JP7411381B2 - ダイシングテープ、及び半導体部品の製造方法 - Google Patents

ダイシングテープ、及び半導体部品の製造方法 Download PDF

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Publication number
JP7411381B2
JP7411381B2 JP2019195485A JP2019195485A JP7411381B2 JP 7411381 B2 JP7411381 B2 JP 7411381B2 JP 2019195485 A JP2019195485 A JP 2019195485A JP 2019195485 A JP2019195485 A JP 2019195485A JP 7411381 B2 JP7411381 B2 JP 7411381B2
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JP
Japan
Prior art keywords
base film
dicing tape
adhesive layer
resin
dicing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019195485A
Other languages
English (en)
Japanese (ja)
Other versions
JP2021068877A (ja
Inventor
佑奈 鈴木
憲治 千嶋
直宏 野村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujimori Kogyo Co Ltd
Original Assignee
Fujimori Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimori Kogyo Co Ltd filed Critical Fujimori Kogyo Co Ltd
Priority to JP2019195485A priority Critical patent/JP7411381B2/ja
Priority to TW109135806A priority patent/TW202131399A/zh
Priority to KR1020200137927A priority patent/KR20210050466A/ko
Priority to CN202011162046.5A priority patent/CN112736009A/zh
Publication of JP2021068877A publication Critical patent/JP2021068877A/ja
Application granted granted Critical
Publication of JP7411381B2 publication Critical patent/JP7411381B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling

Landscapes

  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2019195485A 2019-10-28 2019-10-28 ダイシングテープ、及び半導体部品の製造方法 Active JP7411381B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019195485A JP7411381B2 (ja) 2019-10-28 2019-10-28 ダイシングテープ、及び半導体部品の製造方法
TW109135806A TW202131399A (zh) 2019-10-28 2020-10-16 切割帶以及半導體零件之製造方法
KR1020200137927A KR20210050466A (ko) 2019-10-28 2020-10-23 다이싱 테이프 및 반도체 부품의 제조 방법
CN202011162046.5A CN112736009A (zh) 2019-10-28 2020-10-27 切割带及半导体部件的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019195485A JP7411381B2 (ja) 2019-10-28 2019-10-28 ダイシングテープ、及び半導体部品の製造方法

Publications (2)

Publication Number Publication Date
JP2021068877A JP2021068877A (ja) 2021-04-30
JP7411381B2 true JP7411381B2 (ja) 2024-01-11

Family

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Application Number Title Priority Date Filing Date
JP2019195485A Active JP7411381B2 (ja) 2019-10-28 2019-10-28 ダイシングテープ、及び半導体部品の製造方法

Country Status (4)

Country Link
JP (1) JP7411381B2 (zh)
KR (1) KR20210050466A (zh)
CN (1) CN112736009A (zh)
TW (1) TW202131399A (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7005805B1 (ja) * 2021-04-28 2022-02-10 藤森工業株式会社 テープ
KR102467494B1 (ko) * 2021-09-09 2022-11-16 주식회사 일레븐전자 감압형 점착 테이프 제조장치 및 제조방법

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006339652A (ja) 2005-06-03 2006-12-14 Ls Cable Ltd 半導体用ダイシングダイ接着フィルム
JP2012156511A (ja) 2012-02-08 2012-08-16 Nitto Denko Corp ダイシング・ダイボンドフィルム
JP2013155295A (ja) 2012-01-30 2013-08-15 Nitto Denko Corp 伸長性加熱剥離型粘着シート
WO2018083982A1 (ja) 2016-11-01 2018-05-11 リンテック株式会社 ダイシングダイボンディングシート、及び半導体チップの製造方法
JP2018081954A (ja) 2016-11-14 2018-05-24 日東電工株式会社 シート、テープおよび半導体装置の製造方法
JP2018113356A (ja) 2017-01-12 2018-07-19 リンテック株式会社 半導体加工用シートおよび半導体装置の製造方法
JP2018170427A (ja) 2017-03-30 2018-11-01 リンテック株式会社 半導体加工用シートおよび半導体装置の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59188940A (ja) * 1983-04-11 1984-10-26 Hitachi Ltd 粘着シ−ト
JP2604899B2 (ja) * 1990-10-11 1997-04-30 三井東圧化学株式会社 半導体ウエハ加工用フィルムの製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006339652A (ja) 2005-06-03 2006-12-14 Ls Cable Ltd 半導体用ダイシングダイ接着フィルム
JP2013155295A (ja) 2012-01-30 2013-08-15 Nitto Denko Corp 伸長性加熱剥離型粘着シート
JP2012156511A (ja) 2012-02-08 2012-08-16 Nitto Denko Corp ダイシング・ダイボンドフィルム
WO2018083982A1 (ja) 2016-11-01 2018-05-11 リンテック株式会社 ダイシングダイボンディングシート、及び半導体チップの製造方法
JP2018081954A (ja) 2016-11-14 2018-05-24 日東電工株式会社 シート、テープおよび半導体装置の製造方法
JP2018113356A (ja) 2017-01-12 2018-07-19 リンテック株式会社 半導体加工用シートおよび半導体装置の製造方法
JP2018170427A (ja) 2017-03-30 2018-11-01 リンテック株式会社 半導体加工用シートおよび半導体装置の製造方法

Also Published As

Publication number Publication date
JP2021068877A (ja) 2021-04-30
KR20210050466A (ko) 2021-05-07
CN112736009A (zh) 2021-04-30
TW202131399A (zh) 2021-08-16

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