CN112439991A - 激光加工装置 - Google Patents
激光加工装置 Download PDFInfo
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- 238000012545 processing Methods 0.000 title claims abstract description 81
- 230000001678 irradiating effect Effects 0.000 claims abstract description 14
- 238000003754 machining Methods 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 13
- 230000001902 propagating effect Effects 0.000 claims abstract description 3
- 238000005259 measurement Methods 0.000 claims description 59
- 230000010355 oscillation Effects 0.000 claims description 7
- 230000003287 optical effect Effects 0.000 description 10
- 239000010410 layer Substances 0.000 description 7
- 230000002950 deficient Effects 0.000 description 6
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000001360 synchronised effect Effects 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 3
- 238000012797 qualification Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910009372 YVO4 Inorganic materials 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 238000011158 quantitative evaluation Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
- B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least in three axial directions, e.g. manipulators, robots
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
- G01J1/4257—Photometry, e.g. photographic exposure meter using electric radiation detectors applied to monitoring the characteristics of a beam, e.g. laser beam, headlamp beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/705—Beam measuring device
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/707—Auxiliary equipment for monitoring laser beam transmission optics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
- G01J1/44—Electric circuits
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/406—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by monitoring or safety
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/4155—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by programme execution, i.e. part programme or machine function execution, e.g. selection of a programme
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
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- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/34—Director, elements to supervisory
- G05B2219/34031—Synchronous detector
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- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45041—Laser cutting
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- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
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Abstract
本发明提供激光加工装置,其能够一边对被加工物进行加工,一边不中断加工而监视加工中的激光束的输出。激光加工装置的激光束照射单元包含:激光振荡器;反射镜,其对从激光振荡器射出的激光束进行反射而向加工点传播;输出测量单元,其对未利用反射镜反射而透过的激光束的漏光的输出进行测量;以及聚光透镜,其将通过反射镜而传播的激光束会聚而照射至被加工物。控制单元一边对被加工物照射激光束一边利用输出测量单元对激光束的漏光的输出进行测量。
Description
技术领域
本发明涉及激光加工装置。
背景技术
作为对半导体晶片等被加工物进行加工的方法,已知有将具有吸收性的波长的激光束照射至被加工物的正面而形成加工槽的方法和将对于被加工物具有透过性的波长的激光束会聚照射至被加工物的内部而形成作为分割起点的改质层的方法(参照专利文献1、2)。
专利文献1:日本特开2003-320466号公报
专利文献2:日本特开2002-192370号公报
关于进行上述激光加工的激光加工装置,希望通过监视加工中的激光束的输出的变化而抑制被加工物的分割不良等的需要不断地提高。作为对激光束的输出进行测量的方法,进行利用输出测量单元遮断光路的方法、中断加工而对输出测量单元照射激光束的方法。但是,这些方法需要中断加工,难以一边对被加工物进行加工一边测量输出。
发明内容
由此,本发明的目的在于提供激光加工装置,其能够一边对被加工物进行加工,一边不中断加工而监视加工中的激光束的输出。
根据本发明,提供激光加工装置,其中,该激光加工装置具有:卡盘工作台,其对被加工物进行保持;激光束照射单元,其对该卡盘工作台所保持的被加工物照射脉冲状的激光束;加工进给单元,其将该卡盘工作台和该激光束照射单元相对地进行加工进给;分度进给单元,其将该卡盘工作台和该激光束照射单元相对地进行分度进给;以及控制单元,该激光束照射单元包含:激光振荡器;反射镜,其对从该激光振荡器射出的激光束进行反射而向加工点传播;输出测量单元,其对未被该反射镜反射而透过的激光束的漏光的输出进行测量;以及聚光透镜,其将通过该反射镜而传播的激光束会聚而照射至被加工物,该控制单元一边对被加工物照射激光束一边利用该输出测量单元对该激光束的漏光的输出进行测量。
优选该控制单元包含:信号生成部,其生成对该激光振荡器的脉冲振荡的时机进行控制的信号;以及信号同步部,其使该信号生成部所生成的信号与利用该输出测量单元对激光束的漏光的输出进行测量的时机同步,仅在从该激光振荡器振荡出脉冲激光的期间利用该输出测量单元对激光束的漏光的输出进行测量。
优选该激光束的漏光通过配设在该输出测量单元的前方的仅使加工中所使用的波长的激光束透过的波长选择滤波器而入射至该输出测量单元。
优选该输出测量单元由位置检测元件(PSD:Position Sensing Device)构成。
优选该控制单元还包含警告通知部,当该输出测量单元所测量的激光束的漏光的输出超出规定的阈值的范围时,该警告通知部通知警告。
优选该输出测量单元与测量激光束的漏光的输出同时地测量位置信息。
