JP7292776B2 - リードフレーム - Google Patents

リードフレーム Download PDF

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Publication number
JP7292776B2
JP7292776B2 JP2020014014A JP2020014014A JP7292776B2 JP 7292776 B2 JP7292776 B2 JP 7292776B2 JP 2020014014 A JP2020014014 A JP 2020014014A JP 2020014014 A JP2020014014 A JP 2020014014A JP 7292776 B2 JP7292776 B2 JP 7292776B2
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JP
Japan
Prior art keywords
plating layer
metal plate
external connection
lead frame
thickness
Prior art date
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JP2020014014A
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English (en)
Japanese (ja)
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JP2021120992A (ja
Inventor
覚史 久保田
直樹 渡邊
Original Assignee
大口マテリアル株式会社
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Publication date
Application filed by 大口マテリアル株式会社 filed Critical 大口マテリアル株式会社
Priority to JP2020014014A priority Critical patent/JP7292776B2/ja
Priority to TW110102564A priority patent/TWI784400B/zh
Priority to CN202110118330.0A priority patent/CN113270386A/zh
Publication of JP2021120992A publication Critical patent/JP2021120992A/ja
Application granted granted Critical
Publication of JP7292776B2 publication Critical patent/JP7292776B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2020014014A 2020-01-30 2020-01-30 リードフレーム Active JP7292776B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2020014014A JP7292776B2 (ja) 2020-01-30 2020-01-30 リードフレーム
TW110102564A TWI784400B (zh) 2020-01-30 2021-01-22 引線框架
CN202110118330.0A CN113270386A (zh) 2020-01-30 2021-01-28 引线框架

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020014014A JP7292776B2 (ja) 2020-01-30 2020-01-30 リードフレーム

Publications (2)

Publication Number Publication Date
JP2021120992A JP2021120992A (ja) 2021-08-19
JP7292776B2 true JP7292776B2 (ja) 2023-06-19

Family

ID=77228027

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020014014A Active JP7292776B2 (ja) 2020-01-30 2020-01-30 リードフレーム

Country Status (3)

Country Link
JP (1) JP7292776B2 (zh)
CN (1) CN113270386A (zh)
TW (1) TWI784400B (zh)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000294715A (ja) 1999-04-09 2000-10-20 Hitachi Ltd 半導体装置及び半導体装置の製造方法
JP2006332472A (ja) 2005-05-30 2006-12-07 Mitsui Chemicals Inc 半導体素子搭載中空パッケージ
JP2018200994A (ja) 2017-05-29 2018-12-20 大口マテリアル株式会社 リードフレーム及びその製造方法
US20190206768A1 (en) 2017-12-29 2019-07-04 Texas Instruments Incorporated Integrated circuit packages with wettable flanks and methods of manufacturing the same

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100740358B1 (ko) * 2005-02-25 2007-07-16 야마하 가부시키가이샤 센서 및 센서 형성 방법
TWI397964B (zh) * 2011-01-19 2013-06-01 Unisem Mauritius Holdings Ltd 部分圖案化之引線框架及其在半導體封裝中製作與使用的方法
US20140165389A1 (en) * 2012-12-14 2014-06-19 Byung Tai Do Integrated circuit packaging system with routable grid array lead frame
US9847235B2 (en) * 2014-02-26 2017-12-19 Infineon Technologies Ag Semiconductor device with plated lead frame, and method for manufacturing thereof
JP6525835B2 (ja) * 2015-09-24 2019-06-05 Ｔｏｗａ株式会社 電子部品の製造方法
JP6789965B2 (ja) * 2015-11-05 2020-11-25 古河電気工業株式会社 リードフレーム材およびその製造方法
DE102016105581A1 (de) * 2016-03-24 2017-09-28 Infineon Technologies Ag Umleiten von Lotmaterial zu einer visuell prüfbaren Packungsoberfläche
JP6757274B2 (ja) * 2017-02-17 2020-09-16 新光電気工業株式会社 リードフレーム及びその製造方法
JP6772087B2 (ja) * 2017-02-17 2020-10-21 新光電気工業株式会社 リードフレーム及びその製造方法
US10483445B2 (en) * 2017-08-31 2019-11-19 Nichia Corporation Lead frame, package for light emitting device, light emitting device, and method for manufacturing light emitting device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000294715A (ja) 1999-04-09 2000-10-20 Hitachi Ltd 半導体装置及び半導体装置の製造方法
JP2006332472A (ja) 2005-05-30 2006-12-07 Mitsui Chemicals Inc 半導体素子搭載中空パッケージ
JP2018200994A (ja) 2017-05-29 2018-12-20 大口マテリアル株式会社 リードフレーム及びその製造方法
US20190206768A1 (en) 2017-12-29 2019-07-04 Texas Instruments Incorporated Integrated circuit packages with wettable flanks and methods of manufacturing the same

Also Published As

Publication number Publication date
JP2021120992A (ja) 2021-08-19
TW202145458A (zh) 2021-12-01
TWI784400B (zh) 2022-11-21
CN113270386A (zh) 2021-08-17

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