TWI899388B - 環氧樹脂、硬化性組成物、硬化物、半導體封裝材料、半導體裝置、預浸漬物、電路基板、及增層薄膜 - Google Patents

環氧樹脂、硬化性組成物、硬化物、半導體封裝材料、半導體裝置、預浸漬物、電路基板、及增層薄膜

Info

Publication number
TWI899388B
TWI899388B TW110143922A TW110143922A TWI899388B TW I899388 B TWI899388 B TW I899388B TW 110143922 A TW110143922 A TW 110143922A TW 110143922 A TW110143922 A TW 110143922A TW I899388 B TWI899388 B TW I899388B
Authority
TW
Taiwan
Prior art keywords
group
epoxy resin
mass
compound
aforementioned
Prior art date
Application number
TW110143922A
Other languages
English (en)
Chinese (zh)
Other versions
TW202231701A (zh
Inventor
青山和賢
矢本和久
秋元源祐
Original Assignee
日商Ｄｉｃ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Ｄｉｃ股份有限公司 filed Critical 日商Ｄｉｃ股份有限公司
Publication of TW202231701A publication Critical patent/TW202231701A/zh
Application granted granted Critical
Publication of TWI899388B publication Critical patent/TWI899388B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Compounds (AREA)
TW110143922A 2020-12-03 2021-11-25 環氧樹脂、硬化性組成物、硬化物、半導體封裝材料、半導體裝置、預浸漬物、電路基板、及增層薄膜 TWI899388B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-200933 2020-12-03
JP2020200933 2020-12-03

Publications (2)

Publication Number Publication Date
TW202231701A TW202231701A (zh) 2022-08-16
TWI899388B true TWI899388B (zh) 2025-10-01

Family

ID=81855009

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110143922A TWI899388B (zh) 2020-12-03 2021-11-25 環氧樹脂、硬化性組成物、硬化物、半導體封裝材料、半導體裝置、預浸漬物、電路基板、及增層薄膜

Country Status (5)

Country Link
JP (1) JP7290205B2 (https=)
KR (1) KR102871799B1 (https=)
CN (1) CN116583943A (https=)
TW (1) TWI899388B (https=)
WO (1) WO2022118723A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1160681A (ja) * 1997-08-14 1999-03-02 Jsr Corp ビフェノール型エポキシ樹脂およびその組成物
JP2011026385A (ja) * 2009-07-22 2011-02-10 Dic Corp エポキシ樹脂組成物、その硬化物、半導体封止材料、半導体装置、及びエポキシ樹脂
JP2014037487A (ja) * 2012-08-16 2014-02-27 Dic Corp 硬化性樹脂組成物、硬化物、及びプリント配線基板

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5839677A (ja) * 1981-09-02 1983-03-08 Mitsubishi Petrochem Co Ltd 新規ポリエポキシ化合物
JP3973773B2 (ja) * 1998-07-28 2007-09-12 ジャパンエポキシレジン株式会社 半導体封止用エポキシ樹脂組成物
CN101495533B (zh) * 2005-03-18 2012-02-29 大日本油墨化学工业株式会社 环氧树脂组合物、其固化物、新型环氧树脂、其制造方法和新型酚树脂
JP5245199B2 (ja) * 2005-03-18 2013-07-24 Ｄｉｃ株式会社 エポキシ樹脂組成物、その硬化物、新規エポキシ樹脂、その製造方法、及び新規フェノール樹脂
JP5257725B2 (ja) * 2005-08-03 2013-08-07 Ｄｉｃ株式会社 エポキシ樹脂，エポキシ樹脂組成物，硬化物，半導体装置，エポキシ樹脂の製造法
JP5463859B2 (ja) * 2009-11-06 2014-04-09 Ｄｉｃ株式会社 エポキシ樹脂組成物、その硬化物、新規エポキシ樹脂、新規フェノール樹脂、プリプレグ、及び回路基板
JP5648832B2 (ja) * 2010-07-02 2015-01-07 Dic株式会社 熱硬化性樹脂組成物、その硬化物、活性エステル樹脂、半導体封止材料、プリプレグ、回路基板、及びビルドアップフィルム
JP6366590B2 (ja) * 2013-09-10 2018-08-01 日本化薬株式会社 エポキシ樹脂混合物、エポキシ樹脂組成物、硬化物および半導体装置
TWI733770B (zh) * 2016-04-04 2021-07-21 日商迪愛生股份有限公司 環氧樹脂組成物、硬化性組成物及半導體密封材料

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1160681A (ja) * 1997-08-14 1999-03-02 Jsr Corp ビフェノール型エポキシ樹脂およびその組成物
JP2011026385A (ja) * 2009-07-22 2011-02-10 Dic Corp エポキシ樹脂組成物、その硬化物、半導体封止材料、半導体装置、及びエポキシ樹脂
JP2014037487A (ja) * 2012-08-16 2014-02-27 Dic Corp 硬化性樹脂組成物、硬化物、及びプリント配線基板

Also Published As

Publication number Publication date
KR102871799B1 (ko) 2025-10-16
TW202231701A (zh) 2022-08-16
WO2022118723A1 (ja) 2022-06-09
KR20230059829A (ko) 2023-05-03
JP7290205B2 (ja) 2023-06-13
JPWO2022118723A1 (https=) 2022-06-09
CN116583943A (zh) 2023-08-11

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