优选该控制单元还包含合格与否判定部和记录部中的至少任意一个,该合格与否判定部对该输出测量单元所测量的激光束的漏光的位置的变动量是否在规定的阈值的范围内进行判定,该记录部对该输出测量单元所测量的数据进行记录。
根据本申请发明,能够一边对被加工物进行加工一边不中断加工而监视加工中的激光束的输出。
附图说明
图1是示出实施方式的激光加工装置的结构例的立体图。
图2是示意性示出图1所示的激光加工装置的激光束照射单元的结构的示意图。
图3是示出基于实施方式的输出测量单元的测量值的一例的示意性的曲线图。
图4是关于图3所示的测量值示出与脉冲振荡的选通信号同步的情况下的测量值的一例的示意性的曲线图。
图5是示出基于实施方式的输出测量单元的漏光的测量位置的一例的示意图。
标号说明
1:激光加工装置;10:卡盘工作台;20:激光束照射单元;21:激光振荡器;22:反射镜;23:聚光透镜;24:输出测量单元;25:波长选择滤波器;30:激光束;31:漏光;32:聚光点;40:加工进给单元;50:分度进给单元;60:拍摄单元;70:显示单元;80:控制单元;81:信号生成部;82:信号同步部;83:合格与否判定部;84:警告通知部;85:记录部;100:被加工物。
具体实施方式
以下,参照附图对本发明的实施方式进行详细说明。本发明并不被以下实施方式所记载的内容限定。另外,在以下所记载的构成要素中包含本领域技术人员能够容易想到的内容、实质上相同的内容。另外,以下所记载的结构可以适当组合。另外,可以在不脱离本发明的主旨的范围内进行结构的各种省略、置换或变更。
首先,根据附图对本发明的实施方式的激光加工装置1的结构进行说明。图1是示出实施方式的激光加工装置1的结构例的立体图。图2是示意性示出图1所示的激光加工装置1的激光束照射单元20的结构的示意图。图3是示出基于实施方式的输出测量单元24的测量值的一例的示意性的曲线图。图4是关于图3所示的测量值示出与脉冲振荡的选通信号811同步的情况下的测量值的一例的示意性的曲线图。图5是示出基于实施方式的输出测量单元24的漏光31的测量位置的一例的示意图。在以下的说明中,X轴方向是水平面上的一个方向。Y轴方向是在水平面上与X轴方向垂直的方向。Z轴方向是与X轴方向和Y轴方向垂直的方向。实施方式的激光加工装置1的加工进给方向是X轴方向,分度进给方向是Y轴方向。
如图1所示,激光加工装置1具有卡盘工作台10、激光束照射单元20、加工进给单元40、分度进给单元50、拍摄单元60、显示单元70以及控制单元80。实施方式的激光加工装置1是对作为加工对象的被加工物100照射激光束30而对被加工物100进行加工的装置。激光加工装置1对被加工物100的加工例如是通过隐形切割在被加工物100的内部形成改质层的改质层形成加工、在被加工物100的正面上形成槽的槽加工、或沿着分割预定线将被加工物100切断的切断加工等。
被加工物100是具有硅、蓝宝石、砷化镓等基板的圆板状的半导体器件晶片、光器件晶片等晶片。被加工物100具有:多条分割预定线,它们呈格子状设定于基板的正面上;以及器件,其形成于由分割预定线划分的区域内。器件例如是IC(Integrated Circuit,集成电路)或LSI(Large Scale Integration,大规模集成)等集成电路、CCD(Charge CoupledDevice,电感耦合元件)或CMOS(Complementary Metal Oxide Semiconductor,互补金属氧化物半导体)等图像传感器、或者MEMS(Micro Electro Mechanical Systems,微机电系统)等。将被加工物100沿着分割预定线分割成各个器件而制造成芯片。芯片包含基板的一部分和基板上的器件。芯片的平面形状例如是正方形状或长方形状。
在实施方式中,通过激光加工装置1进行加工的被加工物100支承于环状框架101和扩展带102。环状框架101具有比被加工物100的外径大的开口。扩展带102粘贴于环状框架101的背面侧。扩展带102例如包含:基材层,其由具有伸缩性的合成树脂构成;以及粘接层,其层叠于基材层且由具有伸缩性和粘接性的合成树脂构成。被加工物100定位于环状框架101的开口的规定的位置,背面粘贴于扩展带102,从而固定于环状框架101和扩展带102。
卡盘工作台10利用保持面11对被加工物100进行保持。保持面11是由多孔陶瓷等形成的圆盘形状。在实施方式中,保持面11是与水平方向平行的平面。保持面11例如经由真空吸引路径而与真空吸引源连接。卡盘工作台10对载置于保持面11上的被加工物100进行吸引保持。在卡盘工作台10的周围配置有多个对支承被加工物100的环状框架101进行夹持的夹持部12。卡盘工作台10通过旋转单元13绕与Z轴方向平行的轴心旋转。旋转单元13支承于X轴方向移动板14。旋转单元13和卡盘工作台10借助X轴方向移动板14而通过加工进给单元40在X轴方向上移动。旋转单元13和卡盘工作台10借助X轴方向移动板14、加工进给单元40以及Y轴方向移动板15而通过分度进给单元50在Y轴方向上移动。
激光束照射单元20是对卡盘工作台10所保持的被加工物100照射脉冲状的激光束30的单元。激光束照射单元20包含激光振荡器21、反射镜22、聚光透镜23、输出测量单元24以及波长选择滤波器25。
激光振荡器21振荡出具有用于对被加工物100进行加工的规定的波长的脉冲激光。激光束照射单元20所照射的激光束30可以是对于被加工物100具有透过性的波长,也可以是对于被加工物100具有吸收性的波长。激光振荡器21例如包含YAG激光振荡器、YVO4激光振荡器等。
反射镜22对从激光振荡器21射出的激光束30进行反射而向卡盘工作台10的保持面11所保持的被加工物100的加工点传播。例如在从激光振荡器21射出的激光束30为UV(紫外线)的情况下,在反射镜22上形成有对UV进行反射的反射膜。形成于反射镜22的反射膜对大部分的激光束30进行反射,但使百分之几左右的激光束30不反射而透过。另外,从激光振荡器21射出的激光束30即使是UV,也有时混合存在IR(红外线)或绿色等波长的光。在该情况下,反射镜22使UV以外的IR或绿色等激光束30不反射而透过。
在实施方式中,反射镜22包含第一反射镜221、第二反射镜222以及第三反射镜223。第一反射镜221将激光振荡器21所振荡的激光束30作为第一激光束301而朝向第二反射镜222反射。第二反射镜222将通过第一反射镜221反射的第一激光束301作为第二激光束302而朝向第三反射镜223反射。第三反射镜223将通过第二反射镜222反射的第二激光束302作为第三激光束303而朝向被加工物100反射。
聚光透镜23将通过反射镜22而反射的激光束30会聚而形成聚光点32,照射至被加工物100。
输出测量单元24对未利用反射镜22反射而透过的激光束30的漏光31的输出进行测量。另外,输出测量单元24检测对激光束30的漏光31进行测量的测量面245(参照图5)内的激光束30的位置。在实施方式中,输出测量单元24包含位置检测元件(PSD:PositionSensing Device),但例如也可以是热电堆功率计或光电探测器功率计等。PSD对通过入射光而流通的电流的电流值进行测量。例如后述的控制单元80根据PSD所测量的电流值而换算成激光束30的漏光31的输出。在输出测量单元24包含PSD的情况下,可以借助均匀地吸收光量的ND(Neutral Density,中性密度)滤波器而接受激光束30的漏光31。PSD根据在4分割后的电阻层中流动的电流的各个电流比而对入射光的位置进行测量。例如后述的控制单元80根据PSD所测量的各个电流比而对入射光的位置进行判定。在实施方式中,输出测量单元24每隔一定时间间隔而将测量结果输出至控制单元80。
在实施方式中,输出测量单元24包含第一输出测量单元241、第二输出测量单元242以及第三输出测量单元243。第一输出测量单元241将未利用第一反射镜221反射而透过的激光束30的漏光31作为第一漏光311而测量输出。第二输出测量单元242将未利用第二反射镜222反射而透过的激光束30的漏光31作为第二漏光312而测量输出。第三输出测量单元243将未利用第三反射镜223反射而透过的激光束30的漏光31作为第三漏光313而测量输出。
波长选择滤波器25配设于输出测量单元24的前方。波长选择滤波器25是仅使在加工中使用的波长的激光束30透过的滤波器。例如在从激光振荡器21射出的激光束30为UV的情况下,波长选择滤波器25仅使UV透过。波长选择滤波器25例如是带通滤波器、二向色滤波器、长通滤波器以及短通滤波器中的任意一种、或者是将这些组合而构成的滤波器。带通滤波器是任意地选择特定的波长并使其透过的滤波器。二向色滤波器是使特定的波长区域的光反射且使剩余的波长区域的光透过的滤波器。长通滤波器是使波长长于规定的波长的光透过的滤波器。短通滤波器是使波长短于规定的波长的光透过的滤波器。
在实施方式中,波长选择滤波器25包含第一波长选择滤波器251、第二波长选择滤波器252以及第三波长选择滤波器253。第一波长选择滤波器251配设于第一输出测量单元241的前方。第一波长选择滤波器251仅使激光束30的第一漏光311中的在加工中使用的波长的激光束30透过。第二波长选择滤波器252配设于第二输出测量单元242的前方。第二波长选择滤波器252仅使激光束30的第二漏光312中的在加工中使用的波长的激光束30透过。第三波长选择滤波器253配设于第三输出测量单元243的前方。第三波长选择滤波器253仅使激光束30的第三漏光313中的在加工中使用的波长的激光束30透过。
如图1所示,加工进给单元40是使卡盘工作台10和激光束照射单元20在作为加工进给方向的X轴方向上相对地移动的单元。在实施方式中,加工进给单元40使卡盘工作台10在X轴方向上移动。在实施方式中,加工进给单元40设置于激光加工装置1的装置主体2上。加工进给单元40将X轴方向移动板14支承为在X轴方向上移动自如。加工进给单元40包含周知的滚珠丝杠41、周知的脉冲电动机42以及周知的导轨43。滚珠丝杠41设置成绕轴心旋转自如。脉冲电动机42使滚珠丝杠41绕轴心旋转。导轨43将X轴方向移动板14支承为在X轴方向上移动自如。导轨43固定地设置于Y轴方向移动板15。
分度进给单元50是使卡盘工作台10和激光束照射单元20在作为分度进给方向的Y轴方向上相对地移动的单元。在实施方式中,分度进给单元50使卡盘工作台10在Y轴方向上移动。在实施方式中,分度进给单元50设置于激光加工装置1的装置主体2上。分度进给单元50将Y轴方向移动板15支承为在Y轴方向上移动自如。分度进给单元50包含周知的滚珠丝杠51、周知的脉冲电动机52以及周知的导轨53。滚珠丝杠51设置成绕轴心旋转自如。脉冲电动机52使滚珠丝杠51绕轴心旋转。导轨53将Y轴方向移动板15支承为在Y轴方向上移动自如。导轨53固定地设置于装置主体2。
激光加工装置1还可以包含使激光束照射单元20中包含的聚光透镜在Z轴方向上移动的Z轴移动单元。Z轴移动单元例如设置于从装置主体2竖立设置的柱3上,将激光束照射单元20的聚光透镜支承为在Z轴方向上移动自如。
拍摄单元60对卡盘工作台10所保持的被加工物100进行拍摄。拍摄单元60包含对卡盘工作台10所保持的被加工物100进行拍摄的CCD相机或红外线相机。
显示单元70是由液晶显示装置等构成的显示部。显示单元70包含显示面71和通知部72。显示面71显示出加工动作的状态或图像等。通知部72发出声和光中的至少一方而将预先设定的通知信息通知给激光加工装置1的操作者。通知部72可以是扬声器或发光装置等外部通知装置。在显示面71包含触摸面板的情况下,显示单元70可以包含输入部。输入部能够接受操作者登记加工内容信息等的各种操作。输入部可以是键盘等外部输入装置。显示单元70根据来自输入部等的操作而切换显示在显示面71上的信息或图像。显示单元70与控制单元80连接。
控制单元80分别控制激光加工装置1的上述各构成要素而使激光加工装置1执行对于被加工物100的加工动作。控制单元80对激光束照射单元20、加工进给单元40、分度进给单元50、拍摄单元60以及显示单元70进行控制。控制单元80是包含作为运算单元的运算处理装置、作为存储单元的存储装置以及作为通信单元的输入输出接口装置的计算机。运算处理装置例如包含CPU(Central Processing Unit,中央处理器)等微处理器。存储装置具有ROM(Read Only Memory,只读存储器)或RAM(Random Access Memory,随机存取存储器)等存储器。运算处理装置根据保存于存储装置的规定的程序而进行各种运算。运算处理装置按照运算结果,经由输入输出接口装置而将各种控制信号输出至上述各构成要素,进行激光加工装置1的控制。
控制单元80通过拍摄单元60对被加工物100进行拍摄。控制单元80进行拍摄单元60所拍摄的图像的图像处理。控制单元80根据图像处理而检测被加工物100的分割预定线。控制单元80按照激光束30的聚光点32沿着分割预定线移动的方式驱动加工进给单元40和分度进给单元50,并且通过激光束照射单元20照射激光束30。控制单元80一边通过激光束照射单元20照射激光束30,一边利用输出测量单元24对激光束30的漏光31的输出进行测量。在实施方式中,控制单元80包含信号生成部81、信号同步部82、合格与否判定部83、警告通知部84以及记录部85。
信号生成部81生成对激光束照射单元20的激光振荡器21的脉冲振荡的时机进行控制的选通信号811。信号生成部81将选通信号811输出至信号同步部82和记录部85。
信号同步部82从信号生成部81获取选通信号811。在实施方式中,信号同步部82获取接收选通信号811时的基于输出测量单元24的测量结果。信号同步部82使信号生成部81所生成的选通信号811和利用输出测量单元24对激光束30的漏光31的输出进行测量的时机同步。信号同步部82将与选通信号811同步的基于输出测量单元24的测量结果输出至合格与否判定部83和记录部85。
合格与否判定部83从信号同步部82获取与选通信号811同步的基于输出测量单元24的测量结果。合格与否判定部83对输出测量单元24所测量的激光束30的漏光31的输出是否在规定的阈值的范围91内进行判定。阈值的范围91示出比图4中的激光束30的漏光31的标准的输出90高的上限的阈值92与比标准的输出90低的下限的阈值93之间的范围。在图4所示的一例中,当激光束30的漏光31的输出低于下限的阈值93时,合格与否判定部83判定为激光束30的漏光31的输出超出规定的阈值的范围91。合格与否判定部83将表示激光束30的漏光31的输出超出规定的阈值的范围91的判定结果输出至警告通知部84和记录部85。
合格与否判定部83还对输出测量单元24所测量的激光束30的漏光31的位置的变动量是否在规定的阈值的范围96内进行判定。位置的变动量的规定的阈值的范围96例如是如图5所示那样在输出测量单元24的测量面245上距离标准的激光束30的光轴所通过的基准位置95的与光轴垂直的面方向的规定的距离以下的范围。位置的变动量的规定的阈值的范围96可以在与光轴垂直的面上用正圆形状示出,也可以如图5所示的一例那样用椭圆形状示出。例如在输出测量单元24包含PSD的情况下,可以通过基于在PSD的电阻层中流动的各个电流比的阈值来判定漏光31的位置的变动量。在图5所示的一例中,输出测量单元24所测量的激光束30的漏光31的一部分探出到规定的阈值的范围96外。在该情况下,合格与否判定部83判定为激光束30的漏光31的位置的变动量超出规定的阈值的范围96。合格与否判定部83将表示激光束30的漏光31的位置的变动量超出规定的阈值的范围96的判定结果输出至警告通知部84和记录部85。
控制单元80在基于激光加工装置1的激光加工中在将卡盘工作台10在Y轴方向上进行分度进给的期间停止来自激光振荡器21的激光束30的振荡。即,如图3所示,在输出测量单元24常时测量激光束30的漏光31的输出的情况下,在选通信号811为关时,输出测量单元24的输出测量值大致为零。
信号同步部82使选通信号811和对激光束30的漏光31的输出进行测量的时机同步,从而能够排除选通信号811为关时的输出测量值。即,信号同步部82仅根据从激光振荡器21振荡出脉冲的时间带812的基于输出测量单元24的输出测量值,对激光束30的漏光31的输出是否在规定的阈值的范围91内进行判定。由此,如图4所示,能够进行输出测量值的定量的评价。更详细而言,能够评价输出测量单元24所测量的激光束30的漏光31的输出是否在适合加工的输出的范围内。
例如在漏光31的输出低于下限的阈值93的情况下,能够预测激光振荡器21的输出降低或光学元件的不良情况等。例如在漏光31的输出高于上限的阈值92的情况下,能够预测反射镜22的反射膜的破损或光学元件本身的脱落等。另外,对第一输出测量单元241、第二输出测量单元242以及第三输出测量单元243各自的输出测量值进行比较,从而容易查明输出降低等的原因。
警告通知部84获取合格与否判定部83的判定结果。警告通知部84在合格与否判定部83判定为输出测量单元24所测量的激光束30的漏光31的输出和位置的变动量中的至少一方超出规定的阈值的范围91、96的情况下,将预先设定的警告信息通知给通知部72。警告通知部84在合格与否判定部83判定为多个输出测量单元241、242、243中的至少一个输出测量单元24的测量结果超出规定的阈值的范围91、96的情况下,将预先设定的警告信息通知给通知部72。
在图4所示的一例中,例如当激光束30的漏光31的输出低于下限的阈值93时,警告通知部84从合格与否判定部83获取表示激光束30的漏光31的输出超出规定的阈值的范围91的判定结果。警告通知部84根据所获取的合格与否判定部83的判定结果,将表示激光束30的漏光31的输出低于下限的阈值93的规定的警告信息通知给通知部72。在图5所示的一例中,例如警告通知部84从合格与否判定部83获取表示激光束30的漏光31的一部分探出到规定的阈值的范围96外的判定结果。警告通知部84根据所获取的合格与否判定部83的判定结果,将表示激光束30的漏光31的一部分探出至规定的阈值的范围96外的规定的警告信息通知给通知部72。
记录部85获取并记录输出测量单元24的测量结果、信号生成部81所生成的选通信号811、通过信号同步部82同步的输出测量单元24的测量结果、合格与否判定部83的判定结果等的数据。测量结果的数据例如包含各个输出测量单元24的激光束30的漏光31的输出测量值以及入射位置的时间序列的数据等。控制单元80可以将记录部85所记录的数据显示在显示单元70的显示面71上。
如以上所说明的那样,实施方式的激光加工装置1一边对被加工物100照射激光束30,一边通过输出测量单元24对未利用反射镜22反射而透过的激光束30的漏光31的输出进行测量。激光加工装置1在输出测量中利用了透过反射镜22的激光束30的漏光31,从而能够一边对被加工物100进行加工,一边不中断加工而监视加工中的激光束30的输出。因此,例如能够快速地发现加工中的输出降低、光学元件的破损等,能够抑制被加工物100的加工不良。
另外,也可以通过多个输出测量单元24对透过激光振荡器21的射出口正后方的反射镜22(第一反射镜221)的第一漏光311以及透过经过了多个光学元件的反射镜22(第二反射镜222或第三反射镜223)的第二漏光312或第三漏光313的输出进行测量。由此,对透过设置于从激光振荡器21的射出口至激光束30的聚光点32之间的各个反射镜22的各个漏光31进行比较,从而容易查明输出降低等的原因。更详细而言,能够区分是由于激光振荡器21的劣化等而引起输出降低、还是由于向聚光点32传播的中途的光学元件而引起输出降低等。
另外,本发明并不限于上述实施方式。即,可以在不脱离本发明的主旨的范围内进行各种变形并实施。
例如在本发明中,信号同步部82可以仅在接收了选通信号811的时间带812使输出测量单元24对激光束30的漏光31的输出进行测量并获取该测量结果。在该情况下,输出测量单元24通过信号同步部82控制对输出进行测量的时机。
另外,在实施方式中,合格与否判定部83对激光束30的漏光31的输出和位置的变动量是否分别在阈值的范围91、96内进行判定,但在本发明中,也可以仅对输出和位置的变动量中的任意一个进行判定。在该情况下,警告通知部84在合格与否判定部83所判定的一方超出阈值的范围91、96的情况下,将警告通知给通知部72。另外,在实施方式中,对激光束30的漏光31的输出和位置的变动量设定了各自的阈值的范围91、96,但在本发明中,也可以设定基于输出和位置的变动量的组合的阈值的范围。
另外,在实施方式中,警告通知部84在合格与否判定部83判定为多个输出测量单元241、242、243中的至少一个输出测量单元24的测量结果超出规定的阈值的范围91、96的情况下,将预先设定的警告信息通知给通知部72,但在本发明中,也可以在合格与否判定部83判定为所有的输出测量单元241、242、243的测量结果超出规定的阈值的范围91、96的情况下,将预先设定的警告信息通知给通知部72。
Claims (7)
1.一种激光加工装置,其中,
该激光加工装置具有:
卡盘工作台,其对被加工物进行保持;
激光束照射单元,其对该卡盘工作台所保持的被加工物照射脉冲状的激光束;
加工进给单元,其将该卡盘工作台和该激光束照射单元相对地进行加工进给;
分度进给单元,其将该卡盘工作台和该激光束照射单元相对地进行分度进给;以及
控制单元,
该激光束照射单元包含:
激光振荡器;
反射镜,其对从该激光振荡器射出的激光束进行反射而向加工点传播;
输出测量单元,其对未被该反射镜反射而透过的激光束的漏光的输出进行测量;以及
聚光透镜,其将通过该反射镜而传播的激光束会聚而照射至被加工物,
该控制单元一边对被加工物照射激光束一边利用该输出测量单元对该激光束的漏光的输出进行测量。
2.根据权利要求1所述的激光加工装置,其中,
该控制单元包含:
信号生成部,其生成对该激光振荡器的脉冲振荡的时机进行控制的信号;以及
信号同步部,其使该信号生成部所生成的信号与利用该输出测量单元对激光束的漏光的输出进行测量的时机同步,
仅在从该激光振荡器振荡出脉冲激光的期间利用该输出测量单元对激光束的漏光的输出进行测量。
3.根据权利要求1或2所述的激光加工装置,其中,
该激光束的漏光通过配设在该输出测量单元的前方的仅使加工中所使用的波长的激光束透过的波长选择滤波器而入射至该输出测量单元。
4.根据权利要求1或2所述的激光加工装置,其中,
该输出测量单元是位置检测元件。
5.根据权利要求1或2所述的激光加工装置,其中,
该控制单元还包含警告通知部,当该输出测量单元所测量的激光束的漏光的输出超出规定的阈值的范围时,该警告通知部通知警告。
6.根据权利要求1或2所述的激光加工装置,其中,
该输出测量单元与测量激光束的漏光的输出同时地测量位置信息。
7.根据权利要求6所述的激光加工装置,其中,
该控制单元还包含合格与否判定部和记录部中的至少任意一个,
该合格与否判定部对该输出测量单元所测量的激光束的漏光的位置的变动量是否在规定的阈值的范围内进行判定,
该记录部对该输出测量单元所测量的数据进行记录。
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