所出射之雷射光束而傳播至加工點的反射鏡, 和測定未由該反射鏡所反射而透過之雷射光束的漏光之輸出的輸出測定單元, 和將經由該反射鏡所傳播之雷射光束進行集光而照射至被加工物的集光透鏡; 該控制單元係對於被加工物而言,照射雷射光束,同時由該輸出測定單元進行該雷射光束的漏光之輸出測定。
- 如請求項1之雷射加工裝置,其中該控制單元係包含: 生成控制該雷射振盪器之脈衝振盪的時間之信號的信號生成部, 和使由該信號生成部所生成之信號與該輸出測定單元所致之雷射光束的漏光之輸出測定的時間同步之信號同步部; 僅自該雷射振盪器振盪脈衝雷射之期間,進行該輸出測定單元所致之雷射光束的漏光之輸出測定。
- 如請求項1或請求項2之雷射加工裝置,其中該雷射光束的漏光係通過配設在該輸出測定單元之前方的僅透過使用於加工之波長的雷射光束的波長選擇濾波器而入射至該輸出測定單元。
- 如請求項1或請求項2之雷射加工裝置,其中該輸出測定單元為PSD(Position Sensing Device)。
- 如請求項1或請求項2之雷射加工裝置,其中該控制單元係更包含:若經由該輸出測定單元所測定到的雷射光束之漏光的輸出成為特定的臨界值之範圍外,則通報警告之警告通報部。
- 如請求項1或請求項2之雷射加工裝置,其中該輸出測定單元係與雷射光束的漏光的輸出同時測定位置資訊。
- 如請求項6之雷射加工裝置,其中該控制單元係更包含: 判定經由該輸出測定單元所測定到的雷射光束之漏光的位置之變動量是否為特定之臨界值的範圍內之是否判定部, 和記錄經由該輸出測定單元所測定到的資料之記錄部之至少任一者。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019155067A JP7418169B2 (ja) | 2019-08-27 | 2019-08-27 | レーザー加工装置 |
JP2019-155067 | 2019-08-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW202109643A true TW202109643A (zh) | 2021-03-01 |
Family
ID=74565687
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109129040A TW202109643A (zh) | 2019-08-27 | 2020-08-26 | 雷射加工裝置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20210066101A1 (zh) |
JP (1) | JP7418169B2 (zh) |
KR (1) | KR20210025479A (zh) |
CN (1) | CN112439991A (zh) |
DE (1) | DE102020210788A1 (zh) |
SG (1) | SG10202007680RA (zh) |
TW (1) | TW202109643A (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102528969B1 (ko) * | 2021-04-30 | 2023-05-03 | 주식회사 휴비스 | 레이저 파워를 모니터링하는 레이저 가공 장치 |
JP2024004575A (ja) | 2022-06-29 | 2024-01-17 | 株式会社ディスコ | レーザー加工装置 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2682476B1 (fr) * | 1991-10-10 | 1995-03-31 | Cheval Freres Sa | Procede pour la detection et la mesure de l'energie emise par une source laser et dispositif pour sa mise en óoeuvre. |
JPH06142218A (ja) * | 1992-11-05 | 1994-05-24 | Toshiba Corp | 多関節導光装置 |
JP2844288B2 (ja) * | 1993-02-09 | 1999-01-06 | ミヤチテクノス株式会社 | レーザモニタ装置 |
JP3415250B2 (ja) * | 1994-03-14 | 2003-06-09 | 日酸Tanaka株式会社 | レーザ加工機におけるレーザビームの監視装置 |
JP2732225B2 (ja) * | 1994-10-03 | 1998-03-25 | 株式会社篠崎製作所 | レーザ光オートアラインメント装置 |
JPH11320147A (ja) * | 1998-05-18 | 1999-11-24 | Miyachi Technos Corp | レーザ加工装置 |
JP3408805B2 (ja) | 2000-09-13 | 2003-05-19 | 浜松ホトニクス株式会社 | 切断起点領域形成方法及び加工対象物切断方法 |
JP2003320466A (ja) | 2002-05-07 | 2003-11-11 | Disco Abrasive Syst Ltd | レーザビームを使用した加工機 |
JP4130799B2 (ja) * | 2003-12-24 | 2008-08-06 | 三星電子株式会社 | マルチビーム型半導体レーザ |
JP4891526B2 (ja) * | 2004-01-23 | 2012-03-07 | ミヤチテクノス株式会社 | レーザ溶接装置 |
JP2006247681A (ja) * | 2005-03-09 | 2006-09-21 | Miyachi Technos Corp | レーザ加工用モニタリング装置 |
JP5010832B2 (ja) * | 2006-01-19 | 2012-08-29 | 株式会社ディスコ | レーザー加工装置 |
