CN110416163A - 摄像器件模块、摄像系统、摄像器件封装和制造方法 - Google Patents
摄像器件模块、摄像系统、摄像器件封装和制造方法 Download PDFInfo
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- CN110416163A CN110416163A CN201910349261.7A CN201910349261A CN110416163A CN 110416163 A CN110416163 A CN 110416163A CN 201910349261 A CN201910349261 A CN 201910349261A CN 110416163 A CN110416163 A CN 110416163A
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/804—Containers or encapsulations
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/51—Housings
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/802—Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018086514A JP7292828B2 (ja) | 2018-04-27 | 2018-04-27 | 撮像素子モジュール、撮像システム、撮像素子パッケージ及び製造方法 |
| JP2018-086514 | 2018-04-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110416163A true CN110416163A (zh) | 2019-11-05 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910349261.7A Pending CN110416163A (zh) | 2018-04-27 | 2019-04-28 | 摄像器件模块、摄像系统、摄像器件封装和制造方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US10735673B2 (enExample) |
| JP (3) | JP7292828B2 (enExample) |
| CN (1) | CN110416163A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111934188A (zh) * | 2020-07-08 | 2020-11-13 | 武汉光迅科技股份有限公司 | 激光器的形成方法和形成设备 |
| CN113955712A (zh) * | 2021-09-30 | 2022-01-21 | 瑞声开泰科技(武汉)有限公司 | 导电结构及其制备方法 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7406314B2 (ja) * | 2019-06-24 | 2023-12-27 | キヤノン株式会社 | 電子モジュール及び機器 |
| JP7490377B2 (ja) * | 2020-02-05 | 2024-05-27 | キヤノン株式会社 | 撮像素子パッケージ |
| CN112525902B (zh) * | 2020-11-13 | 2022-11-08 | 昆明理工大学 | 一种合金抗氧化性能的高通量测试方法 |
| US12341126B2 (en) * | 2022-04-27 | 2025-06-24 | Texas Instruments Incorporated | Bump to package substrate solder joint |
| JP2024039630A (ja) * | 2022-09-09 | 2024-03-22 | 株式会社カネカ | 固体撮像素子パッケージ製造方法および固体撮像素子パッケージ |
| WO2025058924A1 (en) * | 2023-09-15 | 2025-03-20 | Intelligent Security Systems Corporation | Technologies for under vehicle surveillance |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101449377A (zh) * | 2006-05-19 | 2009-06-03 | 住友电木株式会社 | 半导体器件 |
| CN101720165A (zh) * | 2008-10-08 | 2010-06-02 | 日本特殊陶业株式会社 | 组件内置布线基板及其制造方法 |
| JP2017188621A (ja) * | 2016-04-08 | 2017-10-12 | クラスターテクノロジー株式会社 | 半導体素子実装パッケージおよびその製造方法、ならびに当該パッケージ製造のための基板プレート |
Family Cites Families (26)
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|---|---|---|---|---|
| JP2843637B2 (ja) * | 1990-03-20 | 1999-01-06 | オリンパス光学工業株式会社 | カメラ装置 |
| JP2003101042A (ja) | 2001-09-25 | 2003-04-04 | Kyocera Corp | 光半導体素子収納用容器 |
| JP2004349318A (ja) | 2003-05-20 | 2004-12-09 | Shinko Electric Ind Co Ltd | 半導体パッケージ及び半導体装置 |
| JP4405208B2 (ja) * | 2003-08-25 | 2010-01-27 | 株式会社ルネサステクノロジ | 固体撮像装置の製造方法 |
| JP2005101711A (ja) * | 2003-09-22 | 2005-04-14 | Renesas Technology Corp | 固体撮像装置およびその製造方法 |
| JP4366197B2 (ja) | 2004-01-21 | 2009-11-18 | Ｈｏｙａ株式会社 | ステージ装置及びこのステージ装置を利用したカメラの手振れ補正装置 |
| US8034652B2 (en) | 2005-03-25 | 2011-10-11 | Fujifilm Corporation | Solid state imaging device and manufacturing method thereof |
| JP5095113B2 (ja) | 2005-03-25 | 2012-12-12 | 富士フイルム株式会社 | 固体撮像装置の製造方法、及び固体撮像装置 |
| JP2006287396A (ja) | 2005-03-31 | 2006-10-19 | Citizen Miyota Co Ltd | 固体撮像装置及びその製造方法 |
| JP2008153313A (ja) | 2006-12-15 | 2008-07-03 | Matsushita Electric Ind Co Ltd | 光学デバイス装置およびその製造方法ならびにカメラモジュール |
| US20090008729A1 (en) | 2007-07-03 | 2009-01-08 | Advanced Chip Engineering Technology Inc. | Image sensor package utilizing a removable protection film and method of making the same |
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| US20190335119A1 (en) | 2019-10-31 |
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