JP7304847B2 - 粘着剤組成物、粘着シートおよび加工物の製造方法 - Google Patents
粘着剤組成物、粘着シートおよび加工物の製造方法 Download PDFInfo
- Publication number
- JP7304847B2 JP7304847B2 JP2020509981A JP2020509981A JP7304847B2 JP 7304847 B2 JP7304847 B2 JP 7304847B2 JP 2020509981 A JP2020509981 A JP 2020509981A JP 2020509981 A JP2020509981 A JP 2020509981A JP 7304847 B2 JP7304847 B2 JP 7304847B2
- Authority
- JP
- Japan
- Prior art keywords
- meth
- pressure
- sensitive adhesive
- acrylate
- adhesive sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dicing (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018058130 | 2018-03-26 | ||
JP2018058130 | 2018-03-26 | ||
PCT/JP2019/012175 WO2019188819A1 (ja) | 2018-03-26 | 2019-03-22 | 粘着剤組成物、粘着シートおよび加工物の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2019188819A1 JPWO2019188819A1 (ja) | 2021-04-01 |
JP7304847B2 true JP7304847B2 (ja) | 2023-07-07 |
Family
ID=68061934
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020509981A Active JP7304847B2 (ja) | 2018-03-26 | 2019-03-22 | 粘着剤組成物、粘着シートおよび加工物の製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7304847B2 (ko) |
KR (1) | KR102644545B1 (ko) |
CN (1) | CN111742027B (ko) |
TW (1) | TWI798394B (ko) |
WO (1) | WO2019188819A1 (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021095449A (ja) * | 2019-12-13 | 2021-06-24 | 日東電工株式会社 | 粘着シート剥離方法 |
EP4166324A1 (en) * | 2020-06-15 | 2023-04-19 | Nissan Chemical Corporation | Laminate, release agent composition, and method for manufacturing processed semiconductor substrate |
WO2023195445A1 (ja) * | 2022-04-06 | 2023-10-12 | 日東電工株式会社 | 表面保護用組成物、表面保護シート、及び、電子部品装置の製造方法 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005054176A (ja) | 2003-07-18 | 2005-03-03 | Oji Paper Co Ltd | シート状発泡体およびその製造方法 |
JP2007035852A (ja) | 2005-07-26 | 2007-02-08 | Nitto Denko Corp | ダイシング・ダイボンドフィルム |
JP2010145428A (ja) | 2008-12-16 | 2010-07-01 | Oji Paper Co Ltd | 光学シートおよびその製造方法、照明装置、投影装置、看板並びに画像表示装置 |
JP2012126879A (ja) | 2010-06-10 | 2012-07-05 | Osaka City Univ | 易解体性粘着剤組成物及び易解体性粘着テープ |
WO2012165619A1 (ja) | 2011-06-02 | 2012-12-06 | Dic株式会社 | 易解体性粘着剤組成物及び易解体性粘着テープ |
JP2017179025A (ja) | 2016-03-29 | 2017-10-05 | リンテック株式会社 | ガラスダイシング用粘着シートおよびその製造方法 |
JP2017193624A (ja) | 2016-04-20 | 2017-10-26 | Dic株式会社 | 易解体性粘着テープ、物品及び物品の解体方法 |
JP2018026567A (ja) | 2017-08-21 | 2018-02-15 | 日立化成株式会社 | ダイシング・ダイボンディング一体型テープの製造方法 |
JP2018154737A (ja) | 2017-03-17 | 2018-10-04 | リンテック株式会社 | ワーク加工用粘着シートおよびその製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5519971B2 (ja) * | 2008-11-26 | 2014-06-11 | 日東電工株式会社 | ダイシング・ダイボンドフィルム及び半導体装置の製造方法 |
JP5491049B2 (ja) * | 2009-03-11 | 2014-05-14 | 日東電工株式会社 | 半導体ウエハ保護用基材レス粘着シート、その粘着シートを用いた半導体ウエハ裏面研削方法及びその粘着シートの製造方法 |
JP2012007047A (ja) * | 2010-06-23 | 2012-01-12 | Nitto Denko Corp | 再剥離粘着テープおよびその製造方法 |
GB201413222D0 (en) * | 2014-07-25 | 2014-09-10 | Ionex Sg Ltd | Treatment of liquid waste |
KR20180113199A (ko) * | 2016-02-29 | 2018-10-15 | 가부시끼가이샤 이테크 | 점착제 조성물 그리고 점착 시트 및 그의 제조 방법 |
KR20180111878A (ko) * | 2016-02-29 | 2018-10-11 | 가부시끼가이샤 이테크 | 점착제 조성물 및 점착 시트 |
JP6661438B2 (ja) * | 2016-03-29 | 2020-03-11 | リンテック株式会社 | ガラスダイシング用粘着シートおよびその製造方法 |
JP6703430B2 (ja) * | 2016-03-29 | 2020-06-03 | リンテック株式会社 | ガラスダイシング用粘着シートおよびその製造方法 |
-
2019
- 2019-03-22 JP JP2020509981A patent/JP7304847B2/ja active Active
- 2019-03-22 TW TW108110003A patent/TWI798394B/zh active
- 2019-03-22 CN CN201980014254.XA patent/CN111742027B/zh active Active
- 2019-03-22 KR KR1020207024194A patent/KR102644545B1/ko active IP Right Grant
- 2019-03-22 WO PCT/JP2019/012175 patent/WO2019188819A1/ja active Application Filing
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005054176A (ja) | 2003-07-18 | 2005-03-03 | Oji Paper Co Ltd | シート状発泡体およびその製造方法 |
JP2007035852A (ja) | 2005-07-26 | 2007-02-08 | Nitto Denko Corp | ダイシング・ダイボンドフィルム |
JP2010145428A (ja) | 2008-12-16 | 2010-07-01 | Oji Paper Co Ltd | 光学シートおよびその製造方法、照明装置、投影装置、看板並びに画像表示装置 |
JP2012126879A (ja) | 2010-06-10 | 2012-07-05 | Osaka City Univ | 易解体性粘着剤組成物及び易解体性粘着テープ |
WO2012165619A1 (ja) | 2011-06-02 | 2012-12-06 | Dic株式会社 | 易解体性粘着剤組成物及び易解体性粘着テープ |
JP2017179025A (ja) | 2016-03-29 | 2017-10-05 | リンテック株式会社 | ガラスダイシング用粘着シートおよびその製造方法 |
JP2017193624A (ja) | 2016-04-20 | 2017-10-26 | Dic株式会社 | 易解体性粘着テープ、物品及び物品の解体方法 |
JP2018154737A (ja) | 2017-03-17 | 2018-10-04 | リンテック株式会社 | ワーク加工用粘着シートおよびその製造方法 |
JP2018026567A (ja) | 2017-08-21 | 2018-02-15 | 日立化成株式会社 | ダイシング・ダイボンディング一体型テープの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20200132853A (ko) | 2020-11-25 |
CN111742027B (zh) | 2022-04-15 |
WO2019188819A1 (ja) | 2019-10-03 |
CN111742027A (zh) | 2020-10-02 |
KR102644545B1 (ko) | 2024-03-08 |
JPWO2019188819A1 (ja) | 2021-04-01 |
TWI798394B (zh) | 2023-04-11 |
TW201940633A (zh) | 2019-10-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7207778B2 (ja) | 半導体加工用粘着テープ、及び半導体装置の製造方法 | |
JP6580219B2 (ja) | 粘着シートおよび加工されたデバイス関連部材の製造方法 | |
JP7304847B2 (ja) | 粘着剤組成物、粘着シートおよび加工物の製造方法 | |
WO2018150859A1 (ja) | 積層シート | |
WO2013175987A1 (ja) | ダイシングシート | |
WO2015133420A1 (ja) | 半導体関連部材加工用シートおよび当該シートを用いるチップの製造方法 | |
JP6883019B2 (ja) | 半導体加工用シート | |
JP6412873B2 (ja) | 粘着シート | |
JP2020105309A (ja) | 粘着シート | |
JP6673734B2 (ja) | ガラスダイシング用粘着シートおよびその製造方法 | |
WO2016017265A1 (ja) | ダイシングシート、ダイシングシートの製造方法、およびモールドチップの製造方法 | |
JP6803674B2 (ja) | ガラスダイシング用粘着シートおよびその製造方法 | |
JP7382690B2 (ja) | ワーク加工用シート | |
JP7434306B2 (ja) | 粘着剤組成物および粘着シート | |
TWI770000B (zh) | 玻璃切割用黏著板片及其製造方法 | |
JP6087122B2 (ja) | ダイシングシート | |
JP6703430B2 (ja) | ガラスダイシング用粘着シートおよびその製造方法 | |
JP2020167258A (ja) | バックグラインドテープ | |
JP7010747B2 (ja) | 半導体加工用シート | |
JP6623098B2 (ja) | ガラスダイシング用粘着シートおよびその製造方法 | |
US20240010881A1 (en) | Adhesive tape and processing method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20211223 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20221108 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20230110 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230228 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230606 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230627 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7304847 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |