CN112706002B - 研磨方法及研磨装置 - Google Patents

研磨方法及研磨装置 Download PDF

Info

Publication number
CN112706002B
CN112706002B CN202011147586.6A CN202011147586A CN112706002B CN 112706002 B CN112706002 B CN 112706002B CN 202011147586 A CN202011147586 A CN 202011147586A CN 112706002 B CN112706002 B CN 112706002B
Authority
CN
China
Prior art keywords
polishing
grinding
substrate
head
swing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202011147586.6A
Other languages
English (en)
Chinese (zh)
Other versions
CN112706002A (zh
Inventor
石井遊
户川哲二
吉田笃史
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of CN112706002A publication Critical patent/CN112706002A/zh
Application granted granted Critical
Publication of CN112706002B publication Critical patent/CN112706002B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN202011147586.6A 2019-10-25 2020-10-23 研磨方法及研磨装置 Active CN112706002B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-194182 2019-10-25
JP2019194182A JP7374710B2 (ja) 2019-10-25 2019-10-25 研磨方法および研磨装置

Publications (2)

Publication Number Publication Date
CN112706002A CN112706002A (zh) 2021-04-27
CN112706002B true CN112706002B (zh) 2024-05-14

Family

ID=74701360

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202011147586.6A Active CN112706002B (zh) 2019-10-25 2020-10-23 研磨方法及研磨装置

Country Status (7)

Country Link
US (1) US11618123B2 (https=)
EP (1) EP3812094B1 (https=)
JP (1) JP7374710B2 (https=)
KR (1) KR102780283B1 (https=)
CN (1) CN112706002B (https=)
SG (1) SG10202010318TA (https=)
TW (1) TWI875845B (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7443169B2 (ja) * 2020-06-29 2024-03-05 株式会社荏原製作所 基板処理装置、基板処理方法、および基板処理方法を基板処理装置のコンピュータに実行させるためのプログラムを格納した記憶媒体
EP4182119A4 (en) * 2020-07-14 2024-08-07 Applied Materials, Inc. METHOD FOR DETECTING NON-CONFORMING SUBSTRATE PROCESSING EVENTS DURING CHEMICAL MECHANICAL POLISHING
JP2023002464A (ja) * 2021-06-22 2023-01-10 株式会社荏原製作所 研磨方法および研磨装置
WO2022270345A1 (ja) * 2021-06-22 2022-12-29 株式会社荏原製作所 研磨方法および研磨装置
JP2024093733A (ja) 2022-12-27 2024-07-09 株式会社荏原製作所 研磨方法、研磨装置、および記録媒体
CN116604407A (zh) * 2023-06-26 2023-08-18 上海中欣晶圆半导体科技有限公司 一种中精抛一体化的硅片加工方法

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08197417A (ja) * 1995-01-19 1996-08-06 Ebara Corp ポリッシングの終点検知方法
JPH09262743A (ja) * 1996-03-27 1997-10-07 Nec Corp 研磨終点検出装置および方法
JP2008110471A (ja) * 2006-10-06 2008-05-15 Ebara Corp 基板研磨装置、基板研磨方法、基板受取方法
JP2009059828A (ja) * 2007-08-30 2009-03-19 Tokyo Seimitsu Co Ltd トルク変化を利用した研磨終端時点検知方法及びその装置
JP2012138442A (ja) * 2010-12-27 2012-07-19 Ebara Corp ポリッシング装置およびポリッシング方法
JP2013219248A (ja) * 2012-04-10 2013-10-24 Ebara Corp 研磨装置および研磨方法
CN104070445A (zh) * 2013-03-29 2014-10-01 株式会社荏原制作所 研磨装置及磨损检测方法
US9308618B2 (en) * 2012-04-26 2016-04-12 Applied Materials, Inc. Linear prediction for filtering of data during in-situ monitoring of polishing
CN107877356A (zh) * 2016-09-30 2018-04-06 株式会社荏原制作所 研磨系统以及研磨方法
JP2019030915A (ja) * 2017-08-04 2019-02-28 東芝メモリ株式会社 研磨装置、研磨方法、およびプログラム

