JP7290205B2 - エポキシ樹脂、硬化性組成物、硬化物、半導体封止材料、半導体装置、プリプレグ、回路基板、及び、ビルドアップフィルム - Google Patents

エポキシ樹脂、硬化性組成物、硬化物、半導体封止材料、半導体装置、プリプレグ、回路基板、及び、ビルドアップフィルム Download PDF

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JP7290205B2
JP7290205B2 JP2022566870A JP2022566870A JP7290205B2 JP 7290205 B2 JP7290205 B2 JP 7290205B2 JP 2022566870 A JP2022566870 A JP 2022566870A JP 2022566870 A JP2022566870 A JP 2022566870A JP 7290205 B2 JP7290205 B2 JP 7290205B2
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group
epoxy resin
mass
hydroxyl group
compound
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Japanese (ja)
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JPWO2022118723A5 (https=
JPWO2022118723A1 (https=
Inventor
和賢 青山
和久 矢本
源祐 秋元
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DIC Corp
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DIC Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Compounds (AREA)
JP2022566870A 2020-12-03 2021-11-25 エポキシ樹脂、硬化性組成物、硬化物、半導体封止材料、半導体装置、プリプレグ、回路基板、及び、ビルドアップフィルム Active JP7290205B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020200933 2020-12-03
JP2020200933 2020-12-03
PCT/JP2021/043092 WO2022118723A1 (ja) 2020-12-03 2021-11-25 エポキシ樹脂、硬化性組成物、硬化物、半導体封止材料、半導体装置、プリプレグ、回路基板、及び、ビルドアップフィルム

Publications (3)

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JPWO2022118723A1 JPWO2022118723A1 (https=) 2022-06-09
JPWO2022118723A5 JPWO2022118723A5 (https=) 2023-04-20
JP7290205B2 true JP7290205B2 (ja) 2023-06-13

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JP2022566870A Active JP7290205B2 (ja) 2020-12-03 2021-11-25 エポキシ樹脂、硬化性組成物、硬化物、半導体封止材料、半導体装置、プリプレグ、回路基板、及び、ビルドアップフィルム

Country Status (5)

Country Link
JP (1) JP7290205B2 (https=)
KR (1) KR102871799B1 (https=)
CN (1) CN116583943A (https=)
TW (1) TWI899388B (https=)
WO (1) WO2022118723A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000044775A (ja) 1998-07-28 2000-02-15 Yuka Shell Epoxy Kk 半導体封止用エポキシ樹脂組成物
JP2007039551A (ja) 2005-08-03 2007-02-15 Dainippon Ink & Chem Inc エポキシ樹脂，エポキシ樹脂組成物，硬化物，半導体装置，エポキシ樹脂の製造法
JP2011026385A (ja) 2009-07-22 2011-02-10 Dic Corp エポキシ樹脂組成物、その硬化物、半導体封止材料、半導体装置、及びエポキシ樹脂
JP2014037487A (ja) 2012-08-16 2014-02-27 Dic Corp 硬化性樹脂組成物、硬化物、及びプリント配線基板
WO2015037584A1 (ja) 2013-09-10 2015-03-19 日本化薬株式会社 エポキシ樹脂混合物、エポキシ樹脂組成物、硬化物および半導体装置
JP2018138681A (ja) 2016-04-04 2018-09-06 Dic株式会社 エポキシ樹脂組成物の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5839677A (ja) * 1981-09-02 1983-03-08 Mitsubishi Petrochem Co Ltd 新規ポリエポキシ化合物
JPH1160681A (ja) * 1997-08-14 1999-03-02 Jsr Corp ビフェノール型エポキシ樹脂およびその組成物
CN101495533B (zh) * 2005-03-18 2012-02-29 大日本油墨化学工业株式会社 环氧树脂组合物、其固化物、新型环氧树脂、其制造方法和新型酚树脂
JP5245199B2 (ja) * 2005-03-18 2013-07-24 Ｄｉｃ株式会社 エポキシ樹脂組成物、その硬化物、新規エポキシ樹脂、その製造方法、及び新規フェノール樹脂
JP5463859B2 (ja) * 2009-11-06 2014-04-09 Ｄｉｃ株式会社 エポキシ樹脂組成物、その硬化物、新規エポキシ樹脂、新規フェノール樹脂、プリプレグ、及び回路基板
JP5648832B2 (ja) * 2010-07-02 2015-01-07 Dic株式会社 熱硬化性樹脂組成物、その硬化物、活性エステル樹脂、半導体封止材料、プリプレグ、回路基板、及びビルドアップフィルム

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000044775A (ja) 1998-07-28 2000-02-15 Yuka Shell Epoxy Kk 半導体封止用エポキシ樹脂組成物
JP2007039551A (ja) 2005-08-03 2007-02-15 Dainippon Ink & Chem Inc エポキシ樹脂，エポキシ樹脂組成物，硬化物，半導体装置，エポキシ樹脂の製造法
JP2011026385A (ja) 2009-07-22 2011-02-10 Dic Corp エポキシ樹脂組成物、その硬化物、半導体封止材料、半導体装置、及びエポキシ樹脂
JP2014037487A (ja) 2012-08-16 2014-02-27 Dic Corp 硬化性樹脂組成物、硬化物、及びプリント配線基板
WO2015037584A1 (ja) 2013-09-10 2015-03-19 日本化薬株式会社 エポキシ樹脂混合物、エポキシ樹脂組成物、硬化物および半導体装置
JP2018138681A (ja) 2016-04-04 2018-09-06 Dic株式会社 エポキシ樹脂組成物の製造方法

Also Published As

Publication number Publication date
KR102871799B1 (ko) 2025-10-16
TW202231701A (zh) 2022-08-16
WO2022118723A1 (ja) 2022-06-09
KR20230059829A (ko) 2023-05-03
TWI899388B (zh) 2025-10-01
JPWO2022118723A1 (https=) 2022-06-09
CN116583943A (zh) 2023-08-11

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