JP7383377B2 - フルサイズマスク組立体とその製造方法 - Google Patents
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2059—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam
- G03F7/2063—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam for the production of exposure masks or reticles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
- H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
- H10K71/233—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers by photolithographic etching
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
Description
100:フレーム
110:支持部
120:フレーム開口部
200:構造用補助マスク
210:構造用補助マスク開口部
220:支柱
221:第1セル単位支持部
222:第2セル単位支持部
223:セル単位離隔部
224:突出部
300:セル単位マスク
310:蒸着パターン部
311:第1位置整列ホール
312:第2位置整列ホール
320:セル単位結合部
321:溶接点
322:第1セル単位結合部
323:第2セル単位結合部
Claims (7)
- フレーム開口部が形成され、前記フレーム開口部を囲む支持部を有するフレーム;
変形を防止すべく前記支持部によって支持され、複数個の構造用補助マスク開口部が形成されるように格子形態をなす複数の支柱を有する構造用補助マスク;および
前記構造用補助マスクによって支持され、蒸着物質を通過させる蒸着パターン部を具備した複数個のセル単位マスクを含み、
前記複数の支柱は、第1方向でセル単位マスクを支持する第1セル単位支持部と、前記第1方向と直交する第2方向でセル単位マスクを支持する第2セル単位支持部と,前記第1セル単位支持部と第2セル単位支持部の間の領域であって互いに離隔させるセル単位離隔部と、縁から突出して延びた突出部を含み、
前記突出部は、引張された状態で、前記フレームに溶接によって接合されるフレーム結合部を含む、フルサイズマスク組立体。 - フルサイズマスク組立体であって、
フレーム開口部が形成され、前記フレーム開口部を囲む支持部を有するフレーム;
変形を防止すべく前記支持部によって支持され、複数個の構造用補助マスク開口部が形成されるように格子形態をなす複数個の支柱を有する構造用補助マスク;および
前記構造用補助マスクによって支持され、蒸着物質を通過させる蒸着パターン部を具備した複数個のセル単位マスクを含み、
前記セル単位マスクは、前記構造用補助マスクの上面に個別的に固定されるために、下面に二つ以上のセル単位結合部を更に含み、
前記セル単位結合部は並んで配置された複数個の溶接点であり、
前記溶接点は、前記構造用補助マスクに前記セル単位マスクを固定する時に、前記フルサイズマスク組立体の下部に位置した溶接用レーザー光による溶接時に発生したバリ(bur)を有し、蒸着時に前記セル単位マスク上にTFTガラスが置かれる時、前記発生したバリは、前記セル単位マスクの上面と前記TFTガラスの下面との間の浮き上がりを招かない、フルサイズマスク組立体。 - 前記セル単位マスクは、垂直方向でTFTガラスのTFT位置互いに一致するようにして整列される、請求項1または2に記載のフルサイズマスク組立体。
- フレームに形成されたフレーム開口部に構造用補助マスクを対向させて整列させる構造用補助マスク整列段階;
構造用補助マスク開口部が形成されるように格子形態をなした前記構造用補助マスクの複数個の支柱のうち、縁から突出して延長された突出部の両端を引張する構造用補助マスク引張段階;
前記突出部が引張された状態で前記突出部のうち、フレーム結合部が前記フレームに溶接接合される構造用補助マスク固定段階;
セルマスクグリッパー(gripper)がセル単位マスクを第1方向及び第2方向に引張支持するセル単位マスク引張段階;
前記構造用補助マスクに形成された構造用補助マスク開口部にそれぞれの前記セル単位マスクを対向させて整列させるセル単位マスク整列段階;および
