JP7490377B2 - 撮像素子パッケージ - Google Patents
撮像素子パッケージ Download PDFInfo
- Publication number
- JP7490377B2 JP7490377B2 JP2020018130A JP2020018130A JP7490377B2 JP 7490377 B2 JP7490377 B2 JP 7490377B2 JP 2020018130 A JP2020018130 A JP 2020018130A JP 2020018130 A JP2020018130 A JP 2020018130A JP 7490377 B2 JP7490377 B2 JP 7490377B2
- Authority
- JP
- Japan
- Prior art keywords
- conductor layer
- frame
- circuit board
- printed circuit
- resin molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004020 conductor Substances 0.000 claims description 130
- 238000003384 imaging method Methods 0.000 claims description 50
- 239000011347 resin Substances 0.000 claims description 50
- 229920005989 resin Polymers 0.000 claims description 50
- 229910000679 solder Inorganic materials 0.000 claims description 23
- 239000010410 layer Substances 0.000 description 156
- 238000010586 diagram Methods 0.000 description 24
- 238000000034 method Methods 0.000 description 18
- 230000000052 comparative effect Effects 0.000 description 14
- 230000007547 defect Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000007788 liquid Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 239000012792 core layer Substances 0.000 description 4
- 238000001459 lithography Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10204—Dummy component, dummy PCB or template, e.g. for monitoring, controlling of processes, comparing, scanning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Solid State Image Pick-Up Elements (AREA)
Description
まず、図1(a)、(b)を参照して、本発明の第1実施形態における撮像素子パッケージについて説明する。図1(a)、(b)は、撮像素子パッケージのプリント回路基板の構成図(断面図)であり、撮像素子パッケージの製造工程を順に示している。
次に、図7(a)~(e)を参照して、本発明の第2実施形態における撮像素子パッケージについて説明する。図7(a)~(e)は、本実施形態における撮像素子パッケージの説明図である。図7(a)~(e)は、第1実施形態にて説明した図5(a)~(e)にそれぞれ相当し、本実施形態の撮像素子パッケージ(撮像素子が実装されていない状態)の完成図である。なお、本実施形態における撮像素子パッケージの製造方法は第1実施形態と同一であるため、その説明を省略する。
次に、図8(a)~(e)を参照して、本発明の第3実施形態における撮像素子パッケージについて説明する。図8(a)~(e)は、本実施形態における撮像素子パッケージの説明図である。図8(a)~(e)は、第1実施形態にて説明した図5(a)~(e)にそれぞれ相当し、本実施形態の撮像素子パッケージ(撮像素子が実装されていない状態)の完成図である。なお、本実施形態における撮像素子パッケージの製造方法は第1実施形態と同一であるため、その説明を省略する。
次に、図9(a)~(c)を参照して、第1比較例について説明する。図9(a)~(c)は、本比較例における撮像素子パッケージの構成図である。図9(a)は、工程aにおけるA2部断面拡大図およびプリント回路基板_Z方向平面視図を示す。図9(b)は、A2部断面拡大図およびプリント回路基板_Z方向平面視図を示す。図9(c)は、A2部断面拡大図を示す。
次に、図10(a)~(e)、図11(a)~(f)、図12(a)~(c)を参照して、第2比較例について説明する。図10(a)~(e)は、本比較例における金型3にプリント回路基板1をインサートした状態の説明図である。図11(a)~(f)および図12(a)~(c)は、本比較例における撮像素子パッケージの構成図である。
4 樹脂モールド部
14 導体層
100 撮像素子パッケージ
141 導体層(第1導体層)
1412 枠下導体層(ダミーパターン)
Claims (7)
- 複数の導体層を有するプリント回路基板と、
前記プリント回路基板の外周を取り囲むように設けられた樹脂モールド部と、を有し、
前記複数の導体層のうち、前記樹脂モールド部に最も近い第1導体層は、前記樹脂モールド部の内側の周囲に沿って形成されたダミーパターンを有し、
