KR102780283B1 - 연마 방법 및 연마 장치 - Google Patents

연마 방법 및 연마 장치 Download PDF

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Publication number
KR102780283B1
KR102780283B1 KR1020200136637A KR20200136637A KR102780283B1 KR 102780283 B1 KR102780283 B1 KR 102780283B1 KR 1020200136637 A KR1020200136637 A KR 1020200136637A KR 20200136637 A KR20200136637 A KR 20200136637A KR 102780283 B1 KR102780283 B1 KR 102780283B1
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South Korea
Prior art keywords
polishing
substrate
head
torque
time
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KR1020200136637A
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Korean (ko)
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KR20210049683A (ko
Inventor
유 이시이
데츠지 도가와
아츠시 요시다
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • H01L21/30625—
    • H01L21/67092—
    • H01L22/26—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020200136637A 2019-10-25 2020-10-21 연마 방법 및 연마 장치 Active KR102780283B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2019-194182 2019-10-25
JP2019194182A JP7374710B2 (ja) 2019-10-25 2019-10-25 研磨方法および研磨装置

Publications (2)

Publication Number Publication Date
KR20210049683A KR20210049683A (ko) 2021-05-06
KR102780283B1 true KR102780283B1 (ko) 2025-03-14

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200136637A Active KR102780283B1 (ko) 2019-10-25 2020-10-21 연마 방법 및 연마 장치

Country Status (7)

Country Link
US (1) US11618123B2 (https=)
EP (1) EP3812094B1 (https=)
JP (1) JP7374710B2 (https=)
KR (1) KR102780283B1 (https=)
CN (1) CN112706002B (https=)
SG (1) SG10202010318TA (https=)
TW (1) TWI875845B (https=)

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JP7443169B2 (ja) * 2020-06-29 2024-03-05 株式会社荏原製作所 基板処理装置、基板処理方法、および基板処理方法を基板処理装置のコンピュータに実行させるためのプログラムを格納した記憶媒体
EP4182119A4 (en) * 2020-07-14 2024-08-07 Applied Materials, Inc. METHOD FOR DETECTING NON-CONFORMING SUBSTRATE PROCESSING EVENTS DURING CHEMICAL MECHANICAL POLISHING
JP2023002464A (ja) * 2021-06-22 2023-01-10 株式会社荏原製作所 研磨方法および研磨装置
WO2022270345A1 (ja) * 2021-06-22 2022-12-29 株式会社荏原製作所 研磨方法および研磨装置
JP2024093733A (ja) 2022-12-27 2024-07-09 株式会社荏原製作所 研磨方法、研磨装置、および記録媒体
CN116604407A (zh) * 2023-06-26 2023-08-18 上海中欣晶圆半导体科技有限公司 一种中精抛一体化的硅片加工方法

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US20010012751A1 (en) * 2000-01-28 2001-08-09 Lam Research Corporation System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques
US20130288572A1 (en) * 2012-04-26 2013-10-31 Applied Materials, Inc. Linear Prediction For Filtering Of Data During In-Situ Monitoring Of Polishing
JP2019030915A (ja) * 2017-08-04 2019-02-28 東芝メモリ株式会社 研磨装置、研磨方法、およびプログラム

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CN1197542A (zh) * 1995-09-13 1998-10-28 株式会社日立制作所 抛光方法和设备
JP3033488B2 (ja) 1996-03-27 2000-04-17 日本電気株式会社 研磨終点検出装置および方法
US8353738B2 (en) * 1998-11-06 2013-01-15 Semcon Tech, Llc Advanced finishing control
US7097534B1 (en) * 2000-07-10 2006-08-29 Applied Materials, Inc. Closed-loop control of a chemical mechanical polisher
US6494765B2 (en) * 2000-09-25 2002-12-17 Center For Tribology, Inc. Method and apparatus for controlled polishing
JP2003318140A (ja) 2002-04-26 2003-11-07 Applied Materials Inc 研磨方法及び装置
JP4838614B2 (ja) * 2006-03-29 2011-12-14 株式会社岡本工作機械製作所 半導体基板の平坦化装置および平坦化方法
JP2009028856A (ja) * 2007-07-27 2009-02-12 Tokyo Seimitsu Co Ltd トルク変化を利用した研磨終端時点検知方法及びその装置
JP2008091698A (ja) * 2006-10-03 2008-04-17 Matsushita Electric Ind Co Ltd 基板処理装置および基板処理方法
JP5009101B2 (ja) 2006-10-06 2012-08-22 株式会社荏原製作所 基板研磨装置
JP5057892B2 (ja) * 2007-08-30 2012-10-24 株式会社東京精密 トルク変化を利用した研磨終端時点検知方法及びその装置
US8616935B2 (en) * 2010-06-02 2013-12-31 Applied Materials, Inc. Control of overpolishing of multiple substrates on the same platen in chemical mechanical polishing
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JP6357260B2 (ja) * 2016-09-30 2018-07-11 株式会社荏原製作所 研磨装置、及び研磨方法
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US20010012751A1 (en) * 2000-01-28 2001-08-09 Lam Research Corporation System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques
US20130288572A1 (en) * 2012-04-26 2013-10-31 Applied Materials, Inc. Linear Prediction For Filtering Of Data During In-Situ Monitoring Of Polishing
JP2019030915A (ja) * 2017-08-04 2019-02-28 東芝メモリ株式会社 研磨装置、研磨方法、およびプログラム

Also Published As

Publication number Publication date
SG10202010318TA (en) 2021-05-28
JP2021065990A (ja) 2021-04-30
CN112706002B (zh) 2024-05-14
TW202128351A (zh) 2021-08-01
US20210170541A1 (en) 2021-06-10
CN112706002A (zh) 2021-04-27
EP3812094B1 (en) 2024-05-29
KR20210049683A (ko) 2021-05-06
TWI875845B (zh) 2025-03-11
US11618123B2 (en) 2023-04-04
JP7374710B2 (ja) 2023-11-07
EP3812094A1 (en) 2021-04-28

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