JP7354479B1 - 接合体の製造方法、接合体、積層体の製造方法、積層体、デバイスの製造方法、及び、デバイス、並びに、ポリイミド含有前駆体部形成用組成物 - Google Patents

接合体の製造方法、接合体、積層体の製造方法、積層体、デバイスの製造方法、及び、デバイス、並びに、ポリイミド含有前駆体部形成用組成物 Download PDF

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JP7354479B1
JP7354479B1 JP2023522543A JP2023522543A JP7354479B1 JP 7354479 B1 JP7354479 B1 JP 7354479B1 JP 2023522543 A JP2023522543 A JP 2023522543A JP 2023522543 A JP2023522543 A JP 2023522543A JP 7354479 B1 JP7354479 B1 JP 7354479B1
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polyimide
containing precursor
substrate
group
bonding
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JPWO2023120037A1 (https=
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敦 中村
広祐 山下
和貴 友田
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Fujifilm Corp
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Fujifilm Corp
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  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
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JP2023522543A 2021-12-23 2022-11-25 接合体の製造方法、接合体、積層体の製造方法、積層体、デバイスの製造方法、及び、デバイス、並びに、ポリイミド含有前駆体部形成用組成物 Active JP7354479B1 (ja)

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