KR102949337B1 - 접합체의 제조 방법, 접합체, 적층체의 제조 방법, 적층체, 디바이스의 제조 방법, 및, 디바이스, 및, 폴리이미드 함유 전구체부 형성용 조성물 - Google Patents
접합체의 제조 방법, 접합체, 적층체의 제조 방법, 적층체, 디바이스의 제조 방법, 및, 디바이스, 및, 폴리이미드 함유 전구체부 형성용 조성물Info
- Publication number
- KR102949337B1 KR102949337B1 KR1020247020124A KR20247020124A KR102949337B1 KR 102949337 B1 KR102949337 B1 KR 102949337B1 KR 1020247020124 A KR1020247020124 A KR 1020247020124A KR 20247020124 A KR20247020124 A KR 20247020124A KR 102949337 B1 KR102949337 B1 KR 102949337B1
- Authority
- KR
- South Korea
- Prior art keywords
- polyimide
- substrate
- containing precursor
- group
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
- H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/04—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polycarbonamides, polyesteramides or polyimides
- C08F283/045—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polycarbonamides, polyesteramides or polyimides on to unsaturated polycarbonamides, polyesteramides or polyimides
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- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/1025—Preparatory processes from tetracarboxylic acids or derivatives and diamines polymerised by radiations
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- C—CHEMISTRY; METALLURGY
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- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
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- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
- C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
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- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/24—Homopolymers or copolymers of amides or imides
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- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
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- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
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- H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
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- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
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- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
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- H10W72/07331—Connecting techniques
- H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
- H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021209029 | 2021-12-23 | ||
| JPJP-P-2021-209029 | 2021-12-23 | ||
| JP2022158712 | 2022-09-30 | ||
| JPJP-P-2022-158712 | 2022-09-30 | ||
| JP2022181282 | 2022-11-11 | ||
| JPJP-P-2022-181282 | 2022-11-11 | ||
| PCT/JP2022/043600 WO2023120037A1 (ja) | 2021-12-23 | 2022-11-25 | 接合体の製造方法、接合体、積層体の製造方法、積層体、デバイスの製造方法、及び、デバイス、並びに、ポリイミド含有前駆体部形成用組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20240111777A KR20240111777A (ko) | 2024-07-17 |
| KR102949337B1 true KR102949337B1 (ko) | 2026-04-08 |
Family
ID=86902047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020247020124A Active KR102949337B1 (ko) | 2021-12-23 | 2022-11-25 | 접합체의 제조 방법, 접합체, 적층체의 제조 방법, 적층체, 디바이스의 제조 방법, 및, 디바이스, 및, 폴리이미드 함유 전구체부 형성용 조성물 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20240339368A1 (https=) |
| EP (1) | EP4456133A4 (https=) |
| JP (2) | JP7354479B1 (https=) |
| KR (1) | KR102949337B1 (https=) |
| TW (1) | TW202348726A (https=) |
| WO (1) | WO2023120037A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW202600623A (zh) * | 2024-02-22 | 2026-01-01 | 日商富士軟片股份有限公司 | 樹脂組成物、硬化物、積層體、硬化物之製造方法、積層體之製造方法、半導體元件之製造方法、半導體元件及聚醯亞胺前驅物之製造方法 |
| WO2026004705A1 (ja) * | 2024-06-25 | 2026-01-02 | 富士フイルム株式会社 | 樹脂組成物、接合体の製造方法、接合体、及び、デバイスの製造方法 |
| WO2026070909A1 (ja) * | 2024-09-27 | 2026-04-02 | 富士フイルム株式会社 | 基材接合用樹脂組成物、積層体の製造方法及び半導体デバイスの製造方法 |
| WO2026070803A1 (ja) * | 2024-09-27 | 2026-04-02 | 富士フイルム株式会社 | 接合体の製造方法、接合体、デバイスの製造方法、及び、樹脂組成物 |
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| TWI859372B (zh) | 2019-12-05 | 2024-10-21 | 日商富士軟片股份有限公司 | 硬化性樹脂組成物、硬化膜、積層體、硬化膜的製造方法、半導體器件及樹脂 |
-
2022
- 2022-11-25 JP JP2023522543A patent/JP7354479B1/ja active Active
- 2022-11-25 EP EP22910755.2A patent/EP4456133A4/en active Pending
- 2022-11-25 WO PCT/JP2022/043600 patent/WO2023120037A1/ja not_active Ceased
- 2022-11-25 KR KR1020247020124A patent/KR102949337B1/ko active Active
- 2022-12-06 TW TW111146730A patent/TW202348726A/zh unknown
-
2023
- 2023-09-20 JP JP2023152347A patent/JP2023178289A/ja active Pending
-
2024
- 2024-06-17 US US18/746,015 patent/US20240339368A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023120037A1 (ja) | 2023-06-29 |
| EP4456133A4 (en) | 2025-07-30 |
| KR20240111777A (ko) | 2024-07-17 |
| US20240339368A1 (en) | 2024-10-10 |
| JPWO2023120037A1 (https=) | 2023-06-29 |
| JP7354479B1 (ja) | 2023-10-02 |
| JP2023178289A (ja) | 2023-12-14 |
| EP4456133A1 (en) | 2024-10-30 |
| TW202348726A (zh) | 2023-12-16 |
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