EP2210696A1 (en) * | 2009-01-26 | 2010-07-28 | Excico France | Method and apparatus for irradiating a semiconductor material surface by laser energy |
TWI454687B (zh) * | 2009-08-03 | 2014-10-01 | Toray Eng Co Ltd | Marking device and method |
JP6030299B2 (ja) * | 2011-12-20 | 2016-11-24 | 株式会社ディスコ | レーザー加工装置 |
JP6022223B2 (ja) * | 2012-06-14 | 2016-11-09 | 株式会社ディスコ | レーザー加工装置 |
JP2014020789A (ja) * | 2012-07-12 | 2014-02-03 | Oputei:Kk | 光測定装置 |
JP6271161B2 (ja) * | 2013-06-10 | 2018-01-31 | 株式会社ディスコ | レーザー加工装置 |
FR3014251B1 (fr) * | 2013-12-04 | 2017-04-28 | Thales Sa | Compresseur associe a un dispositif d'echantillonnage d'un faisceau laser a haute energie et grande taille |
JP6882045B2 (ja) * | 2017-04-13 | 2021-06-02 | 株式会社ディスコ | 集光点位置検出方法 |
JP6659654B2 (ja) * | 2017-11-24 | 2020-03-04 | ファナック株式会社 | レーザ加工前に外部光学系の異常を警告するレーザ加工装置 |
-
2019
- 2019-08-27 JP JP2019155067A patent/JP7418169B2/ja active Active
-
2020
- 2020-07-24 KR KR1020200092628A patent/KR20210025479A/ko unknown
- 2020-08-11 SG SG10202007680RA patent/SG10202007680RA/en unknown
- 2020-08-24 CN CN202010854560.9A patent/CN112439991A/zh active Pending
- 2020-08-26 TW TW109129040A patent/TW202109643A/zh unknown
- 2020-08-26 US US17/003,491 patent/US20210066101A1/en active Pending
- 2020-08-26 DE DE102020210788.2A patent/DE102020210788A1/de active Pending
Also Published As
Publication number | Publication date |
---|---|
CN112439991A (zh) | 2021-03-05 |
SG10202007680RA (en) | 2021-03-30 |
US20210066101A1 (en) | 2021-03-04 |
KR20210025479A (ko) | 2021-03-09 |
JP2021030283A (ja) | 2021-03-01 |
JP7418169B2 (ja) | 2024-01-19 |
DE102020210788A1 (de) | 2021-03-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8124909B2 (en) | Laser processing apparatus | |
TW202109643A (zh) | 雷射加工裝置 | |
US10121672B2 (en) | Cutting method for cutting processing-target object and cutting apparatus that cuts processing-target object | |
CN107470782B (zh) | 激光光线的检查方法 | |
CN109382591B (zh) | 激光加工方法 | |
US20050082264A1 (en) | Laser beam machine | |
KR102008532B1 (ko) | 가공 장치 | |
TW200428501A (en) | Laser dicing apparatus | |
US9149886B2 (en) | Modified layer forming method | |
JP6906837B2 (ja) | レーザー加工装置 | |
KR20210015637A (ko) | 레이저 가공 장치 | |
TW201913049A (zh) | 雷射光束剖析器單元以及雷射加工裝置 | |
US20050082267A1 (en) | Laser beam machine | |
JP2009145141A (ja) | 欠陥検査装置及び欠陥検査プログラム | |
CN112091412B (zh) | 反射率测量装置和激光加工装置 | |
TWI829930B (zh) | 雷射加工裝置的光軸調整方法 | |
JP2009291818A (ja) | レーザ加工装置及びレーザ加工方法 | |
JP7266430B2 (ja) | レーザー加工装置 | |
TW202410233A (zh) | 雷射加工裝置 | |
JP7199256B2 (ja) | 出力測定ユニットの合否判定方法 | |
JP7334072B2 (ja) | レーザー加工装置およびビーム径測定方法 | |
JP7450447B2 (ja) | レーザー加工装置 | |
JP2024004575A (ja) | レーザー加工装置 | |
TW202313235A (zh) | 雷射加工裝置 | |
JP2024016673A (ja) | レーザー加工装置 |