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1197542A (zh) * 1995-09-13 1998-10-28 株式会社日立制作所 抛光方法和设备
US8353738B2 (en) * 1998-11-06 2013-01-15 Semcon Tech, Llc Advanced finishing control
US6705930B2 (en) * 2000-01-28 2004-03-16 Lam Research Corporation System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques
US7097534B1 (en) * 2000-07-10 2006-08-29 Applied Materials, Inc. Closed-loop control of a chemical mechanical polisher
US6494765B2 (en) * 2000-09-25 2002-12-17 Center For Tribology, Inc. Method and apparatus for controlled polishing
JP2003318140A (ja) 2002-04-26 2003-11-07 Applied Materials Inc 研磨方法及び装置
JP4838614B2 (ja) * 2006-03-29 2011-12-14 株式会社岡本工作機械製作所 半導体基板の平坦化装置および平坦化方法
JP2009028856A (ja) * 2007-07-27 2009-02-12 Tokyo Seimitsu Co Ltd トルク変化を利用した研磨終端時点検知方法及びその装置
JP2008091698A (ja) * 2006-10-03 2008-04-17 Matsushita Electric Ind Co Ltd 基板処理装置および基板処理方法
US8616935B2 (en) * 2010-06-02 2013-12-31 Applied Materials, Inc. Control of overpolishing of multiple substrates on the same platen in chemical mechanical polishing
JP6145342B2 (ja) * 2013-07-12 2017-06-07 株式会社荏原製作所 膜厚測定装置、膜厚測定方法、および膜厚測定装置を備えた研磨装置
JP6030041B2 (ja) * 2013-11-01 2016-11-24 株式会社荏原製作所 研磨装置および研磨方法
US10029346B2 (en) * 2015-10-16 2018-07-24 Applied Materials, Inc. External clamp ring for a chemical mechanical polishing carrier head
TW201822953A (zh) * 2016-09-16 2018-07-01 美商應用材料股份有限公司 基於溝槽深度的電磁感應監控進行的過拋光
KR102526545B1 (ko) * 2017-03-06 2023-04-28 어플라이드 머티어리얼스, 인코포레이티드 Cmp 위치 특정 연마(lsp)를 위해 설계된 나선형 및 동심 이동

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08197417A (ja) * 1995-01-19 1996-08-06 Ebara Corp ポリッシングの終点検知方法
JPH09262743A (ja) * 1996-03-27 1997-10-07 Nec Corp 研磨終点検出装置および方法
JP2008110471A (ja) * 2006-10-06 2008-05-15 Ebara Corp 基板研磨装置、基板研磨方法、基板受取方法
JP2009059828A (ja) * 2007-08-30 2009-03-19 Tokyo Seimitsu Co Ltd トルク変化を利用した研磨終端時点検知方法及びその装置
JP2012138442A (ja) * 2010-12-27 2012-07-19 Ebara Corp ポリッシング装置およびポリッシング方法
JP2013219248A (ja) * 2012-04-10 2013-10-24 Ebara Corp 研磨装置および研磨方法
US9308618B2 (en) * 2012-04-26 2016-04-12 Applied Materials, Inc. Linear prediction for filtering of data during in-situ monitoring of polishing
CN104070445A (zh) * 2013-03-29 2014-10-01 株式会社荏原制作所 研磨装置及磨损检测方法
CN107877356A (zh) * 2016-09-30 2018-04-06 株式会社荏原制作所 研磨系统以及研磨方法
JP2018058197A (ja) * 2016-09-30 2018-04-12 株式会社荏原製作所 研磨装置、及び研磨方法
JP2019030915A (ja) * 2017-08-04 2019-02-28 東芝メモリ株式会社 研磨装置、研磨方法、およびプログラム

Also Published As

Publication number Publication date
SG10202010318TA (en) 2021-05-28
JP2021065990A (ja) 2021-04-30
KR102780283B1 (ko) 2025-03-14
TW202128351A (zh) 2021-08-01
US20210170541A1 (en) 2021-06-10
CN112706002A (zh) 2021-04-27
EP3812094B1 (en) 2024-05-29
KR20210049683A (ko) 2021-05-06
TWI875845B (zh) 2025-03-11
US11618123B2 (en) 2023-04-04
JP7374710B2 (ja) 2023-11-07
EP3812094A1 (en) 2021-04-28

Similar Documents

Publication Publication Date Title
CN112706002B (zh) 研磨方法及研磨装置
US8398456B2 (en) Polishing method, polishing apparatus and method of monitoring a substrate
CN110545958A (zh) 基板的研磨装置
TWI568535B (zh) Substrate holding device and grinding device
KR102685999B1 (ko) 기판 프로세싱 시스템을 위한 방법 및 평탄화된 멤브레인
JP2001129754A (ja) パッドプロファイルを測定する方法および装置、ならびにパッドコンディショニングプロセスの閉ループ制御
KR101276715B1 (ko) 폴리싱방법, 폴리싱장치, 및 폴리싱장치를 제어하기 위한 프로그램을 기록한 컴퓨터로 읽을 수 있는 기록매체
TW202201513A (zh) 研磨方法、研磨裝置、及記錄有程式之電腦可讀取記錄媒體
US6758726B2 (en) Partial-membrane carrier head
JP2001237206A (ja) 平坦化加工方法
US20220359219A1 (en) Chemical Mechanical Polishing With Die-Based Modification
JPH0911117A (ja) 平坦化方法及び平坦化装置
JP3902715B2 (ja) ポリッシング装置
JP2000233360A5 (https=)
KR20210131616A (ko) 화학적 기계적 연마 장치
KR20030089252A (ko) 반도체 웨이퍼 폴리싱장치의 패드콘디셔너 오동작 감지장치
KR20080096929A (ko) 화학기계적 연마 장치 및 연마 패드 컨디셔닝 방법
JP2000233360A (ja) ポリッシング装置

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant