JP7411381B2 - ダイシングテープ、及び半導体部品の製造方法 - Google Patents
ダイシングテープ、及び半導体部品の製造方法 Download PDFInfo
- Publication number
- JP7411381B2 JP7411381B2 JP2019195485A JP2019195485A JP7411381B2 JP 7411381 B2 JP7411381 B2 JP 7411381B2 JP 2019195485 A JP2019195485 A JP 2019195485A JP 2019195485 A JP2019195485 A JP 2019195485A JP 7411381 B2 JP7411381 B2 JP 7411381B2
- Authority
- JP
- Japan
- Prior art keywords
- base film
- dicing tape
- adhesive layer
- resin
- dicing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title claims description 40
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000012790 adhesive layer Substances 0.000 claims description 69
- 229920005989 resin Polymers 0.000 claims description 47
- 239000011347 resin Substances 0.000 claims description 47
- 230000001070 adhesive effect Effects 0.000 claims description 36
- 239000000853 adhesive Substances 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 34
- 229920001721 polyimide Polymers 0.000 claims description 15
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 13
- 229920002530 polyetherether ketone Polymers 0.000 claims description 13
- 239000004642 Polyimide Substances 0.000 claims description 12
- 239000011241 protective layer Substances 0.000 claims description 12
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 10
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 10
- 238000005520 cutting process Methods 0.000 claims description 7
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 claims description 5
- 229920002312 polyamide-imide Polymers 0.000 claims description 5
- 239000000463 material Substances 0.000 description 11
- 235000012431 wafers Nutrition 0.000 description 11
- 239000010410 layer Substances 0.000 description 10
- 239000003795 chemical substances by application Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 238000002834 transmittance Methods 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 6
- -1 polypropylene Polymers 0.000 description 6
- 239000004952 Polyamide Substances 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 4
- 229920002647 polyamide Polymers 0.000 description 4
- 229920001707 polybutylene terephthalate Polymers 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229920001155 polypropylene Polymers 0.000 description 4
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 4
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000004677 Nylon Substances 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 229920006015 heat resistant resin Polymers 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229920013716 polyethylene resin Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 229920005672 polyolefin resin Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000013464 silicone adhesive Substances 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004823 Reactive adhesive Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920006295 polythiol Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
Landscapes
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesive Tapes (AREA)
- Dicing (AREA)
- Adhesives Or Adhesive Processes (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019195485A JP7411381B2 (ja) | 2019-10-28 | 2019-10-28 | ダイシングテープ、及び半導体部品の製造方法 |
TW109135806A TW202131399A (zh) | 2019-10-28 | 2020-10-16 | 切割帶以及半導體零件之製造方法 |
KR1020200137927A KR20210050466A (ko) | 2019-10-28 | 2020-10-23 | 다이싱 테이프 및 반도체 부품의 제조 방법 |
CN202011162046.5A CN112736009A (zh) | 2019-10-28 | 2020-10-27 | 切割带及半导体部件的制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019195485A JP7411381B2 (ja) | 2019-10-28 | 2019-10-28 | ダイシングテープ、及び半導体部品の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021068877A JP2021068877A (ja) | 2021-04-30 |
JP7411381B2 true JP7411381B2 (ja) | 2024-01-11 |
Family
ID=75597317
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019195485A Active JP7411381B2 (ja) | 2019-10-28 | 2019-10-28 | ダイシングテープ、及び半導体部品の製造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7411381B2 (zh) |
KR (1) | KR20210050466A (zh) |
CN (1) | CN112736009A (zh) |
TW (1) | TW202131399A (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7005805B1 (ja) * | 2021-04-28 | 2022-02-10 | 藤森工業株式会社 | テープ |
KR102467494B1 (ko) * | 2021-09-09 | 2022-11-16 | 주식회사 일레븐전자 | 감압형 점착 테이프 제조장치 및 제조방법 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006339652A (ja) | 2005-06-03 | 2006-12-14 | Ls Cable Ltd | 半導体用ダイシングダイ接着フィルム |
JP2012156511A (ja) | 2012-02-08 | 2012-08-16 | Nitto Denko Corp | ダイシング・ダイボンドフィルム |
JP2013155295A (ja) | 2012-01-30 | 2013-08-15 | Nitto Denko Corp | 伸長性加熱剥離型粘着シート |
WO2018083982A1 (ja) | 2016-11-01 | 2018-05-11 | リンテック株式会社 | ダイシングダイボンディングシート、及び半導体チップの製造方法 |
JP2018081954A (ja) | 2016-11-14 | 2018-05-24 | 日東電工株式会社 | シート、テープおよび半導体装置の製造方法 |
JP2018113356A (ja) | 2017-01-12 | 2018-07-19 | リンテック株式会社 | 半導体加工用シートおよび半導体装置の製造方法 |
JP2018170427A (ja) | 2017-03-30 | 2018-11-01 | リンテック株式会社 | 半導体加工用シートおよび半導体装置の製造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59188940A (ja) * | 1983-04-11 | 1984-10-26 | Hitachi Ltd | 粘着シ−ト |
JP2604899B2 (ja) * | 1990-10-11 | 1997-04-30 | 三井東圧化学株式会社 | 半導体ウエハ加工用フィルムの製造方法 |
-
2019
- 2019-10-28 JP JP2019195485A patent/JP7411381B2/ja active Active
-
2020
- 2020-10-16 TW TW109135806A patent/TW202131399A/zh unknown
- 2020-10-23 KR KR1020200137927A patent/KR20210050466A/ko unknown
- 2020-10-27 CN CN202011162046.5A patent/CN112736009A/zh active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006339652A (ja) | 2005-06-03 | 2006-12-14 | Ls Cable Ltd | 半導体用ダイシングダイ接着フィルム |
JP2013155295A (ja) | 2012-01-30 | 2013-08-15 | Nitto Denko Corp | 伸長性加熱剥離型粘着シート |
JP2012156511A (ja) | 2012-02-08 | 2012-08-16 | Nitto Denko Corp | ダイシング・ダイボンドフィルム |
WO2018083982A1 (ja) | 2016-11-01 | 2018-05-11 | リンテック株式会社 | ダイシングダイボンディングシート、及び半導体チップの製造方法 |
JP2018081954A (ja) | 2016-11-14 | 2018-05-24 | 日東電工株式会社 | シート、テープおよび半導体装置の製造方法 |
JP2018113356A (ja) | 2017-01-12 | 2018-07-19 | リンテック株式会社 | 半導体加工用シートおよび半導体装置の製造方法 |
JP2018170427A (ja) | 2017-03-30 | 2018-11-01 | リンテック株式会社 | 半導体加工用シートおよび半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2021068877A (ja) | 2021-04-30 |
KR20210050466A (ko) | 2021-05-07 |
CN112736009A (zh) | 2021-04-30 |
TW202131399A (zh) | 2021-08-16 |
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