JP7292828B2 - 撮像素子モジュール、撮像システム、撮像素子パッケージ及び製造方法 - Google Patents

撮像素子モジュール、撮像システム、撮像素子パッケージ及び製造方法 Download PDF

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JP7292828B2
JP7292828B2 JP2018086514A JP2018086514A JP7292828B2 JP 7292828 B2 JP7292828 B2 JP 7292828B2 JP 2018086514 A JP2018086514 A JP 2018086514A JP 2018086514 A JP2018086514 A JP 2018086514A JP 7292828 B2 JP7292828 B2 JP 7292828B2
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imaging device
solid
linear expansion
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JP2019192855A (ja
JP2019192855A5 (enExample
Inventor
孝一 清水
忠志 小坂
修一 千葉
和也 野津
久種 小森
智 ▲濱▼▲崎▼
悠 片瀬
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Canon Inc
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Canon Inc
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Priority to JP2018086514A priority Critical patent/JP7292828B2/ja
Priority to US16/389,218 priority patent/US10735673B2/en
Priority to CN201910349261.7A priority patent/CN110416163A/zh
Publication of JP2019192855A publication Critical patent/JP2019192855A/ja
Publication of JP2019192855A5 publication Critical patent/JP2019192855A5/ja
Priority to JP2023061246A priority patent/JP7547541B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/802—Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
JP2018086514A 2018-04-27 2018-04-27 撮像素子モジュール、撮像システム、撮像素子パッケージ及び製造方法 Active JP7292828B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2018086514A JP7292828B2 (ja) 2018-04-27 2018-04-27 撮像素子モジュール、撮像システム、撮像素子パッケージ及び製造方法
US16/389,218 US10735673B2 (en) 2018-04-27 2019-04-19 Imaging device module, imaging system, imaging device package, and manufacturing method
CN201910349261.7A CN110416163A (zh) 2018-04-27 2019-04-28 摄像器件模块、摄像系统、摄像器件封装和制造方法
JP2023061246A JP7547541B2 (ja) 2018-04-27 2023-04-05 撮像素子モジュール、撮像システム、撮像素子パッケージ及び製造方法
JP2024145745A JP2024161135A (ja) 2018-04-27 2024-08-27 モジュール、システム、パッケージ

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JP2018086514A JP7292828B2 (ja) 2018-04-27 2018-04-27 撮像素子モジュール、撮像システム、撮像素子パッケージ及び製造方法

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JP2023061246A Division JP7547541B2 (ja) 2018-04-27 2023-04-05 撮像素子モジュール、撮像システム、撮像素子パッケージ及び製造方法

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JP2019192855A5 JP2019192855A5 (enExample) 2021-06-10
JP7292828B2 true JP7292828B2 (ja) 2023-06-19

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JP2023061246A Active JP7547541B2 (ja) 2018-04-27 2023-04-05 撮像素子モジュール、撮像システム、撮像素子パッケージ及び製造方法
JP2024145745A Pending JP2024161135A (ja) 2018-04-27 2024-08-27 モジュール、システム、パッケージ

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JP2024145745A Pending JP2024161135A (ja) 2018-04-27 2024-08-27 モジュール、システム、パッケージ

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US (1) US10735673B2 (enExample)
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JP7406314B2 (ja) * 2019-06-24 2023-12-27 キヤノン株式会社 電子モジュール及び機器
JP7490377B2 (ja) * 2020-02-05 2024-05-27 キヤノン株式会社 撮像素子パッケージ
CN111934188B (zh) * 2020-07-08 2022-06-10 武汉光迅科技股份有限公司 激光器的形成方法和形成设备
CN112525902B (zh) * 2020-11-13 2022-11-08 昆明理工大学 一种合金抗氧化性能的高通量测试方法
CN113955712A (zh) * 2021-09-30 2022-01-21 瑞声开泰科技(武汉)有限公司 导电结构及其制备方法
US12341126B2 (en) * 2022-04-27 2025-06-24 Texas Instruments Incorporated Bump to package substrate solder joint
JP2024039630A (ja) * 2022-09-09 2024-03-22 株式会社カネカ 固体撮像素子パッケージ製造方法および固体撮像素子パッケージ
WO2025058924A1 (en) * 2023-09-15 2025-03-20 Intelligent Security Systems Corporation Technologies for under vehicle surveillance

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JP2005210319A (ja) 2004-01-21 2005-08-04 Pentax Corp ステージ装置及びこのステージ装置を利用したカメラの手振れ補正装置
JP2013243339A (ja) 2012-04-27 2013-12-05 Canon Inc 電子部品、電子モジュールおよびこれらの製造方法。
JP2015185763A (ja) 2014-03-25 2015-10-22 エムテックスマツムラ株式会社 半導体素子実装用中空パッケージ
JP2017188621A (ja) 2016-04-08 2017-10-12 クラスターテクノロジー株式会社 半導体素子実装パッケージおよびその製造方法、ならびに当該パッケージ製造のための基板プレート
JP2017212351A (ja) 2016-05-26 2017-11-30 キヤノン株式会社 撮像装置

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JP2004349318A (ja) 2003-05-20 2004-12-09 Shinko Electric Ind Co Ltd 半導体パッケージ及び半導体装置
JP4405208B2 (ja) * 2003-08-25 2010-01-27 株式会社ルネサステクノロジ 固体撮像装置の製造方法
JP2005101711A (ja) * 2003-09-22 2005-04-14 Renesas Technology Corp 固体撮像装置およびその製造方法
US8034652B2 (en) 2005-03-25 2011-10-11 Fujifilm Corporation Solid state imaging device and manufacturing method thereof
JP5095113B2 (ja) 2005-03-25 2012-12-12 富士フイルム株式会社 固体撮像装置の製造方法、及び固体撮像装置
JP2006287396A (ja) 2005-03-31 2006-10-19 Citizen Miyota Co Ltd 固体撮像装置及びその製造方法
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JP6780277B2 (ja) 2016-03-29 2020-11-04 株式会社ニコン 基板
JP2018046092A (ja) * 2016-09-13 2018-03-22 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体装置
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Publication number Priority date Publication date Assignee Title
JP2005210319A (ja) 2004-01-21 2005-08-04 Pentax Corp ステージ装置及びこのステージ装置を利用したカメラの手振れ補正装置
JP2013243339A (ja) 2012-04-27 2013-12-05 Canon Inc 電子部品、電子モジュールおよびこれらの製造方法。
JP2015185763A (ja) 2014-03-25 2015-10-22 エムテックスマツムラ株式会社 半導体素子実装用中空パッケージ
JP2017188621A (ja) 2016-04-08 2017-10-12 クラスターテクノロジー株式会社 半導体素子実装パッケージおよびその製造方法、ならびに当該パッケージ製造のための基板プレート
JP2017212351A (ja) 2016-05-26 2017-11-30 キヤノン株式会社 撮像装置

Also Published As

Publication number Publication date
JP2019192855A (ja) 2019-10-31
JP7547541B2 (ja) 2024-09-09
JP2024161135A (ja) 2024-11-15
US20190335119A1 (en) 2019-10-31
US10735673B2 (en) 2020-08-04
JP2023083334A (ja) 2023-06-15
CN110416163A (zh) 2019-11-05

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