前記第1導体層は、前記ダミーパターンの一部と他のパターンの一部とを電気的に接続する接続部を有することを特徴とする撮像素子パッケージ。 - 前記ダミーパターンは、前記第1導体層の他のパターンと電気的に接続されていないことを特徴とする請求項1に記載の撮像素子パッケージ。
- 前記接続部は、前記ダミーパターンと、前記他のパターンのうち前記ダミーパターンよりも内側のパターンとを電気的に接続していることを特徴とする請求項1または2に記載の撮像素子パッケージ。
- 前記接続部は、前記ダミーパターンと、前記他のパターンのうち前記ダミーパターンよりも外側のパターンとを電気的に接続していることを特徴とする請求項1または2に記載の撮像素子パッケージ。
- 前記ダミーパターンは、前記樹脂モールド部の内側の全周囲に形成されていることを特徴とする請求項1乃至4のいずれか一項に記載の撮像素子パッケージ。
- 複数の導体層を有するプリント回路基板と、
前記プリント回路基板の外周を取り囲むように設けられた樹脂モールド部と、を有し、
前記複数の導体層のうち、前記樹脂モールド部に最も近い第1導体層は、前記樹脂モールド部の内側の周囲に沿って形成されたダミーパターンを有し、
前記ダミーパターンは、前記樹脂モールド部の内側の周囲の一部に形成されていることを特徴とする撮像素子パッケージ。 - 前記ダミーパターンの少なくとも一部を覆うソルダーレジスト層を更に有することを特徴とする請求項1乃至6のいずれか一項に記載の撮像素子パッケージ。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020018130A JP7490377B2 (ja) | 2020-02-05 | 2020-02-05 | 撮像素子パッケージ |
US17/165,654 US20210242269A1 (en) | 2020-02-05 | 2021-02-02 | Image sensor package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020018130A JP7490377B2 (ja) | 2020-02-05 | 2020-02-05 | 撮像素子パッケージ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021125564A JP2021125564A (ja) | 2021-08-30 |
JP7490377B2 true JP7490377B2 (ja) | 2024-05-27 |
Family
ID=77061922
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020018130A Active JP7490377B2 (ja) | 2020-02-05 | 2020-02-05 | 撮像素子パッケージ |
Country Status (2)
Country | Link |
---|---|
US (1) | US20210242269A1 (ja) |
JP (1) | JP7490377B2 (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016076669A (ja) | 2014-10-09 | 2016-05-12 | クラスターテクノロジー株式会社 | 半導体素子実装パッケージおよびその製造方法、ならびに当該パッケージ製造のための基板プレート |
JP2016171203A (ja) | 2015-03-12 | 2016-09-23 | 株式会社デンソー | 電子装置及びその製造方法 |
JP2019192855A (ja) | 2018-04-27 | 2019-10-31 | キヤノン株式会社 | 撮像素子モジュール、撮像システム、撮像素子パッケージ及び製造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040061213A1 (en) * | 2002-09-17 | 2004-04-01 | Chippac, Inc. | Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages |
US8350367B2 (en) * | 2008-02-05 | 2013-01-08 | Advanced Semiconductor Engineering, Inc. | Semiconductor device packages with electromagnetic interference shielding |
JP5395446B2 (ja) * | 2009-01-22 | 2014-01-22 | ルネサスエレクトロニクス株式会社 | 半導体装置および半導体装置の製造方法 |
JP5051189B2 (ja) * | 2009-07-10 | 2012-10-17 | アイシン・エィ・ダブリュ株式会社 | 電子回路装置 |
KR101688084B1 (ko) * | 2010-06-30 | 2016-12-20 | 삼성전자주식회사 | 이미지 센서 및 이를 포함하는 패키지 |
US9673131B2 (en) * | 2013-04-09 | 2017-06-06 | Intel Corporation | Integrated circuit package assemblies including a glass solder mask layer |
WO2017127023A1 (en) * | 2016-01-20 | 2017-07-27 | Heptagon Micro Optics Pte. Ltd. | Optoelectronic modules having fluid permeable channels and methods for manufacturing the same |
JP6597502B2 (ja) * | 2016-07-06 | 2019-10-30 | 株式会社デンソー | 電子装置 |