前記構造用補助マスクと前記セル単位マスクの間にセル単位結合部を形成して前記構造用補助マスクに前記セル単位マスクを固定するセル単位マスク固定段階を含む、
フルサイズマスク組立体の製造方法。 - 前記セル単位マスク整列段階は、
蒸着物質を通過させる蒸着パターン部のうちある一側の角に位置した第1位置整列ホールを垂直方向で前記構造用補助マスク開口部内に整列させるセル単位マスク第1位置整列段階;
前記蒸着パターン部のうち多数個の第2位置整列ホールを垂直方向でTFTガラスのTFT位置に整列させるセル単位マスク第2位置整列段階;および
前記構造用補助マスク開口部に前記セル単位マスクを装着させるセル単位マスク装着段階をさらに含む、請求項4に記載のフルサイズマスク組立体の製造方法。 - 前記セル単位マスク第2位置整列段階は、
前記第2位置整列ホールの中心と前記TFT位置とを一致させる、請求項5に記載のフルサイズマスク組立体の製造方法。 - 前記セル単位マスク固定段階は、
フルサイズマスク組立体の下部に位置したレーザー光によって前記構造用補助マスクと前記セル単位マスクを溶接する、請求項4から6のいずれか一項に記載のフルサイズマスク組立体の製造方法。
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WO2018110253A1 (ja) * | 2016-12-14 | 2018-06-21 | 大日本印刷株式会社 | 蒸着マスク装置及び蒸着マスク装置の製造方法 |
KR101909582B1 (ko) * | 2018-06-04 | 2018-10-18 | 주식회사 케이피에스 | 풀 사이즈 마스크 조립체와 그 제조방법 |
KR20200082919A (ko) * | 2018-12-31 | 2020-07-08 | 엘지디스플레이 주식회사 | 마스크 및 이의 제조 방법 |
KR20200092534A (ko) * | 2019-01-24 | 2020-08-04 | 삼성디스플레이 주식회사 | 표시장치 제조를 위한 마스크유닛 |
WO2021092759A1 (zh) * | 2019-11-12 | 2021-05-20 | 京东方科技集团股份有限公司 | 掩模板 |
CN111020478B (zh) * | 2019-12-18 | 2022-08-09 | 京东方科技集团股份有限公司 | 掩膜板组件及一种蒸镀设备 |
CN111041416B (zh) * | 2020-01-03 | 2021-12-07 | 京东方科技集团股份有限公司 | 掩膜板组件及制作掩膜板组件的方法 |
JP2021175824A (ja) * | 2020-03-13 | 2021-11-04 | 大日本印刷株式会社 | 有機デバイスの製造装置の蒸着室の評価方法、評価方法で用いられる標準マスク装置及び標準基板、標準マスク装置の製造方法、評価方法で評価された蒸着室を備える有機デバイスの製造装置、評価方法で評価された蒸着室において形成された蒸着層を備える有機デバイス、並びに有機デバイスの製造装置の蒸着室のメンテナンス方法 |
CN111394692B (zh) * | 2020-05-09 | 2022-05-13 | 京东方科技集团股份有限公司 | 掩膜版 |
CN111394694A (zh) * | 2020-05-18 | 2020-07-10 | 昆山国显光电有限公司 | 掩膜板 |
CN111500981B (zh) * | 2020-06-10 | 2022-06-24 | 京东方科技集团股份有限公司 | 掩膜版 |
CN111575648B (zh) * | 2020-06-23 | 2022-07-15 | 京东方科技集团股份有限公司 | 掩膜板组件及其制造方法 |
KR20220006152A (ko) * | 2020-07-07 | 2022-01-17 | 삼성디스플레이 주식회사 | 마스크 어셈블리, 이를 통해 제조되는 마스크, 및 표시 패널 제조 방법 |
KR20220030437A (ko) | 2020-08-31 | 2022-03-11 | 삼성디스플레이 주식회사 | 마스크, 이의 제조 방법, 및 표시 패널 제조 방법 |
CN112267092B (zh) * | 2020-10-27 | 2023-04-07 | 京东方科技集团股份有限公司 | 掩膜板及其制备方法 |
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