JP7374710B2 - 研磨方法および研磨装置 - Google Patents

研磨方法および研磨装置 Download PDF

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Publication number
JP7374710B2
JP7374710B2 JP2019194182A JP2019194182A JP7374710B2 JP 7374710 B2 JP7374710 B2 JP 7374710B2 JP 2019194182 A JP2019194182 A JP 2019194182A JP 2019194182 A JP2019194182 A JP 2019194182A JP 7374710 B2 JP7374710 B2 JP 7374710B2
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Japan
Prior art keywords
polishing
substrate
head
static
end point
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Application number
JP2019194182A
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English (en)
Japanese (ja)
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JP2021065990A (ja
JP2021065990A5 (https=
Inventor
遊 石井
哲二 戸川
篤史 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
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Ebara Corp
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Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2019194182A priority Critical patent/JP7374710B2/ja
Priority to US17/072,870 priority patent/US11618123B2/en
Priority to SG10202010318TA priority patent/SG10202010318TA/en
Priority to TW109136371A priority patent/TWI875845B/zh
Priority to KR1020200136637A priority patent/KR102780283B1/ko
Priority to EP20203265.2A priority patent/EP3812094B1/en
Priority to CN202011147586.6A priority patent/CN112706002B/zh
Publication of JP2021065990A publication Critical patent/JP2021065990A/ja
Publication of JP2021065990A5 publication Critical patent/JP2021065990A5/ja
Application granted granted Critical
Publication of JP7374710B2 publication Critical patent/JP7374710B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2019194182A 2019-10-25 2019-10-25 研磨方法および研磨装置 Active JP7374710B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2019194182A JP7374710B2 (ja) 2019-10-25 2019-10-25 研磨方法および研磨装置
US17/072,870 US11618123B2 (en) 2019-10-25 2020-10-16 Polishing method and polishing apparatus
SG10202010318TA SG10202010318TA (en) 2019-10-25 2020-10-19 Polishing method and polishing apparatus
KR1020200136637A KR102780283B1 (ko) 2019-10-25 2020-10-21 연마 방법 및 연마 장치
TW109136371A TWI875845B (zh) 2019-10-25 2020-10-21 研磨方法及研磨裝置
EP20203265.2A EP3812094B1 (en) 2019-10-25 2020-10-22 Polishing method and polishing apparatus
CN202011147586.6A CN112706002B (zh) 2019-10-25 2020-10-23 研磨方法及研磨装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019194182A JP7374710B2 (ja) 2019-10-25 2019-10-25 研磨方法および研磨装置

Publications (3)

Publication Number Publication Date
JP2021065990A JP2021065990A (ja) 2021-04-30
JP2021065990A5 JP2021065990A5 (https=) 2022-08-12
JP7374710B2 true JP7374710B2 (ja) 2023-11-07

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019194182A Active JP7374710B2 (ja) 2019-10-25 2019-10-25 研磨方法および研磨装置

Country Status (7)

Country Link
US (1) US11618123B2 (https=)
EP (1) EP3812094B1 (https=)
JP (1) JP7374710B2 (https=)
KR (1) KR102780283B1 (https=)
CN (1) CN112706002B (https=)
SG (1) SG10202010318TA (https=)
TW (1) TWI875845B (https=)

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* Cited by examiner, † Cited by third party
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JP7443169B2 (ja) * 2020-06-29 2024-03-05 株式会社荏原製作所 基板処理装置、基板処理方法、および基板処理方法を基板処理装置のコンピュータに実行させるためのプログラムを格納した記憶媒体
EP4182119A4 (en) * 2020-07-14 2024-08-07 Applied Materials, Inc. METHOD FOR DETECTING NON-CONFORMING SUBSTRATE PROCESSING EVENTS DURING CHEMICAL MECHANICAL POLISHING
JP2023002464A (ja) * 2021-06-22 2023-01-10 株式会社荏原製作所 研磨方法および研磨装置
WO2022270345A1 (ja) * 2021-06-22 2022-12-29 株式会社荏原製作所 研磨方法および研磨装置
JP2024093733A (ja) 2022-12-27 2024-07-09 株式会社荏原製作所 研磨方法、研磨装置、および記録媒体
CN116604407A (zh) * 2023-06-26 2023-08-18 上海中欣晶圆半导体科技有限公司 一种中精抛一体化的硅片加工方法

Citations (1)

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JP4838614B2 (ja) * 2006-03-29 2011-12-14 株式会社岡本工作機械製作所 半導体基板の平坦化装置および平坦化方法
JP2009028856A (ja) * 2007-07-27 2009-02-12 Tokyo Seimitsu Co Ltd トルク変化を利用した研磨終端時点検知方法及びその装置
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Also Published As

Publication number Publication date
SG10202010318TA (en) 2021-05-28
JP2021065990A (ja) 2021-04-30
KR102780283B1 (ko) 2025-03-14
CN112706002B (zh) 2024-05-14
TW202128351A (zh) 2021-08-01
US20210170541A1 (en) 2021-06-10
CN112706002A (zh) 2021-04-27
EP3812094B1 (en) 2024-05-29
KR20210049683A (ko) 2021-05-06
TWI875845B (zh) 2025-03-11
US11618123B2 (en) 2023-04-04
EP3812094A1 (en) 2021-04-28

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