JP7344647B2 - テープ貼着装置 - Google Patents

テープ貼着装置 Download PDF

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Publication number
JP7344647B2
JP7344647B2 JP2019026501A JP2019026501A JP7344647B2 JP 7344647 B2 JP7344647 B2 JP 7344647B2 JP 2019026501 A JP2019026501 A JP 2019026501A JP 2019026501 A JP2019026501 A JP 2019026501A JP 7344647 B2 JP7344647 B2 JP 7344647B2
Authority
JP
Japan
Prior art keywords
tape
side wall
passing
roller
support roller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019026501A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020132340A (ja
Inventor
篤史 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2019026501A priority Critical patent/JP7344647B2/ja
Priority to KR1020200006416A priority patent/KR20200100533A/ko
Priority to CN202010092656.6A priority patent/CN111573365A/zh
Priority to TW109104928A priority patent/TWI834813B/zh
Publication of JP2020132340A publication Critical patent/JP2020132340A/ja
Application granted granted Critical
Publication of JP7344647B2 publication Critical patent/JP7344647B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H19/00—Changing the web roll
    • B65H19/22—Changing the web roll in winding mechanisms or in connection with winding operations
    • B65H19/28—Attaching the leading end of the web to the replacement web-roll core or spindle
    • B65H19/286—Attaching the leading end of the web to the replacement web-roll core or spindle by applying adhesive to the web
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H35/00—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers
    • B65H35/0006—Article or web delivery apparatus incorporating cutting or line-perforating devices
    • B65H35/0013—Article or web delivery apparatus incorporating cutting or line-perforating devices and applying the article or the web by adhesive to a surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
JP2019026501A 2019-02-18 2019-02-18 テープ貼着装置 Active JP7344647B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019026501A JP7344647B2 (ja) 2019-02-18 2019-02-18 テープ貼着装置
KR1020200006416A KR20200100533A (ko) 2019-02-18 2020-01-17 테이프 첩착 장치
CN202010092656.6A CN111573365A (zh) 2019-02-18 2020-02-14 带粘贴装置
TW109104928A TWI834813B (zh) 2019-02-18 2020-02-17 膠帶貼附裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019026501A JP7344647B2 (ja) 2019-02-18 2019-02-18 テープ貼着装置

Publications (2)

Publication Number Publication Date
JP2020132340A JP2020132340A (ja) 2020-08-31
JP7344647B2 true JP7344647B2 (ja) 2023-09-14

Family

ID=72116906

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019026501A Active JP7344647B2 (ja) 2019-02-18 2019-02-18 テープ貼着装置

Country Status (3)

Country Link
JP (1) JP7344647B2 (zh)
KR (1) KR20200100533A (zh)
CN (1) CN111573365A (zh)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003026355A (ja) 2001-07-12 2003-01-29 Dainippon Printing Co Ltd 旋回装置
JP2018127323A (ja) 2017-02-08 2018-08-16 日東電工株式会社 粘着テープ接合方法、粘着テープ接合装置、および粘着テープ搬送方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0383758A (ja) * 1989-08-25 1991-04-09 Kaitou Seisakusho:Kk 材料自動交換接続手段並びに該手段を具えた巻取機装置
JP2001151393A (ja) * 1999-11-26 2001-06-05 Dainippon Printing Co Ltd ウェブ接合装置および同装置を備えたウェブ加工機
CN202400660U (zh) * 2011-12-31 2012-08-29 汕头市华鹰软包装设备总厂有限公司 用于卷筒材料的接料装置
JP6316673B2 (ja) 2014-06-24 2018-04-25 株式会社ディスコ テープ貼着装置
CN108675033A (zh) * 2018-04-11 2018-10-19 浙江华创机电科技有限公司 一种伸缩式接膜台

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003026355A (ja) 2001-07-12 2003-01-29 Dainippon Printing Co Ltd 旋回装置
JP2018127323A (ja) 2017-02-08 2018-08-16 日東電工株式会社 粘着テープ接合方法、粘着テープ接合装置、および粘着テープ搬送方法

Also Published As

Publication number Publication date
CN111573365A (zh) 2020-08-25
TW202032696A (zh) 2020-09-01
KR20200100533A (ko) 2020-08-26
JP2020132340A (ja) 2020-08-31

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