US10707257B2 (en) * | 2018-08-14 | 2020-07-07 | Semiconductor Components Industries, Llc | Multi-chip packaging structure for an image sensor |
-
2020
- 2020-02-05 JP JP2020018130A patent/JP7490377B2/ja active Active
-
2021
- 2021-02-02 US US17/165,654 patent/US20210242269A1/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016076669A (ja) | 2014-10-09 | 2016-05-12 | クラスターテクノロジー株式会社 | 半導体素子実装パッケージおよびその製造方法、ならびに当該パッケージ製造のための基板プレート |
JP2016171203A (ja) | 2015-03-12 | 2016-09-23 | 株式会社デンソー | 電子装置及びその製造方法 |
JP2019192855A (ja) | 2018-04-27 | 2019-10-31 | キヤノン株式会社 | 撮像素子モジュール、撮像システム、撮像素子パッケージ及び製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20210242269A1 (en) | 2021-08-05 |
JP2021125564A (ja) | 2021-08-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7506437B2 (en) | Printed circuit board having chip package mounted thereon and method of fabricating same | |
KR100619347B1 (ko) | 리지드-플렉서블 기판의 제조 방법 | |
JP4505623B2 (ja) | 印刷回路基板のホール充填装置及びその方法並びに印刷回路基板の製造方法 | |
US6239488B1 (en) | Method for mounting a semiconductor chip on a substrate, and semiconductor device adapted for mounting on a substrate | |
US7696623B2 (en) | Electronic carrier board and package structure thereof | |
KR20030039553A (ko) | 반도체 패키지용 인쇄회로기판의 와이어 본딩패드 형성방법 | |
US20210037651A1 (en) | Electric circuit device and method for producing circuit board | |
TWI453870B (zh) | 配線電路基板及其製造方法 | |
JP7490377B2 (ja) | 撮像素子パッケージ | |
JP2001251042A (ja) | プリント基板のランド形成方法 | |
JP2715934B2 (ja) | 多層印刷配線基板装置及びその製造方法 | |
JP4413932B2 (ja) | カメラの埋込みレンズモジュールの製造方法 | |
KR20100117975A (ko) | 임베디드 회로 기판 및 그 제조 방법 | |
WO2019142724A1 (ja) | 電子部品搭載用基板、回路基板および電子部品搭載用基板の製造方法 | |
US20010012644A1 (en) | Method for mounting a semiconductor chip on a substrate, and semiconductor device adapted for mounting on a substrate | |
KR100835720B1 (ko) | 이미지센서 모듈 및 이를 이용한 카메라 모듈 | |
KR101022869B1 (ko) | 이미지센서 모듈용 인쇄회로기판의 제조방법 | |
JP3846209B2 (ja) | 多層印刷配線基板の製造方法及び多層印刷配線基板 | |
KR101130608B1 (ko) | 반도체 패키지 및 그 제조방법 | |
KR20120004088A (ko) | 인쇄회로기판 제조 방법 | |
KR19990003309A (ko) | 공기 방출구를 갖는 볼 그리드 어레이 패키지용 인쇄 회로기판 | |
KR102109046B1 (ko) | 인쇄회로 기판 및 그 제조 방법 | |
US20180160533A1 (en) | Multilayer printed circuit board | |
CN118315362A (zh) | 具有镶埋芯片的线路板和发光装置及其制造方法 | |
JP2022094390A (ja) | 電子回路モジュール及びその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230124 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20231023 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20231128 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240115 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20240416 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20240515 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7490377 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |